Fusion Bonding of Copper and Silicon at -70°C by Electrochemistry

2020 ◽  
Author(s):  
Po-Yen Chien ◽  
Lin Cheng ◽  
Cheng-Ying Liu ◽  
Jhong-En Li ◽  
Benjamin Tien-Hsi Lee
Keyword(s):  
Fusion Bonding

scholarly journals Fusion bonding of carbon fabric reinforced polyphenylene sulphide

2010 ◽  
Vol 6 ◽  
pp. 08005 ◽  
Author(s):  
I. De Baere ◽  
W. Van Paepegem ◽  
J. Degrieck
Keyword(s):  
Carbon Fabric ◽  
Fusion Bonding ◽  
Polyphenylene Sulphide

Fusion bonding of thermosets composite structures with thermoplastic binder co-cure and prepreg interlayer in electrical resistance welding

2016 ◽  
Vol 98 ◽  
pp. 143-149 ◽  
Author(s):  
Lei Xie ◽  
Hongbo Liu ◽  
Wangqing Wu ◽  
Dilmurat Abliz ◽  
Yugang Duan ◽  
...  
Keyword(s):  
Electrical Resistance ◽  
Composite Structures ◽  
Resistance Welding ◽  
Fusion Bonding

MEMS Post-Packaging by Localized Heating

2000 ◽  
Author(s):  
Liwei Lin
Keyword(s):  
Vapor Deposition ◽  
Microelectromechanical Systems ◽  
Chemical Vapor ◽  
Research Subject ◽  
Major Research ◽  
Research Directions ◽  
Mems Packaging ◽  
Fusion Bonding ◽  
Localized Heating ◽  
Pressure Chemical

Abstract This work addresses important post-packaging issues for microelectromechanical systems (MEMS) and introduces specific research directions by means of localized heating and bonding. MEMS packaging has become a major research subject due to the stringent packaging requirements in the emerging filed of MEMS. Establishing a versatile post-packaging process not only advances the field scientifically but also helps product commercialization in industry. An innovative post-packaging approach by localized heating and bonding is proposed and presented in this paper. Various post-packaging processes are demonstrated, including an integrated LPCVD (Low Pressure Chemical Vapor Deposition) sealing process, localized silicon-gold eutectic bonding, localized silicon-glass fusion bonding, localized solder bonding and localized CVD bonding processes.

Enhanced Comprehension of the Continuous Fusion Bonding Process of Multi-Material Structures

2018 ◽  
Vol 939 ◽  
pp. 197-204 ◽  
Author(s):  
Tobias Reincke ◽  
Sven Hartwig ◽  
Klaus Dilger
Keyword(s):  
Composite Structures ◽  
Large Scale ◽  
Lightweight Design ◽  
Continuous Process ◽  
Peel Test ◽  
Roll Forming ◽  
Scale Production ◽  
Continuous Manufacturing ◽  
Fusion Bonding ◽  
Reinforced Thermoplastics

In comparison to monolithic composite structures, tailored multi-material structures offer high potential considering lightweight design approaches in combination with cost efficient manufacturing processes. Roll forming enables flexible large scale production of hybrid structures, due to the continuous manufacturing process as well as high degree of automation. The multi-material structures consist of steel sheets which are selectively reinforced by unidirectional carbon fibre reinforced thermoplastics (CFR-TP). In view of minimizing process steps and decreasing cycle times, both materials are joined by fusion bonding. Therefore, CFR-TP is heated above melting temperature of thermoplastic matrix and joined to the steel surface under defined pressure and time. However, joining of both materials within a continuous process is still challenging due to a lack in terms of process comprehension. Consequently, multi-material specimens were manufactured depending on various process parameters as temperature of either material or processing speed and tested mechanically by floating roller peel test for the evaluation of the adhesion between both materials. Furthermore, viscosity of matrix was determined and investigations of CFR-TP interface were performed by Fourier transform infrared spectroscopy. The results show the requirement of a defined CFR-TP temperature and the change in crystalline structure of the matrix in dependency of the processing.

Effects on Silanol Condensation during Low Temperature Silicon Fusion Bonding

2009 ◽  
Vol 156 (10) ◽  
pp. H786 ◽  
Author(s):  
M. Eichler ◽  
B. Michel ◽  
P. Hennecke ◽  
C.-P. Klages
Keyword(s):  
Low Temperature ◽  
Fusion Bonding

Fusion bonding of supercooled poly(ethylene terephthalate) between Tg and Tm

2010 ◽  
Vol 119 (5) ◽  
pp. 3101-3112 ◽  
Author(s):  
Ruihua Li ◽  
Donggang Yao ◽  
Qunhui Sun ◽  
Yulin Deng
Keyword(s):  
Ethylene Terephthalate ◽  
Fusion Bonding ◽  
Poly Ethylene Terephthalate ◽  
Poly Ethylene

Bonding of 2 mm thick silicon wafers using LTCC as an intermediate layer

2012 ◽  
Vol 2012 (CICMT) ◽  
pp. 000436-000440 ◽  
Author(s):  
S. Günschmann ◽  
M. Fischer ◽  
T. Bley ◽  
I. Käpplinger ◽  
W. Brode ◽  
...  
Keyword(s):  
High Pressure ◽  
Wafer Bonding ◽  
Silicon Surface ◽  
Silicon Wafers ◽  
Anodic Bonding ◽  
Silicon Substrates ◽  
Infrared Transmission ◽  
Fusion Bonding ◽  
Internal Side ◽  
Bonding Technique

For the fabrication of a micro fluidic high pressure oil sensor (400 bar) based on an infrared transmission measuring principle the bonding of 2 mm silicon wafers is necessary. Conventional bonding techniques such as silicon fusion bonding or anodic bonding are not suitable for bonding thick and inflexible silicon wafers, because these techniques can not compensate for the wafer bow. We present a new bonding procedure for silicon substrates thicker than 1 mm using a silicon adapted LTCC tape as an intermediate leveling layer. The wafers are preprocessed by etching a nano structured silicon surface on the internal side. The silicon wafers are aligned and stacked with pre-structured green LTCC tapes by an optical stacking unit. During the hot isostatic lamination at 55 bar the structured LTCC tape is adjusted to the silicon. A subsequent pressure assisted sintering leads to a wafer bonding strength up to 5000 N/cm2. With the bonding technique it is possible to create cavities and channels between the thick wafers by the use of punched and laser cut LTCC. The fabrication steps of the sandwich build-up especially the sequential lamination and the optical adjusting procedure of the flexible (LTCC) and inflexible (2 mm Wafer) substrates will be explained in detail. A method to reduce the shrinkage and distortion of the green LTCC during handling is demonstrated. The distribution of the bonding and bursting strength of the single fluidic systems on a complete sandwich substrate is analyzed.

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