scholarly journals Sandia programs relevant to microelectronics fabrication

1987 ◽  
Author(s):  
S.T. Picraux ◽  
F.L. Vook ◽  
B.L. Gregory
Keyword(s):  
Microelectronics Fabrication

Modified Edge Lift-Off Test: Experimental Modifications for Multifilm Systems

1999 ◽  
Vol 594 ◽  
Author(s):  
J. C. Hay ◽  
E. G. Liniger ◽  
X-H Liu
Keyword(s):  
Energy Release Rate ◽  
Energy Release ◽  
Release Rate ◽  
Strain Energy ◽  
Plate Bending ◽  
Adhesion Test ◽  
Testing Method ◽  
Rate Calculation ◽  
Lift Off ◽  
Microelectronics Fabrication

AbstractIn developing an adhesion test for a microelectronics fabrication facility there are many criteria which must be met. Some of these include (i) sample prep must be simple, (ii) deformations should be elastic so the problem can be easily modeled, (iii) mechanics are ideally analytical, and (iv) the test end-point must be unambiguous and easy to obtain. A testing method in the literature which meets many of these criteria is the modified edge liftoff test (MELT). Delamination is induced through the release of strain energy stored in an elastic superlayer which results from a large mismatch in CTE between the film and substrate. In this work we consider details of the energy release rate calculation, effects of plate bending, and initial flaw size.

Free Abrasive Machining in Slicing Brittle Materials With Wiresaw

2000 ◽  
Vol 123 (3) ◽  
pp. 254-259 ◽  
Author(s):  
Fuqian Yang ◽  
Imin Kao
Keyword(s):  
Process Parameters ◽  
Manufacturing Process ◽  
Brittle Materials ◽  
Stochastic Approach ◽  
Abrasive Machining ◽  
Photovoltaic Applications ◽  
Indentation Crack ◽  
Microelectronics Fabrication ◽  
The Relationship ◽  
Free Abrasive

Wiresaw has emerged as a leading technology in wafer preparation for microelectronics fabrication, especially in slicing large silicon wafers (diameter⩾300 mm) for both microelectronic and photovoltaic applications. Wiresaw has also been employed to slice other brittle materials such as alumina, quartz, glass, and ceramics. The manufacturing process of wiresaw is a free abrasive machining (FAM) process. Specifically, the wiresaw cuts brittle materials through the “rolling-indenting” and “scratch-indenting” processes where the materials removal is resulting from mechanical interactions between the substrate of the workpiece and loss abrasives, which are trapped between workpiece and wire. Built upon results of previous investigation in modeling of wiresaw, a model of wiresaw slicing is developed based on indentation crack as well as the influence of wire carrying the abrasives. This model is used to predict the relationship between the rate of material removal and the mechanical properties of the workpiece together with the process parameters. The rolling, indenting, and scratching modes of materials removal are considered with a simple stochastic approach. The model provides us with the basis for improving the efficiency of the wiresaw manufacturing process based on the process parameters.

Carbon Nanotube-Based Vacuum Microelectronic Gated Cathode

1998 ◽  
Vol 509 ◽  
Author(s):  
Xueping Xu ◽  
George R. Brandes
Keyword(s):  
Carbon Nanotube ◽  
Emission Current Density ◽  
Growth Step ◽  
Vacuum Microelectronics ◽  
Field Emitters ◽  
Vacuum Microelectronic ◽  
Microelectronics Fabrication ◽  
Carbon Nanotube Growth ◽  
Nanotube Growth

AbstractA vacuum microelectronic device containing carbon nanotube electron field-emitters was developed and tested. The gated cathode was fabricated using conventional microelectronics fabrication techniques and a final, self-aligned, in situ carbon nanotube growth step. To our knowledge, this is the first vacuum microelectronics device with carbon nanotube field-emitters grown in situ with a catalytic growth process. The turn-on voltage of the cathode was less than 20 volts and the emission current density at 50 volts was as high as 9 mA-cm−2. The fabrication process, device performance, manufacturing issues and cathode applications will be discussed.

Microstrip patch antenna performance analysis with Defected Ground structures: A review

2020 ◽  
Vol 1 (1) ◽  
pp. 15-21
Author(s):  
Amandeep Kaur ◽  
Amandeep Kaur
Keyword(s):  
Patch Antenna ◽  
Microstrip Patch Antenna ◽  
Extensive Literature ◽  
Operational Parameters ◽  
Microstrip Patch ◽  
Antenna Performance ◽  
Compact Size ◽  
Microelectronics Fabrication ◽  
Defected Ground Structures ◽  
Ground Structures

Over last few decades, wireless communication system has sought more attention and plays predominant role in different areas for human personal and commercial applications. Day by day, with advancements in technology, wireless gadgets got more compact due to microelectronics fabrication and integration techniques. So, such applications put great demand over new design specifications on antenna structures used in transmitter and receiver for radio wave communication. In wireless applications depending upon, frequency bands and bandwidth requirements numerous compact antenna structures are used with improved efficiency. Microstrip patch antennas are highly regarded due to its compact size, easy integration with microwave circuits. In study of patch antenna, Defected Ground structures gain popularity these days due to its various benefits to enhance antenna performance. This research article, provides extensive literature survey over use of Defected Ground Structures (DGS) in microstrip patch antenna with its design consequences. This article also explores the enhancement in antenna parameters with implementation of DGS’s. DGS concept is used in microstrip patch antenna and microwave engineering for performance improvement of these devices. DGS can be merged with other techniques to enhance antenna operational parameters like gain, bandwidth, VSWR and spurious radiations.

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