scholarly journals Heat Source Analysis on Ultrasonic Welding of Plastic Structural Components Based on Numerical Simulation

2021 ◽  
Vol 39 (3) ◽  
pp. 947-954
Author(s):  
Miaomiao Zhang
Keyword(s):  
Heat Transfer ◽  
Numerical Simulation ◽  
Heat Source ◽  
Welding Process ◽  
Transient Heat Conduction ◽  
Ultrasonic Welding ◽  
Weld Strength ◽  
Source Analysis ◽  
Structural Components ◽  
Small Surface

Compared with traditional arc welding, ultrasonic welding of plastic structural components has such advantages as fast welding speed, high weld strength, small surface damages, simple equipment operation and cleanness and no pollution, thus having a good application prospect. However, the existing literatures have discussed little on the thermal stability analysis of the welding process and the influences of the parameters affecting the fixation effect of welding on the heat transfer performance of the welding process. For this reason, this paper analyzes the heat source in the ultrasonic welding of plastic structural components based on numerical simulation. First, numerical simulation was performed on the temperature field of the heat source in the ultrasonic welding of plastic structural components, the basic heat transfer forms in the welding process were elaborated in detail, the corresponding governing equations and boundary conditions were given and the governing equation of nonlinear transient heat conduction were solved by the finite element method. Then, ABAQUS thermal analysis and heat source parameter calibration were carried out on the welding heat source. In the experiment section, the heat source analysis results were given regarding the ultrasonic welding of plastic structural components.

scholarly journals Thermal Design and Cooling Performance Evaluation of Electronic Equipment Containing Power Electronic Devices

2021 ◽  
Vol 39 (2) ◽  
pp. 451-459
Author(s):  
Zhengde Wang
Keyword(s):  
Heat Transfer ◽  
Numerical Simulation ◽  
Heat Source ◽  
Electronic Devices ◽  
Thermal Design ◽  
Electronic Equipment ◽  
Source Analysis ◽  
Power Electronic ◽  
Cooling Performance ◽  
Scheme Design

In electronic equipment, thermal failure and thermal degradation are two increasingly prominent problems of the devices, with the deepening integration and growing power density. Currently, there are relatively few reports on the heat transfer mechanism, heat source analysis, and numerical simulation of electronic equipment containing power electronic devices (PEDs). Therefore, this paper carries out thermal design and evaluates the cooling performance of PED-containing electronic equipment. Firstly, the basic flow was given for the thermal design of PED-containing electronic equipment; the heat transfer mode of PEDs and the equipment were detailed, so was the principle of thermal design; the cooling principles were introduced for ventilation cooling, heat pipe cooling, and closed loop cooling. Then, numerical simulation was carried out on the solid and liquid state heat transfer of PEDs and the equipment under different cooling modes. Based on an engineering example, the cooling scheme was finalized through heat source analysis on the proposed electronic equipment. The experimental results rove the effectiveness of numerical simulation and electronic equipment cooling scheme. The results provide a reference for the cooling scheme design for other fields of thermal design.

scholarly journals The numerical simulation of heat transfer during a hybrid laser–MIG welding using equivalent heat source approach

2014 ◽  
Vol 56 ◽  
pp. 334-342 ◽  
Author(s):  
Issam Bendaoud ◽  
Simone Matteï ◽  
Eugen Cicala ◽  
Iryna Tomashchuk ◽  
Henri Andrzejewski ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Numerical Simulation ◽  
Heat Source ◽  
Mig Welding

An Appropriate Design in Dimensions of Submount with Extra-Low Thermal Resistance for High Power LED

2013 ◽  
Vol 284-287 ◽  
pp. 824-828
Author(s):  
Farn Shiun Hwu ◽  
Ho Chih Cheng ◽  
Ya Hui Hu ◽  
Gwo Jiun Sheu
Keyword(s):  
Heat Transfer ◽  
Numerical Simulation ◽  
Numerical Model ◽  
Aspect Ratio ◽  
Heat Source ◽  
Thermal Resistance ◽  
Symmetry Axis ◽  
Contact Ratio ◽  
Convective Effect ◽  
Internal Thermal Resistance

A numerical simulation model to obtain the extra-low internal thermal resistance for submount of LED is presented. The 3-D numerical model for calculating thermal resistance is demonstrated on examining the aspect ratio of submount, the contact ratio between chip and submount, and the surrounding condition. According to the analysis by accurate numerical simulations of heat transfer; the appropriate dimensions for different conditions of ambient are determined. The thickness of submount should be over a specially designated value. Besides, a higher contact ratio between heat source and submount, a larger external convective effect, and the heat dissipated from symmetry axis of submount will decrease the spreading thermal resistance.

scholarly journals Continuous ultrasonic welding of thermoplastic composites: Enhancing the weld uniformity by changing the energy director

2019 ◽  
Vol 54 (15) ◽  
pp. 2023-2035 ◽  
Author(s):  
Bram Jongbloed ◽  
Julie Teuwen ◽  
Genevieve Palardy ◽  
Irene Fernandez Villegas ◽  
Rinze Benedictus
Keyword(s):  
Thin Film ◽  
Heat Generation ◽  
High Speed ◽  
Welding Process ◽  
Ultrasonic Welding ◽  
Thermoplastic Composites ◽  
Weld Strength ◽  
Good Contact ◽  
Energy Director ◽  
Welded Seam

Continuous ultrasonic welding is a high-speed joining method for thermoplastic composites. Currently, a thin film energy director is used to focus the heat generation at the interface. However, areas of intact energy director remain in the welded seam, which significantly lowers the weld strength, and result in a non-uniformly welded seam. To improve the weld uniformity of continuous ultrasonically welded joints, we changed to a more compliant energy director. A woven polymer mesh energy director was found to give a significant improvement in weld quality. The mesh was flattened in between the composite adherends during the welding process. This flattening promoted a good contact between the energy director and the adherends, fully wetting the adherend surfaces, resulting in a more uniformly welded seam without areas of intact energy director.

scholarly journals Development of Finite Element Solver for Welding Analysis

2018 ◽  
Vol 2 (2) ◽  
Author(s):  
Abid Ali Khan ◽  
Farzeen Shahid ◽  
Ihtzaz Qamar
Keyword(s):  
Finite Element ◽  
Temperature Field ◽  
Heat Conduction ◽  
Heat Source ◽  
Welding Process ◽  
Transient Heat Conduction ◽  
Moving Heat Source ◽  
Structural Members ◽  
Final Solution ◽  
Governing Equations

Welding is a process of joining the similar or different metals. Improper welding process leads to inaccuracies and misalignments of structural members, causing high cost and delays in work. Therefore, it is essential to predict the temperature field during welding process. Different techniques can be used to predict the temperature field, which may lead to structure distortion. The present study aims to develop a finite element solver for transient heat conduction analysis. The final solution is calculated from the assumed solution and compared with the numerical computations. The solver is then modified for use of moving heat source. The modification comprise, change in governing equations with the inclusion of phase change. The moving heat source continuously increases the temperature during motion. When the heat source completes a pass, model is allowed to cool down in order to study the temperature distribution during cooling.

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