scholarly journals Technical support for GEIS: radioactive waste isolation in geologic formations. Volume 20. Thermo-mechanical stress analysis and development of thermal loading guidelines

1978 ◽  
Author(s):  
Keyword(s):  
Radioactive Waste ◽  
Stress Analysis ◽  
Mechanical Stress ◽  
Thermal Loading ◽  
Technical Support

Mechanical stress analysis of an LDD MOSFET structure

1996 ◽  
Vol 43 (9) ◽  
pp. 1525-1532 ◽  
Author(s):  
P. Ferreira ◽  
V. Senez ◽  
B. Baccus
Keyword(s):  
Stress Analysis ◽  
Mechanical Stress

Thermo-Mechanical Stress Analysis for an Integrated Passive Resonant Module

2004 ◽  
Vol 40 (1) ◽  
pp. 94-102 ◽  
Author(s):  
S.-Y. Lee ◽  
W.G. Odendaal ◽  
J.D. vanWyk
Keyword(s):  
Stress Analysis ◽  
Mechanical Stress

Mechanical Stress Analysis and Evaluation of Hybrid Land Grid Array Attached Large Form Factor Organic Modules

2012 ◽  
Vol 2012 (1) ◽  
pp. 000818-000824
Author(s):  
John Torok ◽  
Shawn Canfield ◽  
Yuet-Ying Yu ◽  
Jiantao Zheng
Keyword(s):  
Form Factor ◽  
Stress Analysis ◽  
Mechanical Stress ◽  
Printed Circuit Board ◽  
Organic Substrate ◽  
Circuit Board ◽  
Bottom Surface ◽  
Mechanical Shock ◽  
Analysis And Evaluation ◽  
Pcb Assembly

Recent industry trends to continue enabling increased server system performance and packaging density has driven the need to implement larger form factor hybrid land grid array (LGA) attached organic modules. In addition, given the need to package multiple modules on a single printed circuit board (PCB) assembly, PCB cross-sections and their corresponding physical properties (e.g., flatness, etc.) as well as module bottom surface metallurgy (BSM) co-planarity require a more detailed understanding of impacts to the compliant as well as the soldered connector interfaces. Lastly, the migration to lead (Pb)-free solders has further complicated the issue given both the change in material properties as well as processing temperatures. In this paper we will discuss the mechanical stress analysis and evaluation tests assessment of a recently developed 50 mm square organic processor module, hybrid LGA attached to a multiple site PCB. The analysis presented will highlight the methodology to identify both connector soldered stress and predicted contact load variation across the module's mated interface. Key parameters discuss will include the PCB flatness, Organic substrate BSM co-planarity (both predicted and measured) and the Hybrid LGA as-soldered contact co-planarity. Corroborating predicted analytical results, we will discuss various evaluation tests performed to validate the design's integrity. Key tests include, pressure sensitive film (PSF) studies and environment stress exposures, including thermal shock, mechanical shock and vibration and seismic exposure. Post test electrical integrity and test sample construction analysis, including 3D x-ray and mechanical cross-section, will also be described. The analysis process and testing described will provide a method to evaluate more challenging hybrid LGA applications as both module sizes and/or number applied per PCB assembly increase and Pb-free assembly is introduced in future applications.

scholarly journals Assessment of Different Cooling Techniques for Reduced Mechanical Stress in the Windings of Electrical Machines

Energies ◽  
2019 ◽  
Vol 12 (10) ◽  
pp. 1967 ◽  
Author(s):  
Bishal Silwal ◽  
Abdalla Hussein Mohamed ◽  
Jasper Nonneman ◽  
Michel De Paepe ◽  
Peter Sergeant
Keyword(s):  
Mechanical Stress ◽  
Thermal Loading ◽  
Three Dimensional ◽  
Electrical Machines ◽  
Water Jacket ◽  
Traction Motors ◽  
Dimensional Finite Element ◽  
Mechanical Models ◽  
Set Up ◽  
Three Dimensional Finite Element

Thermal loading can induce mechanical stresses in the windings of electrical machines, especially those impregnated with epoxy resins, which is mostly the case in modern traction motors. Although designers look for cooling techniques that give better performance in terms of the power density and efficiency of the machine, several thermal cycles can lead to fatigue and the degradation of the copper insulation, epoxy and consequently the windings. In this paper, the performance of different cooling techniques has been compared based on the temperature distribution and the mechanical stress induced in the windings. Three-dimensional finite element thermo-mechanical models were built to perform the study. Two different variants of water jacket cooling, two configurations of direct coil cooling and two cases of combined water jacket and direct coil cooling methods have been considered in the paper. The results show that the combined water jacket and direct coil cooling perform the best in terms of the temperature and also the mechanical stress induced in the windings. An experimental set-up is built and tested to validate the numerical results.

Stress analysis for a thin film bonded to an orthotropic substrate under thermal loading

2020 ◽  
Vol 109 ◽  
pp. 103594
Author(s):  
Y. Alinia ◽  
S.A. Abbaszadeh-Fathabadi ◽  
M.A. Guler
Keyword(s):  
Thin Film ◽  
Stress Analysis ◽  
Thermal Loading
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