Mechanical stress analysis of an LDD MOSFET structure

1996 ◽  
Vol 43 (9) ◽  
pp. 1525-1532 ◽  
Author(s):  
P. Ferreira ◽  
V. Senez ◽  
B. Baccus
Keyword(s):  
Stress Analysis ◽  
Mechanical Stress

Thermo-Mechanical Stress Analysis for an Integrated Passive Resonant Module

2004 ◽  
Vol 40 (1) ◽  
pp. 94-102 ◽  
Author(s):  
S.-Y. Lee ◽  
W.G. Odendaal ◽  
J.D. vanWyk
Keyword(s):  
Stress Analysis ◽  
Mechanical Stress

Mechanical Stress Analysis and Evaluation of Hybrid Land Grid Array Attached Large Form Factor Organic Modules

2012 ◽  
Vol 2012 (1) ◽  
pp. 000818-000824
Author(s):  
John Torok ◽  
Shawn Canfield ◽  
Yuet-Ying Yu ◽  
Jiantao Zheng
Keyword(s):  
Form Factor ◽  
Stress Analysis ◽  
Mechanical Stress ◽  
Printed Circuit Board ◽  
Organic Substrate ◽  
Circuit Board ◽  
Bottom Surface ◽  
Mechanical Shock ◽  
Analysis And Evaluation ◽  
Pcb Assembly

Recent industry trends to continue enabling increased server system performance and packaging density has driven the need to implement larger form factor hybrid land grid array (LGA) attached organic modules. In addition, given the need to package multiple modules on a single printed circuit board (PCB) assembly, PCB cross-sections and their corresponding physical properties (e.g., flatness, etc.) as well as module bottom surface metallurgy (BSM) co-planarity require a more detailed understanding of impacts to the compliant as well as the soldered connector interfaces. Lastly, the migration to lead (Pb)-free solders has further complicated the issue given both the change in material properties as well as processing temperatures. In this paper we will discuss the mechanical stress analysis and evaluation tests assessment of a recently developed 50 mm square organic processor module, hybrid LGA attached to a multiple site PCB. The analysis presented will highlight the methodology to identify both connector soldered stress and predicted contact load variation across the module's mated interface. Key parameters discuss will include the PCB flatness, Organic substrate BSM co-planarity (both predicted and measured) and the Hybrid LGA as-soldered contact co-planarity. Corroborating predicted analytical results, we will discuss various evaluation tests performed to validate the design's integrity. Key tests include, pressure sensitive film (PSF) studies and environment stress exposures, including thermal shock, mechanical shock and vibration and seismic exposure. Post test electrical integrity and test sample construction analysis, including 3D x-ray and mechanical cross-section, will also be described. The analysis process and testing described will provide a method to evaluate more challenging hybrid LGA applications as both module sizes and/or number applied per PCB assembly increase and Pb-free assembly is introduced in future applications.

Design and Mechanical Stress Analysis of a Toroidal-Type SMES Magnet

2010 ◽  
Vol 20 (3) ◽  
pp. 1900-1903 ◽  
Author(s):  
Kwang-Min Kim ◽  
A-Rong Kim ◽  
Hae-Yong Park ◽  
Jin-Geun Kim ◽  
Minwon Park ◽  
...  
Keyword(s):  
Stress Analysis ◽  
Mechanical Stress

Thermo-mechanical stress analysis of the water cooled DEMO First Wall mock-up components

2018 ◽  
Vol 136 ◽  
pp. 1618-1623 ◽  
Author(s):  
Robin Kamenický ◽  
Phani Kumar Domalapally ◽  
Xavier Arnoult
Keyword(s):  
Stress Analysis ◽  
Mechanical Stress ◽  
First Wall

Construction of collagen gel scaffolds for mechanical stress analysis

2014 ◽  
Vol 78 (3) ◽  
pp. 458-461 ◽  
Author(s):  
Masao Hara ◽  
Masahiro Nakashima ◽  
Takahiro Fujii ◽  
Kazuki Uehara ◽  
Chisako Yokono ◽  
...  
Keyword(s):  
Stress Analysis ◽  
Mechanical Stress ◽  
Collagen Gel
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