Novel flame-retardant thermosets: Diglycidyl ether of bisphenol A as a curing agent of boron-containing phenolic resins

2006 ◽  
Vol 44 (5) ◽  
pp. 1701-1710 ◽  
Author(s):  
C. Martín ◽  
J. C. Ronda ◽  
V. Cádiz
Keyword(s):  
Bisphenol A ◽  
Flame Retardant ◽  
Diglycidyl Ether ◽  
Curing Agent ◽  
Phenolic Resins

Azomethine ether-based potential curing agent for epoxy resin (diglycidyl ether of bisphenol A): Synthesis and characterization

2020 ◽  
pp. 009524432092857
Author(s):  
Fozia Noreen ◽  
Ahtaram Bibi ◽  
Naila Khalid ◽  
Imran Ullah Khan
Keyword(s):  
Spectral Analysis ◽  
Bisphenol A ◽  
Light Emission ◽  
Condensation Reaction ◽  
Stokes Shift ◽  
Green Light ◽  
Diglycidyl Ether ◽  
Proton Nuclear Magnetic Resonance ◽  
Curing Agent ◽  
Scanning Calorimetry

Novel azomethine ether-based compounds (A: N-((4-(9-(4-(phenylimino)methyl)phenoxy)nonyloxy)benzylidene)bezenamine and B: N-((4-(9-(4-(p-hydroxyphenylimino)methyl)phenoxy)nonyloxy)benzylidene)-4-hydroxybenzenamine) were synthesized by condensation reaction of dialdehyde, 4,4-(1,9-nonandiyle)bis(oxy)dibenzaldehyde with aromatic amines. Structures of synthesized compounds were successfully characterized by Fourier transform infrared (FTIR), ultraviolet–visible, proton nuclear magnetic resonance imaging and photoluminescence (PL) spectroscopy. The PL spectral analysis revealed that emission maxima of compounds A and B are at 475 and 500 nm, respectively, indicate blue and green light emission with large Stokes shift range (Δ λ ST, 109–138 nm). Two series of polymers: one azomethine-based polymers (C1–C5) and other without azomethine (H1–H4) were prepared by curing diglycidyl ether of bisphenol A with a synthesized curing agent (B) and commercial curing agent, respectively, in various proportions. The structural characterization of the resulting polymers was carried out by FTIR spectral analysis. Thermal properties revealed that azomethine-based polymers (C1–C5) were thermally stable up to 400°C as compared to H1–H4. The glass transition temperature of the polymers, determined by differential scanning calorimetry, was in the range 121–123°C.

A novel curing agent based on diphenylphosphine oxide for flame-retardant epoxy resin

2017 ◽  
Vol 30 (10) ◽  
pp. 1229-1239 ◽  
Author(s):  
Shan Huang ◽  
Xiao Hou ◽  
Jiaojiao Li ◽  
Xiujuan Tian ◽  
Qing Yu ◽  
...  
Keyword(s):  
Heat Release ◽  
Flame Retardant ◽  
Epoxy Resin ◽  
Energy Dispersive Spectrometer ◽  
Diglycidyl Ether ◽  
Curing Agent ◽  
Diphenylphosphine Oxide ◽  
Excellent Thermal Stability ◽  
Cone Calorimeter Test ◽  
Ul 94

A phosphorous/nitrogen-containing diphenylphosphine oxide (DPO) derivative (DPO-SS) was designed and synthesized via a two-step reaction of 4,4′-diaminodiphenylsulfone, 2-hydroxy-benzaldehyde, and DPO. The structure of DPO-SS was confirmed by Fourier transform infrared spectroscopy (FTIR), 1H and 31P nuclear magnetic resonance (NMR) spectroscopy, and mass spectrometry (MS). DPO-SS was used as a flame retardant and curing agent for copolymerizing with diglycidyl ether of bisphenol-A. Thermal and flame-retardant properties of the obtained flame-retardant epoxy resin (F-EP) were investigated by thermogravimetric analysis, dynamic thermomechanical analysis, limited oxygen index (LOI) measurement, vertical burning test (UL-94), and cone calorimeter test. Results indicated that all F-EP samples exhibited excellent thermal stability and flame-retardant property. Especially for F-EP with P content of 0.7 wt% (denoted as EP/P-0.7), it achieved high LOI values (32.4%) and UL-94 V-0 rating. Compared with pure EP, all F-EP samples showed lower heat release rate, total heat release, total smoke produce, and little Tg fluctuation. In order to study the flame-retardant mechanism, the char residues were investigated by FTIR, scanning electron microscopy, and energy-dispersive spectrometer analysis. The results manifested that DPO-SS acted as flame retardant in both gas phase and condensed phase. Water absorption properties of pure EP and F-EP were also compared through immersion experiments. Results showed that EP/P-0.7 sample had apparently lower water absorptivity than pure EP.

Cationic Catalyst as Latent Curing Agent for Epoxy Resin

2015 ◽  
Vol 749 ◽  
pp. 126-128 ◽  
Author(s):  
Ho Kyoung Choi ◽  
Bong Goo Choi ◽  
Yong Yoon Lee ◽  
Jae Sik Na
Keyword(s):  
Thermal Stability ◽  
Elevated Temperature ◽  
Bisphenol A ◽  
Epoxy Resin ◽  
Chemical Conversion ◽  
Diglycidyl Ether ◽  
Curing Agent ◽  
Good Thermal Stability ◽  
Ft Ir ◽  
Cure Temperature

1-Benzyl-3-methyl-imidazolium hexafluoroantimonate (BMH) was newly synthesized and characterized with FT-IR, 1H-NMR. We synthesized catalysts fulfill requirements for a rapid cure at a moderately elevated temperature in curing the epoxy resin for neat diglycidyl ether bisphenol A (DGBEA). The cure behavior of this resin was investigated at elevated temperature and cure temperature in the presence of 0.5, 1.0, 2.0 wt% of 1-benzyl-3-methyl-imidazolium hexafluoroantimonate (BMH) by mean of differential scanning calorimeter (DSC). Chemical conversion as function of temperature and amount of BMH (0.5, 1.0, 2.0 wt%) were determined from DSC. It was found that BMH were superior latent thermal catalyst for catinonic curing which have a good thermal stability.

Fast Curing Epoxy and Episulfide Resins for Biomedical Applications

1987 ◽  
Vol 110 ◽  
Author(s):  
Ioannis N. Hadjinikolaou ◽  
James P. Bell ◽  
Larz Spangberg
Keyword(s):  
Bisphenol A ◽  
Physical Properties ◽  
Epoxy Resins ◽  
Biomedical Applications ◽  
Room Temperature ◽  
Diglycidyl Ether ◽  
Clinical Use ◽  
Curing Agent ◽  
Curing Agents

Epoxy resins have physical properties that make them suitable for dental and orthopaedic applications such as adhesives and cements. However, it has been observed that epoxy resins harden too slowly for clinical use when mixed with conventional curing agents, e.g. amines and polyamides. A new epoxy - diepisulfide - polyamide system has been developed which gels in 5 to 20 minutes at room temperature. The system consists of two parts: a polyamide curing agent, and a blend of the diepisulfide analog of diglycidyl ether of bisphenol A [DGEBA] dissolved in a mixture of epoxies of the DGEBA type.

Study on curing kinetics of a diglycidyl ether of bisphenol A epoxy resin/microencapsulated curing agent system

2012 ◽  
Vol 24 (8) ◽  
pp. 730-737 ◽  
Author(s):  
Wang Fang ◽  
Xiao Jun ◽  
Wang Jing-wen ◽  
Li Shu-qin
Keyword(s):  
Particle Size ◽  
Bisphenol A ◽  
Epoxy Resin ◽  
Diglycidyl Ether ◽  
Wall Material ◽  
Curing Agent ◽  
Resin System ◽  
Scanning Calorimetry ◽  
Cure Reaction ◽  
Epoxy Resin System

A modified imidazole curing agent, EMI-g-BGE, was encapsulated for one-package of diglycidyl ether of bisphenol A (DGEBA) epoxy resin system. Polyetherimide (PEI) was used as the wall material, and the emulsion solvent evaporation method was used to form the microcapsules. The morphology and particle size distribution of microcapsules were evaluated by scanning electron microscopy (SEM), mastersizer analyzer. Microcapsules exhibited spherical shapes and the mean particle size was about 745 nm. The curing kinetic of DGEBA/microcapsules curing agent was studied by nonisothermal differential scanning calorimetry (DSC) technique at different heating rates. Dynamic DSC scans indicated the microcapsule was an effective curing agent of epoxy resin. The apparent activation energy Ea was 88.03 kJ/mol calculated through Kissinger method, more than DGEBA/EMI-g-BGE system. This microcapsule of EMI-g-BGE exhibited a long shelf life, and the curing did not occur in this epoxy-microcapsule resin system for more than 3months at room temperature. The kinetic parameters were determined by Málek method and a two-parameter ( m, n) autocatalytic model (Šesták–Berggren equation) was found to be the most adequate selected kinetic model, which showed the encapsulation of the curing agent EMI-g-BGE did not change the cure reaction mechanism of the epoxy resin system. From the experimental data, the nonisothermal DSC curves show the results being in accordant with those theoretically calculated.

scholarly journals Impact of halogen-free flame retardant with varied phosphorus chemical surrounding on the properties of diglycidyl ether of bisphenol-A type epoxy resin: synthesis, fire behaviour, flame-retardant mechanism and mechanical properties

RSC Advances ◽  
2016 ◽  
Vol 6 (64) ◽  
pp. 59226-59236 ◽  
Author(s):  
Xiaomin Zhao ◽  
Heeralal Vignesh Babu ◽  
Javier Llorca ◽  
De-Yi Wang
Keyword(s):  
Mechanical Properties ◽  
Bisphenol A ◽  
Flame Retardant ◽  
Epoxy Resin ◽  
Flame Retardants ◽  
Diglycidyl Ether ◽  
Fire Behaviour ◽  
Halogen Free

This work aimed to investigate the effect of two types ofphosphorus-containing flame retardants (P-FRs) with different chemical surroundings on flame-retardant efficiency for diglycidyl ester of bisphenol-A type epoxy (EP).

Dielectric Cure Analysis of Epoxy Resins before Gelation

2002 ◽  
Vol 18 (3) ◽  
pp. 127-159 ◽  
Author(s):  
Tsuneo Koike
Keyword(s):  
Bisphenol A ◽  
Real Time ◽  
Epoxy Resins ◽  
Structural Model ◽  
Diglycidyl Ether ◽  
Curing Agent ◽  
Monitoring Methods ◽  
Real Time Monitoring ◽  
The Real ◽  
Epoxide Oligomer

Dielectric measuring methods have been widely used for monitoring the curing system of the diglycidyl ether of bisphenol-A (DGEBA), a typical commercially available epoxide oligomer. The uncured DGEBA oligomer is regarded as a simple structural model for the reactive DGEBA-curing agent system before gelation. Dielectric monitoring methods, which are based on viscoelastic data of uncured DGEBA, are reviewed in terms of the real-time monitoring of the DGEBA curing system.

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