2010 IEEE International 3D Systems Integration Conference (3DIC)
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9781457705267
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Development of a CAD tool for 3D-FPGAs

2010 ◽  
Author(s):  
Naoto Miyamoto ◽  
Yohei Matsumoto ◽  
Hanpei Koike ◽  
Tadayuki Matsumura ◽  
Kenichi Osada ◽  
...  
Keyword(s):  
Cad Tool

scholarly journals Pixel detectors in 3D technologies for high energy physics

2010 ◽  
Author(s):  
G. Deptuch ◽  
M. Demarteau ◽  
J. Hoff ◽  
R. Lipton ◽  
A. Shenai ◽  
...  
Keyword(s):  
High Energy Physics ◽  
High Energy ◽  
Pixel Detectors ◽  
Energy Physics

3D DfT architecture for pre-bond and post-bond testing

2010 ◽  
Author(s):  
Erik Jan Marinissen ◽  
Chun-Chuan Chi ◽  
Jouke Verbree ◽  
Mario Konijnenburg

High density 3D integration by pre-applied Inter Chip Fill

2010 ◽  
Author(s):  
Akihiro Horibe ◽  
Kuniaki Sueoka ◽  
Katsuyuki Sakuma ◽  
Sayuri Kohara ◽  
Keiji Matsumoto ◽  
...  
Keyword(s):  
High Density ◽  
3D Integration

scholarly journals Performance analysis of 3-D monolithic integrated circuits

2010 ◽  
Author(s):  
Shashikanth Bobba ◽  
Ashutosh Chakraborty ◽  
Olivier Thomas ◽  
Perrine Batude ◽  
Vasilis F. Pavlidis ◽  
...  
Keyword(s):  
Performance Analysis ◽  
Integrated Circuits ◽  
Monolithic Integrated Circuits

Monolithic 3D integration of SRAM and image sensor using two layers of single grain silicon

2010 ◽  
Author(s):  
Negin Golshani ◽  
Jaber Derakhshandeh ◽  
Ryoichi Ishihara ◽  
C. I. M Beenakker ◽  
Michael Robertson ◽  
...  
Keyword(s):  
Image Sensor ◽  
3D Integration ◽  
Single Grain
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