Theoretical (Ideal) Module Cooling and Module Cooling Effectiveness

When contemplating processor module cooling, the notion of maximum cooling capability is not simple or straight forward to estimate. There are a multitude of variables and constraints to consider; some more rigid or fixed than others. This paper proposes a theoretical maximum cooling capability predicated on the treatment of the module heat sink or cold plate as a heat exchanger with infinite conductive and convective behavior. The resulting theoretical minimum heat sink thermal resistance is a function of the bulk thermal transport of the fluid dependent only on the fluid’s density, specific heat (at constant pressure) and volumetric flow rate. An ideal module internal thermal resistance will also be defined. The sum of the two resistances constitutes the theoretical minimum total module thermal resistance and defines the ideal thermal performance of the module. Finally, a module cooling effectiveness relating the actual module thermal performance to the ideal thermal performance will defined. Examples of both air and water cooled modules will be given with discussion on the relevance and utility of this methodology.

THE INFLUENCE ON THE THERMAL RESISTANCE OF LED PACKAGING WITH DIFFERENT SUBMOUNT AND SURROUNDING CONDITIONS

A three-dimensional numerical model using the finite element method is proposed in the present study to accurately simulate the influences of the thermal resistance on the submount of an LED. In a system with adiabatic lateral boundaries, the internal thermal resistance of the submount is principally analyzed from the series connection effect of the spreading thermal resistance and one-dimensional material resistance. However, the total thermal resistance is used for analysis under various heat dissipating conditions due to the complex coupling relations among the material resistance, the spreading thermal resistance, and the external thermal resistance. A higher contact ratio between heat source and submount, a larger external convective effect, and dissipation of heat from the symmetrical axis of the submount will decrease the spreading thermal resistance.

Semi-Industrial Scale Preliminary Test of Silicon Thermal Reduction Lithium with Internal Thermal Resistance Furnace

With the development of vacuum technology and the demand of lithium increasing rapidly all over the world, vacuum thermal extraction lithium will be applied widely in future. A new internal thermal resistance furnace for lithium smelting was designed, which can be used for the thermal decomposition of Li2CO3 and reduction of Li2O. The production capacity is 7.5kg lithium per test. Semi-industrial scale preliminary test was researched in the internal thermal resistance furnace. The results show that the decomposition efficiency of lithium carbonate can be above 98%, the calcined product meets the requirement of reduction lithium. But the lithium reduction rate is 63.86%, which is below the reduction rate of basis experiment, so the design of crystallizer and technological process should be improved.

An Appropriate Design in Dimensions of Submount with Extra-Low Thermal Resistance for High Power LED

A numerical simulation model to obtain the extra-low internal thermal resistance for submount of LED is presented. The 3-D numerical model for calculating thermal resistance is demonstrated on examining the aspect ratio of submount, the contact ratio between chip and submount, and the surrounding condition. According to the analysis by accurate numerical simulations of heat transfer; the appropriate dimensions for different conditions of ambient are determined. The thickness of submount should be over a specially designated value. Besides, a higher contact ratio between heat source and submount, a larger external convective effect, and the heat dissipated from symmetry axis of submount will decrease the spreading thermal resistance.

Convection Calibration of Schmidt–Boelter Heat Flux Gauges in Stagnation and Shear Air Flow

Experiments were performed to characterize the performance of Schmidt–Boelter heat flux gauges in stagnation and shear convective air flows. The gauges were of a standard design (25.4 mm and 38 mm in diameter), using a copper heat sink with water cooling channels around the active sensing element. A simple model of the gauges using an internal thermal resistance between the sensor surface and the heat sink is used to interpret the results. The model predicts a nonlinear dependence of the gauge sensitivity as a function of the heat transfer coefficient. Experimental calibration systems were developed to simultaneously measure the heat flux gauge response relative to a secondary standard under the same flow and thermal conditions. The measured gauge sensitivities in the stagnation flow matched the model, and were used to estimate the value of the internal thermal resistance for each of the four gauges tested. For shear flow, the effect of the varying gauge surface temperature on the boundary layer was included. The results matched the model with a constant factor of 15–25% lower effective heat transfer coefficient. When the gauge was water cooled, the effect of the internal thermal resistance of the gauge was markedly different for the two flow conditions. In the stagnation flow, the internal resistance further decreased the apparent gauge sensitivity. Conversely, in shear flow, the resistance was effectively offset by the cooler heat sink of the gauge, and the resulting sensitivities were nearly the same as, or larger than, for radiation.