Reaction of solder with Ni/Au metallization for electronic packages during reflow soldering

2001 ◽  
Vol 24 (2) ◽  
pp. 493-498 ◽  
Author(s):  
C.E. Ho ◽  
S.Y. Tsai ◽  
C.R. Kao
Keyword(s):  
Electronic Packages ◽  
Reflow Soldering

Signature Analysis of Package Delamination Using Scanning Acoustic Microscope

1996 ◽  
Author(s):  
S.X. Li ◽  
K. Lee ◽  
J. Hulog ◽  
R. Gannamani ◽  
S. Yin
Keyword(s):  
Failure Analysis ◽  
Early Stage ◽  
Signature Analysis ◽  
Acoustic Microscope ◽  
Reflow Soldering ◽  
Moisture Expansion ◽  
Scanning Acoustic Microscope ◽  
Package Reliability

Abstract Package delaminations are often associated with electrical and package reliability problems in IC devices. Delaminations caused by electrical-over-stress (EOS) and moisture expansion during reflow soldering have shown different delamination patterns. A Scanning Acoustic Microscope (SAM) can be used to detect package delaminations. Understanding these delamination signatures can help us quickly identify the failure cause at an early stage of the failure analysis.

Backside Application of Acoustic Micro Imaging (AMI) on Plastic Ball Grid Array (PBGA) and Plastic Quad Flat Pack (PQFP) Packages

2004 ◽  
Author(s):  
Luis A. Curiel ◽  
Andrew J. Komrowski ◽  
Daniel J.D. Sullivan
Keyword(s):  
Ball Grid Array ◽  
Acoustic Microscopy ◽  
Electronic Packages ◽  
Nondestructive Technique ◽  
Molding Compound ◽  
Microscopy Technique ◽  
Plastic Ball ◽  
Die Surface ◽  
Plastic Ball Grid Array ◽  
Bond Pads

Abstract Acoustic Micro Imaging (AMI) is an established nondestructive technique for evaluation of electronic packages. Non-destructive evaluation of electronic packages is often a critical first step in the Failure Analysis (FA) process of semiconductor devices [1]. The molding compound to die surface interface of the Plastic Ball Grid Array (PBGA) and Plastic Quad Flat Pack (PQFP) packages is an important interface to acquire for the FA process. Occasionally, with these packages, the standard acoustic microscopy technique fails to identify defects at the molding compound to die surface interface. The hard to identify defects are found at the edge of the die next to the bond pads or under the bonds wires. This paper will present a technique, Backside Acoustic Micro Imaging (BAMI) analysis, which can better resolve the molding compound to die surface interface at the die edge by sending the acoustic signal through the backside of the PBGA and PQFP packages.

Advanced Acoustic Micro Imaging Applications: Deciphering Multiple Acoustic Echoes and Reflections

2004 ◽  
Author(s):  
Andrew J. Komrowski ◽  
Luis A. Curiel ◽  
Daniel J. D. Sullivan ◽  
Quang Nguyen ◽  
Lisa Logan-Willams
Keyword(s):  
Failure Analysis ◽  
Case Studies ◽  
New Technologies ◽  
Electronic Packages ◽  
Advanced Packaging ◽  
Ic Package ◽  
Non Destructive

Abstract The acquisition of reliable Acoustic Micro Images (AMI) are an essential non-destructive step in the Failure Analysis (FA) of electronic packages. Advanced packaging and new IC materials present challenges to the collection of reliable AMI signals. The AMI is complicated due to new technologies that utilize an increasing number of interfaces in ICs and packages. We present two case studies in which it is necessary to decipher the acoustic echoes from the signals generated by the interface of interest in order to acquire trustworthy information about the IC package.

X-Ray Tomography for Electronic Packages

2000 ◽  
Author(s):  
Deepak Goyal
Keyword(s):  
3D Imaging ◽  
Development Time ◽  
Analytical Techniques ◽  
Electronic Packages ◽  
X Ray ◽  
Imaging Capability ◽  
Imaging Results ◽  
Key Drivers ◽  
Analytical Tools ◽  
Non Destructive

Abstract Next generation assembly/package development challenges are primarily increased interconnect complexity and density with ever shorter development time. The results of this trend present some distinct challenges for the analytical tools/techniques to support this technical roadmap. The key challenge in the analytical tools/techniques is the development of non-destructive imaging for improved time to information. This paper will present the key drivers for the non-destructive imaging, results of literature search and evaluation of key analytical techniques currently available. Based on these studies requirements of a 3D imaging capability will be discussed. Critical breakthroughs required for development of such a capability are also summarized.

scholarly journals Joining of Electrodes to Ultra-Thin Metallic Layers on Ceramic Substrates in Cryogenic Sensors

Sensors ◽  
2021 ◽  
Vol 21 (14) ◽  
pp. 4919
Author(s):  
Marcin Lebioda ◽  
Ryszard Pawlak ◽  
Jacek Rymaszewski
Keyword(s):  
Cryogenic Temperatures ◽  
Thermal And Mechanical Properties ◽  
Reflow Soldering ◽  
Ceramic Substrates ◽  
Temperature Range ◽  
Wave Soldering ◽  
Materials Used ◽  
Standard Designs ◽  
Electrical Connections ◽  
Method Show

Microjoining technologies are crucial for producing reliable electrical connections in modern microelectronic and optoelectronic devices, as well as for the assembly of electronic circuits, sensors, and batteries. However, the production of miniature sensors presents particular difficulties, due to their non-standard designs, unique functionality and applications in various environments. One of the main challenges relates to the fact that common methods such as reflow soldering or wave soldering cannot be applied to making joints to the materials used for the sensing layers (oxides, polymers, graphene, metallic layers) or to the thin metallic layers that act as contact pads. This problem applies especially to sensors designed to work at cryogenic temperatures. In this paper, we demonstrate a new method for the dynamic soldering of outer leads in the form of metallic strips made from thin metallic layers on ceramic substrates. These leads can be used as contact pads in sensors working in a wide temperature range. The joints produced using our method show excellent electrical, thermal, and mechanical properties in the temperature range of 15–300 K.

Thermomechanical modeling of 3D electronic packages

2008 ◽  
Vol 52 (6) ◽  
pp. 623-634 ◽  
Author(s):  
S. M. Sri-Jayantha ◽  
G. McVicker ◽  
K. Bernstein ◽  
J. U. Knickerbocker
Keyword(s):  
Electronic Packages ◽  
Thermomechanical Modeling

Neural networks for enhanced stress prognostics for encapsulated electronic packages - A comparison

2021 ◽  
Vol 123 ◽  
pp. 114181
Author(s):  
Peter Meszmer ◽  
Mehryar Majd ◽  
Alexandru Prisacaru ◽  
Przemyslaw Jakub Gromala ◽  
Bernhard Wunderle
Keyword(s):  
Neural Networks ◽  
Electronic Packages

59‐2: Laser Reflow Soldering Technique for Mini/MicroLed Displays

2021 ◽  
Vol 52 (1) ◽  
pp. 830-832
Author(s):  
Lili Wang ◽  
Chuhang Wang ◽  
Chao Liu ◽  
Enkai Dong ◽  
Ming Zhai ◽  
...  
Keyword(s):  
Reflow Soldering

Reliability enhancement of electronic packages by design of optimal parameters

2004 ◽  
Vol 44 (7) ◽  
pp. 1157-1163 ◽  
Author(s):  
Ashish Batra ◽  
Pradeep Ramachandran ◽  
Poornima Sathyanarayanan ◽  
Susan Lu ◽  
Hari Srihari
Keyword(s):  
Electronic Packages ◽  
Optimal Parameters ◽  
Reliability Enhancement
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