Curing of diglycidyl ether of bisphenol-A epoxy resin using a poly(aryl ether ketone) bearing pendant carboxyl groups as macromolecular curing agent

2009 ◽  
Vol 58 (8) ◽  
pp. 912-918 ◽  
Author(s):  
Fuhua Liu ◽  
Zhonggang Wang ◽  
Dan Liu ◽  
Jianfeng Li
Keyword(s):  
Bisphenol A ◽  
Epoxy Resin ◽  
Diglycidyl Ether ◽  
Carboxyl Groups ◽  
Curing Agent ◽  
Aryl Ether ◽  
Aryl Ether Ketone ◽  
Ether Ketone

Diglycidyl ether of bisphenol-A epoxy resin modified using poly(ether ether ketone) with pendenttert-butyl groups

2007 ◽  
Vol 45 (17) ◽  
pp. 2481-2496 ◽  
Author(s):  
Bejoy Francis ◽  
Sabu Thomas ◽  
R. Sadhana ◽  
Nicole Thuaud ◽  
R. Ramaswamy ◽  
...  
Keyword(s):  
Bisphenol A ◽  
Epoxy Resin ◽  
Diglycidyl Ether ◽  
Ether Ether Ketone ◽  
Poly Ether Ether Ketone ◽  
Ether Ketone

Cationic Catalyst as Latent Curing Agent for Epoxy Resin

2015 ◽  
Vol 749 ◽  
pp. 126-128 ◽  
Author(s):  
Ho Kyoung Choi ◽  
Bong Goo Choi ◽  
Yong Yoon Lee ◽  
Jae Sik Na
Keyword(s):  
Thermal Stability ◽  
Elevated Temperature ◽  
Bisphenol A ◽  
Epoxy Resin ◽  
Chemical Conversion ◽  
Diglycidyl Ether ◽  
Curing Agent ◽  
Good Thermal Stability ◽  
Ft Ir ◽  
Cure Temperature

1-Benzyl-3-methyl-imidazolium hexafluoroantimonate (BMH) was newly synthesized and characterized with FT-IR, 1H-NMR. We synthesized catalysts fulfill requirements for a rapid cure at a moderately elevated temperature in curing the epoxy resin for neat diglycidyl ether bisphenol A (DGBEA). The cure behavior of this resin was investigated at elevated temperature and cure temperature in the presence of 0.5, 1.0, 2.0 wt% of 1-benzyl-3-methyl-imidazolium hexafluoroantimonate (BMH) by mean of differential scanning calorimeter (DSC). Chemical conversion as function of temperature and amount of BMH (0.5, 1.0, 2.0 wt%) were determined from DSC. It was found that BMH were superior latent thermal catalyst for catinonic curing which have a good thermal stability.

Synthesis and properties of a cyclic oligo(aryl ether ketone) based on bisphenol A and its polymerization

1998 ◽  
Vol 263 (1) ◽  
pp. 15-20 ◽  
Author(s):  
Mitsuhiro Shibata ◽  
Ryutoku Yosomiya ◽  
Chunhai Chen ◽  
Junzuo Wang ◽  
Zhongwen Wu
Keyword(s):  
Bisphenol A ◽  
Aryl Ether ◽  
Aryl Ether Ketone ◽  
Ether Ketone

One-Pot Synthesis and Characterization of Soluble Poly(aryl ether−ketone)s Having Pendant Carboxyl Groups

2003 ◽  
Vol 36 (13) ◽  
pp. 4766-4771 ◽  
Author(s):  
Mikhail G. Zolotukhin ◽  
Howard M. Colquhoun ◽  
Lionel G. Sestiaa ◽  
Daniel R. Rueda ◽  
David Flot
Keyword(s):  
Synthesis And Characterization ◽  
Carboxyl Groups ◽  
Aryl Ether ◽  
One Pot ◽  
One Pot Synthesis ◽  
Aryl Ether Ketone ◽  
Ether Ketone ◽  
Soluble Poly

Study on curing kinetics of a diglycidyl ether of bisphenol A epoxy resin/microencapsulated curing agent system

2012 ◽  
Vol 24 (8) ◽  
pp. 730-737 ◽  
Author(s):  
Wang Fang ◽  
Xiao Jun ◽  
Wang Jing-wen ◽  
Li Shu-qin
Keyword(s):  
Particle Size ◽  
Bisphenol A ◽  
Epoxy Resin ◽  
Diglycidyl Ether ◽  
Wall Material ◽  
Curing Agent ◽  
Resin System ◽  
Scanning Calorimetry ◽  
Cure Reaction ◽  
Epoxy Resin System

A modified imidazole curing agent, EMI-g-BGE, was encapsulated for one-package of diglycidyl ether of bisphenol A (DGEBA) epoxy resin system. Polyetherimide (PEI) was used as the wall material, and the emulsion solvent evaporation method was used to form the microcapsules. The morphology and particle size distribution of microcapsules were evaluated by scanning electron microscopy (SEM), mastersizer analyzer. Microcapsules exhibited spherical shapes and the mean particle size was about 745 nm. The curing kinetic of DGEBA/microcapsules curing agent was studied by nonisothermal differential scanning calorimetry (DSC) technique at different heating rates. Dynamic DSC scans indicated the microcapsule was an effective curing agent of epoxy resin. The apparent activation energy Ea was 88.03 kJ/mol calculated through Kissinger method, more than DGEBA/EMI-g-BGE system. This microcapsule of EMI-g-BGE exhibited a long shelf life, and the curing did not occur in this epoxy-microcapsule resin system for more than 3months at room temperature. The kinetic parameters were determined by Málek method and a two-parameter ( m, n) autocatalytic model (Šesták–Berggren equation) was found to be the most adequate selected kinetic model, which showed the encapsulation of the curing agent EMI-g-BGE did not change the cure reaction mechanism of the epoxy resin system. From the experimental data, the nonisothermal DSC curves show the results being in accordant with those theoretically calculated.

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