scholarly journals Moisture penetration evaluation of polystyrene bead foam as an encapsulant for electronic packages

1980 ◽  
Author(s):  
G.D. Swanson
Keyword(s):  
Polystyrene Bead ◽  
Electronic Packages

Backside Application of Acoustic Micro Imaging (AMI) on Plastic Ball Grid Array (PBGA) and Plastic Quad Flat Pack (PQFP) Packages

2004 ◽  
Author(s):  
Luis A. Curiel ◽  
Andrew J. Komrowski ◽  
Daniel J.D. Sullivan
Keyword(s):  
Ball Grid Array ◽  
Acoustic Microscopy ◽  
Electronic Packages ◽  
Nondestructive Technique ◽  
Molding Compound ◽  
Microscopy Technique ◽  
Plastic Ball ◽  
Die Surface ◽  
Plastic Ball Grid Array ◽  
Bond Pads

Abstract Acoustic Micro Imaging (AMI) is an established nondestructive technique for evaluation of electronic packages. Non-destructive evaluation of electronic packages is often a critical first step in the Failure Analysis (FA) process of semiconductor devices [1]. The molding compound to die surface interface of the Plastic Ball Grid Array (PBGA) and Plastic Quad Flat Pack (PQFP) packages is an important interface to acquire for the FA process. Occasionally, with these packages, the standard acoustic microscopy technique fails to identify defects at the molding compound to die surface interface. The hard to identify defects are found at the edge of the die next to the bond pads or under the bonds wires. This paper will present a technique, Backside Acoustic Micro Imaging (BAMI) analysis, which can better resolve the molding compound to die surface interface at the die edge by sending the acoustic signal through the backside of the PBGA and PQFP packages.

Advanced Acoustic Micro Imaging Applications: Deciphering Multiple Acoustic Echoes and Reflections

2004 ◽  
Author(s):  
Andrew J. Komrowski ◽  
Luis A. Curiel ◽  
Daniel J. D. Sullivan ◽  
Quang Nguyen ◽  
Lisa Logan-Willams
Keyword(s):  
Failure Analysis ◽  
Case Studies ◽  
New Technologies ◽  
Electronic Packages ◽  
Advanced Packaging ◽  
Ic Package ◽  
Non Destructive

Abstract The acquisition of reliable Acoustic Micro Images (AMI) are an essential non-destructive step in the Failure Analysis (FA) of electronic packages. Advanced packaging and new IC materials present challenges to the collection of reliable AMI signals. The AMI is complicated due to new technologies that utilize an increasing number of interfaces in ICs and packages. We present two case studies in which it is necessary to decipher the acoustic echoes from the signals generated by the interface of interest in order to acquire trustworthy information about the IC package.

X-Ray Tomography for Electronic Packages

2000 ◽  
Author(s):  
Deepak Goyal
Keyword(s):  
3D Imaging ◽  
Development Time ◽  
Analytical Techniques ◽  
Electronic Packages ◽  
X Ray ◽  
Imaging Capability ◽  
Imaging Results ◽  
Key Drivers ◽  
Analytical Tools ◽  
Non Destructive

Abstract Next generation assembly/package development challenges are primarily increased interconnect complexity and density with ever shorter development time. The results of this trend present some distinct challenges for the analytical tools/techniques to support this technical roadmap. The key challenge in the analytical tools/techniques is the development of non-destructive imaging for improved time to information. This paper will present the key drivers for the non-destructive imaging, results of literature search and evaluation of key analytical techniques currently available. Based on these studies requirements of a 3D imaging capability will be discussed. Critical breakthroughs required for development of such a capability are also summarized.

Thermomechanical modeling of 3D electronic packages

2008 ◽  
Vol 52 (6) ◽  
pp. 623-634 ◽  
Author(s):  
S. M. Sri-Jayantha ◽  
G. McVicker ◽  
K. Bernstein ◽  
J. U. Knickerbocker
Keyword(s):  
Electronic Packages ◽  
Thermomechanical Modeling

Neural networks for enhanced stress prognostics for encapsulated electronic packages - A comparison

2021 ◽  
Vol 123 ◽  
pp. 114181
Author(s):  
Peter Meszmer ◽  
Mehryar Majd ◽  
Alexandru Prisacaru ◽  
Przemyslaw Jakub Gromala ◽  
Bernhard Wunderle
Keyword(s):  
Neural Networks ◽  
Electronic Packages

Reliability enhancement of electronic packages by design of optimal parameters

2004 ◽  
Vol 44 (7) ◽  
pp. 1157-1163 ◽  
Author(s):  
Ashish Batra ◽  
Pradeep Ramachandran ◽  
Poornima Sathyanarayanan ◽  
Susan Lu ◽  
Hari Srihari
Keyword(s):  
Electronic Packages ◽  
Optimal Parameters ◽  
Reliability Enhancement
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