scholarly journals A Printed Circuit Board Design Project For A Switching Power Converter

2020 ◽  
Author(s):  
Christopher Root ◽  
Biswajit Ray
2004 ◽  
Vol 1 (2) ◽  
pp. 95-101
Author(s):  
Yu Xiaoling ◽  
Xiong Wei ◽  
Zhou Wei ◽  
Feng Quanke

In a hybrid integrated power electronic module (IPEM) for medium power converter, when packaged with power circuit closely, the driver & protection circuit is affected seriously by heat generated from power chips in the power circuit. Thermal simulation results of the module show that the thermal resistance between the power chip and the bottom surface of substrate is 0.24 °C/W. Experimental results reveal that the highest temperature on the driver & protection printed circuit board (PCB) is over 70 °C when the power chip temperature reaches 93 °C. Therefore, an air gap is sandwiched between the power circuit and the driver & protection PCB to insulate the heat transferred from the former to the latter. Measuring results show that the air gap weakens the thermal effect of power circuit on the driver & protection PCB, and the highest temperature on the PCB decreases while the thickness of air gap increases. If the thickness of air gap increases to certain value, the highest temperature on the driver & protection PCB can be controlled below 70 °C when the power chip temperature reaches 125 °C.


2012 ◽  
Vol 132 (6) ◽  
pp. 404-410 ◽  
Author(s):  
Kenichi Nakayama ◽  
Kenichi Kagoshima ◽  
Shigeki Takeda

2014 ◽  
Vol 5 (1) ◽  
pp. 737-741
Author(s):  
Alejandro Dueñas Jiménez ◽  
Francisco Jiménez Hernández

Because of the high volume of processing, transmission, and information storage, electronic systems presently requires faster clock speeds tosynchronizethe integrated circuits. Presently the “speeds” on the connections of a printed circuit board (PCB) are in the order of the GHz. At these frequencies the behavior of the interconnects are more like that of a transmission line, and hence distortion, delay, and phase shift- effects caused by phenomena like cross talk, ringing and over shot are present and may be undesirable for the performance of a circuit or system.Some of these phrases were extracted from the chapter eight of book “2-D Electromagnetic Simulation of Passive Microstrip Circuits” from the corresponding author of this paper.


Author(s):  
Prabjit Singh ◽  
Ying Yu ◽  
Robert E. Davis

Abstract A land-grid array connector, electrically connecting an array of plated contact pads on a ceramic substrate chip carrier to plated contact pads on a printed circuit board (PCB), failed in a year after assembly due to time-delayed fracture of multiple C-shaped spring connectors. The land-grid-array connectors analyzed had arrays of connectors consisting of gold on nickel plated Be-Cu C-shaped springs in compression that made electrical connections between the pads on the ceramic substrates and the PCBs. Metallography, fractography and surface analyses revealed the root cause of the C-spring connector fracture to be plating solutions trapped in deep grain boundary grooves etched into the C-spring connectors during the pre-plating cleaning operation. The stress necessary for the stress corrosion cracking mechanism was provided by the C-spring connectors, in the land-grid array, being compressed between the ceramic substrate and the printed circuit board.


Author(s):  
William Ng ◽  
Kevin Weaver ◽  
Zachary Gemmill ◽  
Herve Deslandes ◽  
Rudolf Schlangen

Abstract This paper demonstrates the use of a real time lock-in thermography (LIT) system to non-destructively characterize thermal events prior to the failing of an integrated circuit (IC) device. A case study using a packaged IC mounted on printed circuit board (PCB) is presented. The result validated the failing model by observing the thermal signature on the package. Subsequent analysis from the backside of the IC identified a hot spot in internal circuitry sensitive to varying value of external discrete component (inductor) on PCB.


Sign in / Sign up

Export Citation Format

Share Document