Electrodeposition and Characterization of Nanocrystalline Ni-NbOxComposite Coatings from Glycol-based Electrolytes for High Temperature Electronics Packaging

Jing Wang; Geoffrey D. Wilcox; Roger J. Mortimer; Changqing Liu; Mark A. Ashworth

doi:10.1149/2.0131409jes

Electrodeposition and Characterization of Nanocrystalline Ni-NbOxComposite Coatings from Glycol-based Electrolytes for High Temperature Electronics Packaging

Journal of The Electrochemical Society ◽

10.1149/2.0131409jes ◽

2014 ◽

Vol 161 (9) ◽

pp. D395-D404 ◽

Cited By ~ 7

Author(s):

Jing Wang ◽

Geoffrey D. Wilcox ◽

Roger J. Mortimer ◽

Changqing Liu ◽

Mark A. Ashworth

Keyword(s):

High Temperature ◽

Electronics Packaging ◽

High Temperature Electronics

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The Characterization of High Temperature Electronics for Future Aircraft Engine Digital Electronic Control Systems

High-Temperature Electronics ◽

10.1109/9780470544884.ch1 ◽

2009 ◽

Keyword(s):

High Temperature ◽

Control Systems ◽

Aircraft Engine ◽

Electronic Control ◽

High Temperature Electronics

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Nano Ag sintering on Cu substrate assisted by self-assembled monolayers for high-temperature electronics packaging

Microelectronics Reliability ◽

10.1016/j.microrel.2021.114241 ◽

2021 ◽

pp. 114241

Author(s):

Canyu Liu ◽

Allan Liu ◽

Yutai Su ◽

Zhaoxia Zhou ◽

Changqing Liu

Keyword(s):

High Temperature ◽

Electronics Packaging ◽

Self Assembled Monolayers ◽

Cu Substrate ◽

High Temperature Electronics ◽

Assembled Monolayers ◽

Self Assembled

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High-temperature nanoindentation characterization of sintered nano-copper particles used in high power electronics packaging

Results in Physics ◽

10.1016/j.rinp.2021.105168 ◽

2021 ◽

pp. 105168

Author(s):

Jiajie Fan ◽

Dawei Jiang ◽

Hao Zhang ◽

Dong Hu ◽

Xu Liu ◽

...

Keyword(s):

High Temperature ◽

Power Electronics ◽

High Power ◽

Electronics Packaging ◽

Copper Particles

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High-temperature electronics packaging solutions for 250°C applications

Soldering & Surface Mount Technology ◽

10.1108/ssmt.2010.21922dad.003 ◽

2010 ◽

Vol 22 (4) ◽

Keyword(s):

High Temperature ◽

Electronics Packaging ◽

High Temperature Electronics

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Comparative characterization of capacitors used in high temperature electronics applications

1998 Fourth International High Temperature Electronics Conference. HITEC (Cat. No.98EX145) ◽

10.1109/hitec.1998.676786 ◽

2002 ◽

Cited By ~ 2

Author(s):

J.S. Bowers

Keyword(s):

High Temperature ◽

Comparative Characterization ◽

High Temperature Electronics

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Hybrid Cu particle paste with surface-modified particles for high temperature electronics packaging

2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) ◽

10.23919/empc44848.2019.8951887 ◽

2019 ◽

Cited By ~ 1

Author(s):

Sri Krishna Bhogaraju ◽

Omid Mokhtari ◽

Jacopo Pascucci ◽

Alexander Hanss ◽

Maximilian Schmid ◽

...

Keyword(s):

High Temperature ◽

Electronics Packaging ◽

High Temperature Electronics ◽

Surface Modified

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Characterization of advanced materials for high voltage/high temperature power electronics packaging

APEC 2001 Sixteenth Annual IEEE Applied Power Electronics Conference and Exposition (Cat No 01CH37181) APEC-01 ◽

10.1109/apec.2001.912498 ◽

2002 ◽

Cited By ~ 5

Author(s):

D.C. Hopkins ◽

J.S. Bowers

Keyword(s):

High Temperature ◽

Power Electronics ◽

High Voltage ◽

Electronics Packaging ◽

Advanced Materials

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High temperature electronics packaging: An overview of substrates for high temperature

2015 IEEE International Symposium on Circuits and Systems (ISCAS) ◽

10.1109/iscas.2015.7168846 ◽

2015 ◽

Cited By ~ 1

Author(s):

David Shaddock ◽

Liang Yin

Keyword(s):

High Temperature ◽

Electronics Packaging ◽

High Temperature Electronics

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Laser Assisted Sintering of Silver Nanoparticle Paste for Bonding of Silicon to DBC for High Temperature Electronics Packaging

IEEE Transactions on Components Packaging and Manufacturing Technology ◽

10.1109/tcpmt.2020.3046917 ◽

2020 ◽

pp. 1-1

Author(s):

G.D. Liu ◽

C.H. Wang ◽

J. Swingler

Keyword(s):

High Temperature ◽

Silver Nanoparticle ◽

Electronics Packaging ◽

High Temperature Electronics

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High-Temperature Nanoindentation Characterization of Sintered Nano-Copper Particles Used in High Power Electronics Packaging

SSRN Electronic Journal ◽

10.2139/ssrn.3931774 ◽

2021 ◽

Author(s):

Jiajie Fan ◽

Dawei Jiang ◽

Hao Zhang ◽

Dong Hu ◽

Xu Liu ◽

...

Keyword(s):

High Temperature ◽

Power Electronics ◽

High Power ◽

Electronics Packaging ◽

Copper Particles

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