The Effect of a Curing Agent and an Accelerator on the Glass Transition of Brominated and Unbrominated Diglycidyl Ether of Bisphenol A

1998 ◽  
Author(s):  
Mark F. Fleszar
Keyword(s):  
Glass Transition ◽  
Bisphenol A ◽  
Diglycidyl Ether ◽  
Curing Agent

Azomethine ether-based potential curing agent for epoxy resin (diglycidyl ether of bisphenol A): Synthesis and characterization

2020 ◽  
pp. 009524432092857
Author(s):  
Fozia Noreen ◽  
Ahtaram Bibi ◽  
Naila Khalid ◽  
Imran Ullah Khan
Keyword(s):  
Spectral Analysis ◽  
Bisphenol A ◽  
Light Emission ◽  
Condensation Reaction ◽  
Stokes Shift ◽  
Green Light ◽  
Diglycidyl Ether ◽  
Proton Nuclear Magnetic Resonance ◽  
Curing Agent ◽  
Scanning Calorimetry

Novel azomethine ether-based compounds (A: N-((4-(9-(4-(phenylimino)methyl)phenoxy)nonyloxy)benzylidene)bezenamine and B: N-((4-(9-(4-(p-hydroxyphenylimino)methyl)phenoxy)nonyloxy)benzylidene)-4-hydroxybenzenamine) were synthesized by condensation reaction of dialdehyde, 4,4-(1,9-nonandiyle)bis(oxy)dibenzaldehyde with aromatic amines. Structures of synthesized compounds were successfully characterized by Fourier transform infrared (FTIR), ultraviolet–visible, proton nuclear magnetic resonance imaging and photoluminescence (PL) spectroscopy. The PL spectral analysis revealed that emission maxima of compounds A and B are at 475 and 500 nm, respectively, indicate blue and green light emission with large Stokes shift range (Δ λ ST, 109–138 nm). Two series of polymers: one azomethine-based polymers (C1–C5) and other without azomethine (H1–H4) were prepared by curing diglycidyl ether of bisphenol A with a synthesized curing agent (B) and commercial curing agent, respectively, in various proportions. The structural characterization of the resulting polymers was carried out by FTIR spectral analysis. Thermal properties revealed that azomethine-based polymers (C1–C5) were thermally stable up to 400°C as compared to H1–H4. The glass transition temperature of the polymers, determined by differential scanning calorimetry, was in the range 121–123°C.

Cationic Catalyst as Latent Curing Agent for Epoxy Resin

2015 ◽  
Vol 749 ◽  
pp. 126-128 ◽  
Author(s):  
Ho Kyoung Choi ◽  
Bong Goo Choi ◽  
Yong Yoon Lee ◽  
Jae Sik Na
Keyword(s):  
Thermal Stability ◽  
Elevated Temperature ◽  
Bisphenol A ◽  
Epoxy Resin ◽  
Chemical Conversion ◽  
Diglycidyl Ether ◽  
Curing Agent ◽  
Good Thermal Stability ◽  
Ft Ir ◽  
Cure Temperature

1-Benzyl-3-methyl-imidazolium hexafluoroantimonate (BMH) was newly synthesized and characterized with FT-IR, 1H-NMR. We synthesized catalysts fulfill requirements for a rapid cure at a moderately elevated temperature in curing the epoxy resin for neat diglycidyl ether bisphenol A (DGBEA). The cure behavior of this resin was investigated at elevated temperature and cure temperature in the presence of 0.5, 1.0, 2.0 wt% of 1-benzyl-3-methyl-imidazolium hexafluoroantimonate (BMH) by mean of differential scanning calorimeter (DSC). Chemical conversion as function of temperature and amount of BMH (0.5, 1.0, 2.0 wt%) were determined from DSC. It was found that BMH were superior latent thermal catalyst for catinonic curing which have a good thermal stability.

Curing, Thermal and Mechanical Properties of Liquid Crystalline p-SBPEPB/BPAER/DDE System

2011 ◽  
Vol 239-242 ◽  
pp. 3253-3256 ◽  
Author(s):  
Li Huo ◽  
Jun Gang Gao ◽  
Yong Gang Du
Keyword(s):  
Mechanical Properties ◽  
Glass Transition ◽  
Transition Temperature ◽  
Glass Transition Temperature ◽  
Impact Strength ◽  
Bisphenol A ◽  
Liquid Crystalline ◽  
Curing Agent ◽  
Thermal And Mechanical Properties ◽  
Component System

The curing, thermal and mechanical properties of bi-component system for bisphenol A epoxy resin (BPAER) modified by liquid crystalline Sulfonyl bis(4,1-phenylene)bis[4-(2,3-epoxypro pyloxy)benzoate] (p-SBPEPB), with 4,4'-diaminodiphenyl ether (DDE) as a curing agent, were investigated. The effect of the different liquid crystalline contents and the heating rate on curing reaction was discussed. The results show that the curing peak temperature decreases, curing rate increases, the glass transition temperature (Tg)and impact strength all increase with adding of liquid crystalline p-SBPEPB when the content is not over 8wt%.

Fast Curing Epoxy and Episulfide Resins for Biomedical Applications

1987 ◽  
Vol 110 ◽  
Author(s):  
Ioannis N. Hadjinikolaou ◽  
James P. Bell ◽  
Larz Spangberg
Keyword(s):  
Bisphenol A ◽  
Physical Properties ◽  
Epoxy Resins ◽  
Biomedical Applications ◽  
Room Temperature ◽  
Diglycidyl Ether ◽  
Clinical Use ◽  
Curing Agent ◽  
Curing Agents

Epoxy resins have physical properties that make them suitable for dental and orthopaedic applications such as adhesives and cements. However, it has been observed that epoxy resins harden too slowly for clinical use when mixed with conventional curing agents, e.g. amines and polyamides. A new epoxy - diepisulfide - polyamide system has been developed which gels in 5 to 20 minutes at room temperature. The system consists of two parts: a polyamide curing agent, and a blend of the diepisulfide analog of diglycidyl ether of bisphenol A [DGEBA] dissolved in a mixture of epoxies of the DGEBA type.

Study on curing kinetics of a diglycidyl ether of bisphenol A epoxy resin/microencapsulated curing agent system

2012 ◽  
Vol 24 (8) ◽  
pp. 730-737 ◽  
Author(s):  
Wang Fang ◽  
Xiao Jun ◽  
Wang Jing-wen ◽  
Li Shu-qin
Keyword(s):  
Particle Size ◽  
Bisphenol A ◽  
Epoxy Resin ◽  
Diglycidyl Ether ◽  
Wall Material ◽  
Curing Agent ◽  
Resin System ◽  
Scanning Calorimetry ◽  
Cure Reaction ◽  
Epoxy Resin System

A modified imidazole curing agent, EMI-g-BGE, was encapsulated for one-package of diglycidyl ether of bisphenol A (DGEBA) epoxy resin system. Polyetherimide (PEI) was used as the wall material, and the emulsion solvent evaporation method was used to form the microcapsules. The morphology and particle size distribution of microcapsules were evaluated by scanning electron microscopy (SEM), mastersizer analyzer. Microcapsules exhibited spherical shapes and the mean particle size was about 745 nm. The curing kinetic of DGEBA/microcapsules curing agent was studied by nonisothermal differential scanning calorimetry (DSC) technique at different heating rates. Dynamic DSC scans indicated the microcapsule was an effective curing agent of epoxy resin. The apparent activation energy Ea was 88.03 kJ/mol calculated through Kissinger method, more than DGEBA/EMI-g-BGE system. This microcapsule of EMI-g-BGE exhibited a long shelf life, and the curing did not occur in this epoxy-microcapsule resin system for more than 3months at room temperature. The kinetic parameters were determined by Málek method and a two-parameter ( m, n) autocatalytic model (Šesták–Berggren equation) was found to be the most adequate selected kinetic model, which showed the encapsulation of the curing agent EMI-g-BGE did not change the cure reaction mechanism of the epoxy resin system. From the experimental data, the nonisothermal DSC curves show the results being in accordant with those theoretically calculated.

Dielectric Cure Analysis of Epoxy Resins before Gelation

2002 ◽  
Vol 18 (3) ◽  
pp. 127-159 ◽  
Author(s):  
Tsuneo Koike
Keyword(s):  
Bisphenol A ◽  
Real Time ◽  
Epoxy Resins ◽  
Structural Model ◽  
Diglycidyl Ether ◽  
Curing Agent ◽  
Monitoring Methods ◽  
Real Time Monitoring ◽  
The Real ◽  
Epoxide Oligomer

Dielectric measuring methods have been widely used for monitoring the curing system of the diglycidyl ether of bisphenol-A (DGEBA), a typical commercially available epoxide oligomer. The uncured DGEBA oligomer is regarded as a simple structural model for the reactive DGEBA-curing agent system before gelation. Dielectric monitoring methods, which are based on viscoelastic data of uncured DGEBA, are reviewed in terms of the real-time monitoring of the DGEBA curing system.

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