Drop Test Results for the Combustion Engineering Model No. ABB-2901 Fuel Pellet Shipping Package

This article contains a study report on the manufacturing of bicycle helmet models that use polymeric foam composite materials strengthened by oil palm empty fruit bunch (OPEFB). The test results of mechanical polymeric foam obtain tensile stress (σt) 1.17 MPa, compressive stress (σc) 0.51 MPa, bending stress (σb) 3.94 MPa, modulus of elasticity (E) 37.97 MPa, density ( ρ) 193 (kg / m3). The testing results of thermal conductivity (k) with ASTM C177-04 standard obtain 0.096 W/mK. Aerodynamic simulation is carried out on 5 bicycle helmet models with different variations of air ventilation formations and obtained the M4A model that best met the ergonomic criteria. The simulation results of the M4A helmet model are max 65.668 Pa of air pressure (Pu), 26,8 0C of inner wall temperature (Ti), 11.0724 m/s of air velocity (vi) and 0.89 of drag coefficient (CD). Bicycle helmet manufacturing is carried out by hand lay up method for shell layer and casting mold for liner by using GFRP polymer composite molds. Both layers are made by sandwich method with the composition of the shell layer is 100 grams resin, 15 grams glass fiber and 5 grams catalyst. The composition of the liner layer is 275 grams (50%) of unsaturated Polyester 157 BQTN-EX resin, 27.5 grams (5%) of OPEFB fiber, 247 grams (45%) of Blowing Agent Polyurethane and 27.5 grams (5%) of Methyl Ketone Perokside catalyst (MEKPO). The toughness of the helmet is tested by using a free fall drop test with the standard of Consumer Product Safety Commission (CPSC) with the height of impact 1.5 meters. The free fall drop test results are max 2.02 MPa of the impact stress of the M4A bicycle helmet model (σi) and max 283.77 joules of energy impact (Ei) which is close to the Consumer Product Safety Commission’s (CPSC) standard value of 110 joules.

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Strain Gage Test Results of Band-Type Locking Rings for a Typical Drum Type Radioactive Material Package

Transportation, Storage, and Disposal of Radioactive Materials ◽

10.1115/pvp2002-1619 ◽

2002 ◽

Author(s):

Charles A. McKeel ◽

Allen C. Smith

Keyword(s):

Uniform Distribution ◽

Strain Gage ◽

Strain Distribution ◽

Drop Test ◽

Uniform Strain ◽

Radioactive Material ◽

Test Results ◽

Lower Weight ◽

Band Type

Band type closure rings are commonly used for securing the drum lid on radioactive material packages of lower weight classifications. Lid installation is achieved by placing the band around the perimeter of the lidded drum and tightening the single bolt in stages until a designated torque value is obtained. The band is subjected to heavy rapping with a soft hammer during installation to equilibrate the band strains around the drum perimeter. The study described here investigated the strain distributions in the band throughout the installation process. The results show that a uniform strain distribution is achieved during installation and that the hammering of the band aids in achieving the uniform distribution. The results of the strain levels after the drop test indicate that the locking rings maintain some pre-tension, even after severe targeted drops that crush a portion of the drum top.

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Wideband Inter-Networking engineering test and Demonstration Satellite Propulsion System and Engineering-Model Test Results

42nd AIAA/ASME/SAE/ASEE Joint Propulsion Conference & Exhibit ◽

10.2514/6.2006-4691 ◽

2006 ◽

Author(s):

Yoshihisa Arikawa ◽

Yasuo Nakamura ◽

Tsunehiko Araki ◽

Eiichi Tomita ◽

Tsuyoshi Maeda ◽

...

Keyword(s):

Model Test ◽

Propulsion System ◽

Test Results ◽

Engineering Model

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Drop Reliability of Corner Bonded CSP in Portable Products

2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2 ◽

10.1115/ipack2003-35318 ◽

2003 ◽

Cited By ~ 6

Author(s):

Guoyun Tian ◽

Yueli Liu ◽

Pradeep Lall ◽

R. Wayne Johnson ◽

Sanan Abderrahman ◽

...

Keyword(s):

Capillary Flow ◽

Drop Test ◽

Mechanical Shock ◽

Solder Paste ◽

Test Results ◽

Mechanical Coupling ◽

Small Areas ◽

Common Solution ◽

Four Corners ◽

Capillary Underfill

The use of CSPs has expanded rapidly, particularly in portable electronic products. Many CSP designs will meet the thermal cycle or thermal shock requirements for these applications. However, mechanical shock (drop) and bending requirements often necessitate the use of underfills to increase the mechanical strength of the CSP-to-board connection. Capillary flow underfills processed after reflow, provide the most common solution to improving mechanical reliability. However, capillary underfill adds board dehydration, underfill dispense, flow and cure steps and the associated equipment to the assembly process. Corner bonding provides an alternate approach. Dots of underfill are dispensed at the four corners of the CSP site after solder paste print, but before CSP placement. During reflow the underfill cures, providing mechanical coupling between the CSP and the board at the corners of the CSP. Since only small areas of underfill are used, board dehydration is not required. This paper examines the manufacturing process for corner bonding including dispense volume, CSP placement and reflow. Drop test results are then presented. A conventional, capillary process was used for comparison of drop test results. Test results with corner bonding were intermediate between complete capillary underfill and non-underfilled CSPs. Finite element modeling results for the drop test are also included.

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LMS and Power Point Physics Lectures

Applied Mechanics and Materials ◽

10.4028/www.scientific.net/amm.519-520.1605 ◽

2014 ◽

Vol 519-520 ◽

pp. 1605-1608

Author(s):

Tatyana N. Gnitetskaya ◽

Elena B. Ivanova ◽

Cherednychenko Alexander

Keyword(s):

Management System ◽

Learning Management System ◽

Heat Engine ◽

Drop Test ◽

Test Results ◽

Advantages And Disadvantages ◽

Learning Management ◽

Power Point

There is a big gap between level of multimedia possibilities and level of using multimedia in training physics at the universities. In this paper the advantages and disadvantages of Power Point physics lectures are described. It is noted that one from important advantages is coordination of Power Point with Learning Management System. The examples of writing formulas, drawing graphics in time are presented in this paper. It is described the animated image illustrating the operation of a heat engine with the help of aniline drop. Test results allow us to give in this paper some guidelines on slide design to make information perceiving from the screen easier for students.

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IN-ORBIT IMPLEMENTATION OF ERROR PATCHING METHODS FOR LAPAN-A3/IPB OBDH FIRMWARE SYSTEM

Jurnal Teknologi Dirgantara ◽

10.30536/j.jtd.2019.v17.a3012 ◽

2019 ◽

Vol 17 (1) ◽

pp. 11

Author(s):

Muhammad Taufik ◽

Wahyudi Hasbi ◽

Abdul Karim

Keyword(s):

Integrated System ◽

Data Handling ◽

Hardware In The Loop ◽

Test Results ◽

Engineering Model ◽

Internal Memory ◽

Two Systems ◽

Satellite Sensors

ABSTRACTOBDH (On-board data handling) is a satellite subsystem that receives, processes, decides and executes commands from and to satellites. OBDH is built on two systems namely hardware and software integrated system (firmware system). In terms of hardware, OBDH uses a processor with 32bit RISC architecture, 128/256 Kbyte internal memory and a firmware system that is built using primitive programming. This programming uses the super loop architecture program and interrupt to manage the system to function properly. Problems occur when an error occurs in one of the functions in the interrupt routine resulting in failure of interpretation of commands or data from satellite sensors. This paper describes the implementation of the error patching methods on the LAPAN-A3/IPB Satellite OBDH firmware system in order to keep the system working well. Initial verification through testing on the ground have been successfully performed using engineering model of OBDH and hardware in the loop simulators (HWIL) module. Based on the test results, implementation on satellite has also been successfully done.ABSTRAKOBDH (On-board data handling) merupakan salah satu subsistem satelit yang berfungsi menerima, mengolah, mengambil keputusan dan mengeksekusi perintah dari dan ke satelit. OBDH dibangun berdasarkan dua buah sistem yaitu sistem perangkat keras dan perangkat lunak yang terintegrasi (sistem firmware). Dari sisi perangkat keras, OBDH menggunakan prosesor dengan arsitektur 32bit RISC, 128/256 Kbyte memori internal, dan sistem firmware yang dibangun menggunakan pemrograman primitif. Pemrograman ini menggunakan arsitektur program super loop dan interrupt untuk mengelola sistem agar dapat berfungsi dengan baik. Permasalahan terjadi ketika terjadi kesalahan pada salah satu fungsi pada rutin interrupt sehingga mengakibatkan kegagalan interpretasi perintah atau data dari sensor satelit. Paper ini menjelaskan mengenai implementasi metode penambalan kesalahan pada sistem firmware OBDH satelit LAPAN-A3/IPB yang bertujuan untuk menjaga agar sistem tetap bekerja dengan baik. Verifikasi awal melalui pengujian telah berhasil dilakukan mengunakan engineering model OBDH dan modul hardware in the loop simulators (HWIL). Berdasarkan hasil pengujian, implementasi pada satelit juga telah sukses dilakukan.

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