Free Abrasive Machining in Slicing Brittle Materials With Wiresaw

2000 ◽  
Vol 123 (3) ◽  
pp. 254-259 ◽  
Author(s):  
Fuqian Yang ◽  
Imin Kao
Keyword(s):  
Process Parameters ◽  
Manufacturing Process ◽  
Brittle Materials ◽  
Stochastic Approach ◽  
Abrasive Machining ◽  
Photovoltaic Applications ◽  
Indentation Crack ◽  
Microelectronics Fabrication ◽  
The Relationship ◽  
Free Abrasive

Wiresaw has emerged as a leading technology in wafer preparation for microelectronics fabrication, especially in slicing large silicon wafers (diameter⩾300 mm) for both microelectronic and photovoltaic applications. Wiresaw has also been employed to slice other brittle materials such as alumina, quartz, glass, and ceramics. The manufacturing process of wiresaw is a free abrasive machining (FAM) process. Specifically, the wiresaw cuts brittle materials through the “rolling-indenting” and “scratch-indenting” processes where the materials removal is resulting from mechanical interactions between the substrate of the workpiece and loss abrasives, which are trapped between workpiece and wire. Built upon results of previous investigation in modeling of wiresaw, a model of wiresaw slicing is developed based on indentation crack as well as the influence of wire carrying the abrasives. This model is used to predict the relationship between the rate of material removal and the mechanical properties of the workpiece together with the process parameters. The rolling, indenting, and scratching modes of materials removal are considered with a simple stochastic approach. The model provides us with the basis for improving the efficiency of the wiresaw manufacturing process based on the process parameters.

Role of process parameters during additive manufacturing by direct metal deposition of Inconel 718

2017 ◽  
Vol 23 (5) ◽  
pp. 919-929 ◽  
Author(s):  
Bo Chen ◽  
Jyoti Mazumder
Keyword(s):  
Additive Manufacturing ◽  
Cooling Rate ◽  
Process Parameters ◽  
Manufacturing Process ◽  
Inconel 718 ◽  
Processing Parameters ◽  
Forming Quality ◽  
Content Type ◽  
Forming Characteristics ◽  
The Relationship

Purpose The aim of this research is to study the influence of laser additive manufacturing process parameters on the deposit formation characteristics of Inconel 718 superalloy, the main parameters that influence the forming characteristics, the cooling rate and the microstructure were studied. Design/methodology/approach Orthogonal experiment design method was used to obtain different deposit shape and microstructure using different process parameters by multiple layers deposition. The relationship between the processing parameters and the geometry of the cladding was analyzed, and the dominant parameters that influenced the cladding width and height were identified. The cooling rates of different forming conditions were obtained by the secondary dendrite arm spacing (SDAS). Findings The microstructure showed different characteristics at different parts of the deposit. Cooling rate of different samples were obtained and compared by using the SDAS, and the influence of the process parameters to the cooling rate was analyzed. Finally, micro-hardness tests were done, and the results were found to be in accordance with the micro-structure distribution. Originality/value Relationships between processing parameters and the forming characteristics and the cooling rates were obtained. The results obtained in this paper will help to understand the relationship between the process parameters and the forming quality of the additive manufacturing process, so as to obtain the desired forming quality by appropriate parameters.

Comparison of Free Abrasive Machining Processes in Wafer Manufacturing

2008 ◽  
Author(s):  
Chunhui Chung ◽  
Imin Kao
Keyword(s):  
Semiconductor Industry ◽  
Process Models ◽  
Machining Process ◽  
Abrasive Machining ◽  
Machining Processes ◽  
Wire Saw ◽  
Microelectronics Fabrication ◽  
Wafer Manufacturing ◽  
Free Abrasive

Free abrasive machining (FAM) processes, such as slicing using slurry wiresaws, lapping, and polishing, are very important manufacturing processes in wafer production for microelectronics fabrication. Since the materials in semiconductor industry are usually brittle, such as silicon, gallium arsenide, ... etc., the FAM processed can provide more gentle machining than the bonded abrasive machining process. Various machining theories and models have been developed to understand those processes. In this paper, the free abrasive machining processes in wafer manufacturing will be discussed in conjunction with the brittle material cracking theory. The modern slurry wire-saw slicing process and lapping process in wafer production will be presented with comparison to abrasive grits, manufacturing process models, characterization of manufacturing mechanisms, and properties of processes.

Application Of Cusum Chart In Control Of Paper Quality

GIS Business ◽  
2020 ◽  
Vol 14 (6) ◽  
pp. 1062-1069
Author(s):  
S.Ramesh ◽  
B.A.Vasu
Keyword(s):  
Process Parameters ◽  
Manufacturing Process ◽  
Paper Industry ◽  
Primary Data ◽  
Cusum Chart ◽  
Paper Machine ◽  
Statistical Control ◽  
Operating Characteristics ◽  
Small Shift

This paper is an attempt to assess if the manufacturing process of paper machine is in statistical control thereby improving the quality of paper being produced in a paper industry at the time of process itself. Quality is the foremost criteria for achieving the business target. Therefore, emphasis was made on controlling the quality of paper at the time of manufacturing process itself, rather than checking the finished lots at a later time.  This control on quality will help the industry deduct the small shift in the process parameters and modify the operating characteristics at the time of production itself rather than receiving complaints from customers at a later stage.  This paper describes controlling quality at the time of manufacture itself and helps the industry to concentrate on quality at low cost. The researcher has collected primary data at a leading paper industry during October, 2019.  Though X-bar and Range charges were primarily used, CUSUM charts were used to sense the minor shifts in manufacturing process, to explore the possibility of adjusting process parameters during manufacture of paper.

scholarly journals The impact of molded pulp product process on the mechanical properties of molded Bleached Chemi-Thermo-Mechanical Pulp

2021 ◽  
Vol 2 (1) ◽  
Author(s):  
Claire Dislaire ◽  
Yves Grohens ◽  
Bastien Seantier ◽  
Marion Muzy
Keyword(s):  
Mechanical Properties ◽  
Water Uptake ◽  
Process Parameters ◽  
Manufacturing Process ◽  
Water Immersion ◽  
Young Modulus ◽  
Drying Time ◽  
Mechanical Pulp ◽  
Hygroscopic Properties ◽  
The Impact

AbstractThis study was carried out using bleached softwood Chemi-Thermo-Mechanical Pulp to evaluate the influence of Molded Pulp Products’ manufacturing process parameters on the finished products’ mechanical and hygroscopic properties. A Taguchi table was done to make 8 tests with specific process parameters such as moulds temperature, pulping time, drying time, and pressing time. The results of these tests were used to obtain an optimized manufacturing process with improved mechanical properties and a lower water uptake after sorption analysis and water immersion. The optimized process parameters allowed us to improve the Young’ Modulus after 30h immersion of 58% and a water uptake reduction of 78% with the first 8 tests done.

Optimize Mixing Process Parameters of Synchronous Rotor Mixer Based on Orthogonal Method

2012 ◽  
Vol 501 ◽  
pp. 442-447
Author(s):  
Ping Fu ◽  
Feng Bao Bai ◽  
Chuan Sheng Wang ◽  
Shan Hu Li
Keyword(s):  
Physical Properties ◽  
Process Parameters ◽  
Fill Factor ◽  
Cooling Water ◽  
Mixing Process ◽  
Rotor Speed ◽  
Orthogonal Method ◽  
Cooling Water Temperature ◽  
Vulcanized Rubber ◽  
The Relationship

In this paper adopting the orthogonal method, self-developed compound formulation had tested, and the relationship between the physical properties of vulcanized rubber and rectangular synchronous rotor mixer parameters had researched. The results showed that when the fill factor was 0.6, the rotor speed was 70r/min, cooling water temperature was 45 °C, pressure on the top bolt was 0.8Mpa, the physical properties of the vulcanized rubber was best.

Prediction model for the mechanical properties of compacted poplar powder generated via hot-pressing

BioResources ◽  
2021 ◽  
Vol 16 (3) ◽  
pp. 4947-4962
Author(s):  
Jin Yan ◽  
Jianan Liu ◽  
Liqiang Zhang ◽  
Zhili Tan ◽  
Haoran Zhang ◽  
...  
Keyword(s):  
Neural Network ◽  
Mechanical Properties ◽  
Network Model ◽  
Process Parameters ◽  
Neural Network Model ◽  
Hot Pressing ◽  
Process Conditions ◽  
Wood Powder ◽  
Single Factor ◽  
The Relationship

The influence of the process parameters on the mechanical properties of compact wood powder generated via hot-pressing was analyzed through a single-factor experiment. The mechanical properties exhibited a nonlinear trend relative to the process conditions of hot-pressed compact wood powder. The relationship models between the process parameters and the mechanical properties for the compact wood powder were established by applying a multiple regression analysis and neural network methods combined with data from an orthogonal array design. A comparison between experimental and predicted results was made to investigate the accuracy of the established models by applying several data groups among the single-factor experiments. The results showed that the accuracy of the neural network model in terms of predicting the mechanical properties was greater compared with the multiple regression model. This demonstrates that the established neural network model had a better prediction performance, and it can accurately map the relationship between the process conditions and the mechanical properties of the compact wood powder.

Experimental Investigation on Rotary Punching by the Compression of Polyurethane Pad

2014 ◽  
Vol 941-944 ◽  
pp. 1802-1807 ◽  
Author(s):  
Qian Liu ◽  
Jing Tao Han ◽  
Jing Liu ◽  
Xiao Xiong Wang
Keyword(s):  
Penetration Depth ◽  
Process Parameters ◽  
High Load ◽  
Large Area ◽  
Bear Capacity ◽  
Hole Edge ◽  
Quality Degradation ◽  
Series Of Experiments ◽  
Blanking Process ◽  
The Relationship

Rotary punching is a sheet metal blanking process which utilizes shearing tools fixed to a pair of rollers. The polyurethane pad is adopted as the die instead of rigid mold because it has the advantages of wide hardness range and high load-bear capacity. Due to the application of polyurethane pad, the surrounding region adjacent to the pierced hole will occur to plastically deform and deflect, which greatly differs from that in the conventional blanking. In this paper, the effects of blank material and thickness, polyurethane hardness, punch penetration depth on deformation behavior were mathematically analyzed and modeled, and then a series of experiments through varying process parameters were conducted to validate the relationship between process parameters and product quality. The degree of sample deflection was exactly measured by scanning electron microscope (SEM). The results show that the deformed area varies with different blank elongations and increases with increasing blank thickness for a given material. When polyurethane pad with low hardness level is employed, it results in large area deformation and quality degradation. Moreover, the deflection degree around the hole edge becomes more severe along with punch penetration, but the penetration depth along blank thickness is not in proportion to the amount of punch advancement.

Machined Surface Characteristics and Removal Mechanism of Soft and Brittle Solids

2010 ◽  
Vol 447-448 ◽  
pp. 183-187 ◽  
Author(s):  
Zhen Yu Zhang ◽  
Rudy Irwan ◽  
Han Huang
Keyword(s):  
Surface Characteristics ◽  
Abrasive Machining ◽  
Precision Grinding ◽  
Machined Surface ◽  
Brittle Solids ◽  
The Coefficient Of Friction ◽  
Ultra Precision ◽  
Ductile Removal ◽  
Fracture Features ◽  
Free Abrasive

Surface characteristics of CZT wafers machined using wire sawing, free abrasives lapping and polishing and ultra-precision grinding were investigated. Wire sawing resulted in the removal of material in both ductile and brittle regimes, but both polishing and grinding led to a ductile removal. The grinding produced very smooth surfaces free of embeddings and scratches, which is thus considered to have better machinability than the free abrasive machining. The nanoindentation and nanoscratch on MCT wafers at nanometric scales resulted in considerable plastic deformation, but no fracture features. The hardness of the MCT wafer was 500 to 550 MPa, and the coefficient of friction was particularly high, ranging from 0.45 to 0.55.

scholarly journals Optimisation of manufacturing process parameters using deep neural networks as surrogate models

Procedia CIRP ◽  
2018 ◽  
Vol 72 ◽  
pp. 426-431 ◽  
Author(s):  
Julius Pfrommer ◽  
Clemens Zimmerling ◽  
Jinzhao Liu ◽  
Luise Kärger ◽  
Frank Henning ◽  
...  
Keyword(s):  
Neural Networks ◽  
Process Parameters ◽  
Manufacturing Process ◽  
Deep Neural Networks ◽  
Surrogate Models
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