scholarly journals High-Temperature Nanoindentation Characterization of Sintered Nano-Copper Particles Used in High Power Electronics Packaging

2021 ◽  
Author(s):  
Jiajie Fan ◽  
Dawei Jiang ◽  
Hao Zhang ◽  
Dong Hu ◽  
Xu Liu ◽  
...  
Keyword(s):  
High Temperature ◽  
Power Electronics ◽  
High Power ◽  
Electronics Packaging ◽  
Copper Particles

Die-Attach Bonding with Etched Micro Brass Metal Pigment Flakes for High-Power Electronics Packaging

2021 ◽  
Author(s):  
Sri Krishna Bhogaraju ◽  
Hiren R. Kotadia ◽  
Fosca Conti ◽  
Armin Mauser ◽  
Thomas Rubenbauer ◽  
...  
Keyword(s):  
Power Electronics ◽  
High Power ◽  
Electronics Packaging ◽  
Die Attach

Survey of High-Temperature Reliability of Power Electronics Packaging Components

2015 ◽  
Vol 30 (5) ◽  
pp. 2456-2464 ◽  
Author(s):  
R. Khazaka ◽  
L. Mendizabal ◽  
D. Henry ◽  
R. Hanna
Keyword(s):  
High Temperature ◽  
Power Electronics ◽  
Electronics Packaging
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