scholarly journals 2-in-1 Diodes with a Contact-Sidewall Structure for Small Pixel Pitch in Silicon-on-Insulator (SOI) Uncooled Infrared (IR) Focal Plane Arrays

2014 ◽  
pp. 189
2015 ◽  
Author(s):  
John Caulfield ◽  
Jon Curzan ◽  
Jay Lewis ◽  
Nibir Dhar

2007 ◽  
Author(s):  
Chuan Li ◽  
George D. Skidmore ◽  
Christopher Howard ◽  
C. J. Han ◽  
Lewis Wood ◽  
...  

2008 ◽  
Vol 1112 ◽  
Author(s):  
Craig Lewis Keast ◽  
Brian Aull ◽  
James Burns ◽  
Chenson Chen ◽  
Jeff Knecht ◽  
...  

AbstractWe have developed a three-dimensional (3D) circuit integration technology that exploits the advantages of silicon-on-insulator (SOI) technology to enable wafer-level stacking and micrometer-scale electrical interconnection of fully fabricated circuit wafers. This paper describes the 3D technology and discusses some of the advanced focal plane arrays that have been built using it.


2009 ◽  
Author(s):  
Chuan Li ◽  
George Skidmore ◽  
Christopher Howard ◽  
Elwood Clarke ◽  
C. J. Han

2014 ◽  
Author(s):  
John T. Caulfield ◽  
Jerry A. Wilson ◽  
Nibir K. Dhar

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