The nature of the copper sulfide film grown on copper in aqueous sulfide and chloride solutions

2020 ◽  
Vol 72 (1-2) ◽  
pp. 300-307 ◽  
Author(s):  
Mengnan Guo ◽  
Jian Chen ◽  
Taylor Martino ◽  
Christina Lilja ◽  
Johannes A. Johansson ◽  
...  
Keyword(s):  
Copper Sulfide ◽  
Chloride Solutions ◽  
Sulfide Film

Study of Rubber-Brass Adhesion Mechanism by Secondary Ion Mass Spectrometry

2002 ◽  
Vol 75 (2) ◽  
pp. 199-214 ◽  
Author(s):  
Jong Myoung Kim ◽  
Wim J. van Ooij
Keyword(s):  
Mass Spectrometry ◽  
Copper Sulfide ◽  
Secondary Ion Mass Spectrometry ◽  
Cluster Formation ◽  
Copper Sulfides ◽  
Sulfide Layer ◽  
Tof Sims ◽  
Sulfide Film ◽  
Ion Mass Spectrometry ◽  
Secondary Ion

Abstract The sulfidization reaction of brass was studied in a squalene model system by Time-of-Flight Secondary Ion Mass Spectrometry, TOF-SIMS. Fragments of the accelerator were observed on the surface of the brass and their concentration changed with reaction time. Copper sulfide formation in the brass panels was confirmed from the TOF-SIMS spectra. The composition of the brass panels could be studied by varying the analysis depth. TOF-SIMS spectra of copper sulfide layer showed a pattern of cluster formation. Cobalt was observed to exist in the sulfide film partly in combination with carbon. Evidence was found of covalent bonding between copper sulfides and squalene.

Copper-sulfide Passivation Capping for Cu Interconnects

2010 ◽  
Vol 1249 ◽  
Author(s):  
Uri Cohen
Keyword(s):  
Copper Sulfide ◽  
Dry Process ◽  
Cu Interconnects ◽  
Sulfide Film ◽  
Strong Adhesion ◽  
Excellent Adhesion ◽  
Rc Delay

AbstractCopper-sulfide is proposed as a selective self-aligned passivation capping film on Cu lines, to improve the lines immunity against electromigration. Copper-sulfide is tenacious, having excellent adhesion (chemically bonded) to the underlying copper lines and strong adhesion to the overlying dielectric capping barrier. Contrary to other passivation schemes, Cu sulfidation is 100% selective. The sulfidation can be done by a wet or a dry process. A very thin copper-sulfide film (of about 25-100Å) will be required, and no significant increase of RC delay is expected.

scholarly journals The effects of varying humidity on copper sulfide film formation.

2004 ◽  
Author(s):  
Thomas Michael Mayer ◽  
Nancy A. Missert ◽  
John Charles Barbour ◽  
John Patrick Sullivan ◽  
Robert Guild Copeland ◽  
...  
Keyword(s):  
Copper Sulfide ◽  
Film Formation ◽  
Sulfide Film

scholarly journals Microstructural Studies of the Initial Stages of Copper Sulfide Film Growth: Influence of Humidity

2003 ◽  
Vol 9 (S02) ◽  
pp. 380-381
Author(s):  
M. J. Campin ◽  
J. C. Barbour ◽  
J. W. Braithwaite ◽  
P. P. Provencio ◽  
J. G. Zhu
Keyword(s):  
Copper Sulfide ◽  
Film Growth ◽  
Sulfide Film ◽  
Microstructural Studies

scholarly journals Microstructural Studies of Copper Sulfide Film Growth: Influence of Humidity

2002 ◽  
Vol 8 (S02) ◽  
pp. 1156-1157
Author(s):  
M. J. Campin ◽  
J. C. Barbour ◽  
J. W. Braithwaite ◽  
J. G. Zhu
Keyword(s):  
Copper Sulfide ◽  
Film Growth ◽  
Sulfide Film ◽  
Microstructural Studies

Fabrication of superhydrophobic copper sulfide film for corrosion protection of copper

2015 ◽  
Vol 272 ◽  
pp. 221-228 ◽  
Author(s):  
Lijun Liu ◽  
Ruifen Chen ◽  
Weikai Liu ◽  
Yangbo Zhang ◽  
Xinben Shi ◽  
...  
Keyword(s):  
Corrosion Protection ◽  
Copper Sulfide ◽  
Sulfide Film

Mechanism and Theories of Rubber Adhesion to Steel Tire Cords—An Overview

1984 ◽  
Vol 57 (3) ◽  
pp. 421-456 ◽  
Author(s):  
W. J. van Ooij
Keyword(s):  
Bond Strength ◽  
Copper Sulfide ◽  
Film Growth ◽  
High Concentration ◽  
Sulfide Film ◽  
Steel Cords ◽  
Good Adhesive ◽  
High Bond ◽  
High Bond Strength ◽  
Corrosive Environments

Abstract An overview is given of the mechanism and theories of adhesion of brass-plated steel cords to rubber. The literature on this topic in the period 1979–1983 is reviewed. Although the actual type of bond between the interfacially formed copper sulfide film and the cured network still has not been identified conclusively, this aspect of rubber-brass adhesion is becoming rather irrelevant since the literature is unanimous that bond failure seldom occurs adhesively, i.e., between CuxS and rubber, but usually cohesively within the sulfide film or adhesively at the interface sulfide-substrate. A model is described in which most of the recent findings are incorporated. In this model, brass develops a high bond strength to NR as a result of the in situ growth of a thin (≤50 nm) copper sulfide film onto the brass during the early stages of the cure before crosslinking sets in. This sulfide film has good adhesive and cohesive properties but is, on the other hand, so porous that rubber molecules become entangled in this film (interlocking model). ZnS or FeS are considered nonbonding because they lack the microporosity required for interlocking. Synchronization of sulfide growth and rubber cure is not required. The major prerequisite is that sulfide film growth has been completed before cross-linking begins. Previous rubber oxidation theories and the effect of CuxS on crosslink density of rubber adjacent to the cord surface are also discarded for lack of experimental evidence. Ultimate bond strength and bond durability are determined by cord and by compound properties. Optimum cord parameters are predicted by the model as a thin brass coating with a high concentration of diffused iron, a low copper content (60–65%) and a thin but very homogeneous ZnO surface layer which is passivating and which contains copper atoms. Copper oxides are undesirable. The homogeneous ZnO film improves the cords' corrosion resistance, the included Cu atoms are required for rapid initial CuxS formation and prevention of non-bonding ZnS formation. The major compound parameter is the sulfur-to-accelerator ratio. There is evidence that brass is sulfidized by intermediates of the type R-S-Sy-NR where R is an accelerator fragment, rather than by free sulfur. The properties of the CuxS film, such as adhesion, cohesion and stability in corrosive environments depend on the type of CuxS formed. High values of y in the intermediate lead to good CuxS films, low values produce poor films, regardless of the quality of the cord.

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