Surface Modified Nanoparticles as Internal Breakers for Viscoelastic Surfactant Based Fracturing Fluids for High Temperature Operations

2017 ◽  
Author(s):  
Shiv Shankar Sangaru ◽  
Prahlad Yadav ◽  
Tim Huang ◽  
Gaurav Agrawal ◽  
Frank Fakuen Chang
Keyword(s):  
High Temperature ◽  
Fracturing Fluids ◽  
Viscoelastic Surfactant ◽  
Surface Modified ◽  
Surface Modified Nanoparticles

Impact of Surface-Modified Nanoparticles on Glass Transition Temperature and Elastic Modulus of Polymer Thin Films

2007 ◽  
Vol 40 (22) ◽  
pp. 7755-7757 ◽  
Author(s):  
Jong-Young Lee ◽  
Kristin E. Su ◽  
Edwin P. Chan ◽  
Qingling Zhang ◽  
Todd Emrick ◽  
...  
Keyword(s):  
Thin Films ◽  
Glass Transition ◽  
Elastic Modulus ◽  
Transition Temperature ◽  
Glass Transition Temperature ◽  
Polymer Thin Films ◽  
Surface Modified ◽  
Surface Modified Nanoparticles

A Novel Gemini Cationic Viscoelastic Surfactant-Based Fluid for High Temperature Well Stimulation Applications

2021 ◽  
Author(s):  
Dawn Friesen ◽  
Brian Seymour ◽  
Aaron Sanders
Keyword(s):  
Thermal Stability ◽  
High Temperature ◽  
Chain Length ◽  
Surfactant Concentration ◽  
Gemini Surfactant ◽  
Alkyl Chain ◽  
Friction Reduction ◽  
Fluid Viscosity ◽  
Viscoelastic Surfactant ◽  
The Impact

Abstract Viscoelastic surfactant (VES)-based fracturing fluids can reduce the risk of formation damage when compared with conventional polymer-based fracturing systems. However, many VES systems lose viscoelasticity rapidly under high-temperature conditions, leading to high fluid leakoff and problems in proppant placement. A gemini cationic VES-based system offering thermal stability above 250°F and its efficiency in friction reduction is presented in this paper. Rheology measurements were conducted on viscoelastic cationic gemini surfactant fluids as a function of temperature (70 – 300°F) and surfactant concentration. The length of surfactant alkyl chain was varied to investigate the impact of surfactant chain length on VES fluid viscosity at elevated temperatures. The effect of flow rate on friction reduction capability of the surfactant fluid was measured on a friction flow loop. Foam rheology measurements were conducted to evaluate the VES fluid's ability to maintain high temperature viscosity with reduced surfactant concentration. A gemini cationic surfactant was used to prepare a viscoelastic surfactant system that could maintain viscosity over 50 cP at a shear rate of 100 s−1up to at least 250°F. With this system, viscoelastic gel viscosity was maintained without degradation for over 18 hours at 250°F, and the fluid showed rapid shear recovery throughout. Decreasing the average alkyl chain length on the surfactant reduced the maximum working temperature of the resulting viscoelastic gel and showed the critical influence of surfactant structure on the resulting fluid performance. The presence of elongated, worm-like micelles in the fluid provided polymer-like friction reduction even at low surfactant concentrations, with friction reduction of over 70% observed during pumping (relative to fresh water) up to a critical Reynolds number. Energized fluids could also be formulated with the gemini surfactant to give foam fluids suitable for hydraulic fracturing or wellbore cleanouts. The resulting viscoelastic surfactant foams had viscosities over 50 cP up to at least 300°F with both nitrogen and carbon dioxide as the gas phase. The information presented in this paper is important for various field applications where thermal stability of the treatment fluid is essential. This will hopefully expand the use of VES-based systems as an alternative to conventional polymer systems in oilfield applications where a less damaging viscosified fluid system is required.

Rheological Characteristics of Viscoelastic Surfactant Fluid Mixed With Silica Nanoparticles

2013 ◽  
Author(s):  
Yueqiong Wu ◽  
Zhongyang Luo ◽  
Hong Yin ◽  
Tao Wang
Keyword(s):  
High Temperature ◽  
Shear Rate ◽  
Volume Fraction ◽  
Sio2 Nanoparticles ◽  
Fluid Loss ◽  
Rheological Characteristics ◽  
High Shear ◽  
Fracturing Process ◽  
Viscoelastic Surfactant ◽  
Rheological Performance

Since the surfactant can form rod-like micelles or even cross-link structures, viscoelastic surfactant (VES) fluid has unique rheological characteristics. The demerits of VES fluids have been proven after being applied as the fracturing fluid for several years. However, the fluid has high fluid loss and a low viscosity at high temperature, which limits the application to hydraulic fracturing. This paper focuses on the VES fluid mixed with nanoparticles which should be an effective way to maintain the viscosity at high temperature and high shear rate. The experiments were based on preparation of uniform and stable nanocolloids, which utilize Microfluidizer high shear fluid processor. Dynamic light scattering and microscopic methods are employed to investigate the stability and micro-structure of the VES fluid. The effects of temperature, shear rate and volume fraction of the nanoparticles on rheology of VES were studied. The SiO2 nanoparticles could significantly improve the rheological performance of VES fluid, although the rheological performance at the temperature over 90 °C needs to be enhanced. The mechanisms of interactions between nanoparticles and micelles are also discussed later in the paper. At the end, the potential of VES fluid mixed with nanoparticles during application in fracturing process was discussed.

High-Temperature Rheological Study of Foam Fracturing Fluids

1987 ◽  
Vol 39 (05) ◽  
pp. 613-619 ◽  
Author(s):  
P.C. Harris ◽  
V.G. Reidenbach
Keyword(s):  
High Temperature ◽  
Rheological Study ◽  
Fracturing Fluids

A multi-pronged approach to low-pressure Cu sintering using surface-modified particles, substrate and chip metallization

2019 ◽  
Vol 2019 (1) ◽  
pp. 000387-000392 ◽  
Author(s):  
Sri Krishna Bhogaraju ◽  
Omid Mokhtari ◽  
Jacopo Pascucci ◽  
Fosca Conti ◽  
Hiren R Kotadia ◽  
...  
Keyword(s):  
High Temperature ◽  
Low Cost ◽  
Surface Modifications ◽  
Low Pressure ◽  
Bonding Pressure ◽  
High Tendency ◽  
Promising Alternative ◽  
Die Attach ◽  
Bandgap Semiconductors ◽  
Surface Modified

Abstract High temperature power electronics based on wide-bandgap semiconductors have prominent applications, such as automotive, aircrafts, space exploration, oil/gas extraction, electricity distribution. Die-attach bonding process is an essential process in the realization of high temperature power devices. Here Cu offers to be a promising alternative to Ag, especially because of thermal and mechanical properties on par with Ag and a cost advantage by being a factor 100 cheaper than Ag. With the aim to achieve a low-pressure Cu sintering process, a low cost wet chemical etching process is developed to selectively etch Zn from brass to create nano-porous surface modifications to enhance sinterability, enabling sintering with low bonding pressure of 1MPa and at temperatures below 300°C. However, high tendency of Cu to oxidize poses a major challenge in realizing stable interconnects. For this purpose, in this contribution, we present the use of polyethylene-glycol 600 as reducing binder in the formulation of the Cu sintering paste. Finally, we propose a multi-pronged approach based on three crucial factors: surface-modified substrates, nanostructured surface modifications on micro-scale Cu-alloy particles and use of a reducing binder in the Cu particle paste.

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