A low-profile power converter using printed-circuit board (PCB) power transformer with ferrite polymer composite

2001 ◽  
Vol 16 (4) ◽  
pp. 493-498 ◽  
Author(s):  
S.C. Tang ◽  
S.Y.R. Hui ◽  
H.S.-H. Chung
Keyword(s):  
Polymer Composite ◽  
Printed Circuit Board ◽  
Power Transformer ◽  
Power Converter ◽  
Circuit Board ◽  
Printed Circuit ◽  
Low Profile

scholarly journals Highly Compact Through-Wire Microstrip to Empty Substrate Integrated Coaxial Line Transition

2021 ◽  
Vol 11 (15) ◽  
pp. 6885
Author(s):  
Marcos D. Fernandez ◽  
José A. Ballesteros ◽  
Angel Belenguer
Keyword(s):  
Printed Circuit Board ◽  
Low Cost ◽  
Coaxial Line ◽  
Circuit Board ◽  
Central Layer ◽  
Printed Circuit ◽  
Integrated Technology ◽  
Low Profile ◽  
The Many ◽  
High Degree

Empty substrate integrated coaxial line (ESICL) technology preserves the many advantages of the substrate integrated technology waveguides, such as low cost, low profile, or integration in a printed circuit board (PCB); in addition, ESICL is non-dispersive and has low radiation. To date, only two transitions have been proposed in the literature that connect the ESICL to classical planar lines such as grounded coplanar and microstrip. In both transitions, the feeding planar lines and the ESICL are built in the same substrate layer and they are based on transformed structures in the planar line, which must be in the central layer of the ESICL. These transitions also combine a lot of metallized and non-metallized parts, which increases the complexity of the manufacturing process. In this work, a new through-wire microstrip-to-ESICL transition is proposed. The feeding lines and the ESICL are implemented in different layers, so that the height of the ESICL can be independently chosen. In addition, it is a highly compact transition that does not require a transformer and can be freely rotated in its plane. This simplicity provides a high degree of versatility in the design phase, where there are only four variables that control the performance of the transition.

Study of Thermal Effect of Power Circuit on Driver & Protection PCB in Hybrid IPEM

2004 ◽  
Vol 1 (2) ◽  
pp. 95-101
Author(s):  
Yu Xiaoling ◽  
Xiong Wei ◽  
Zhou Wei ◽  
Feng Quanke
Keyword(s):  
Thermal Effect ◽  
Printed Circuit Board ◽  
Power Converter ◽  
Air Gap ◽  
Circuit Board ◽  
Bottom Surface ◽  
Power Circuit ◽  
Printed Circuit ◽  
Chip Temperature ◽  
Protection Circuit

In a hybrid integrated power electronic module (IPEM) for medium power converter, when packaged with power circuit closely, the driver & protection circuit is affected seriously by heat generated from power chips in the power circuit. Thermal simulation results of the module show that the thermal resistance between the power chip and the bottom surface of substrate is 0.24 °C/W. Experimental results reveal that the highest temperature on the driver & protection printed circuit board (PCB) is over 70 °C when the power chip temperature reaches 93 °C. Therefore, an air gap is sandwiched between the power circuit and the driver & protection PCB to insulate the heat transferred from the former to the latter. Measuring results show that the air gap weakens the thermal effect of power circuit on the driver & protection PCB, and the highest temperature on the PCB decreases while the thickness of air gap increases. If the thickness of air gap increases to certain value, the highest temperature on the driver & protection PCB can be controlled below 70 °C when the power chip temperature reaches 125 °C.

scholarly journals Miniaturized Printed Inverted-F Antenna for Internet of Things: A Design on PCB with a Meandering Line and Shorting Strip

2018 ◽  
Vol 2018 ◽  
pp. 1-5 ◽  
Author(s):  
Cheuk Yin Cheung ◽  
Joseph S. M. Yuen ◽  
Steve W. Y. Mung
Keyword(s):  
Internet Of Things ◽  
Printed Circuit Board ◽  
Low Cost ◽  
Circuit Board ◽  
Ism Band ◽  
Printed Circuit ◽  
Iot Applications ◽  
Low Profile ◽  
Measurement Results

This paper focuses on a printed inverted-F antenna (PIFA) with meandering line and meandering shorting strip under 2.4 GHz industrial, scientific, and medical (ISM) band for Internet of things (IoT) applications. Bluetooth Low Energy (BLE) technology is one of potential platforms and technologies for IoT applications under ISM band. Printed circuit board (PCB) antenna commonly used in commercial and medical applications because of its small size, low profile, and low cost compared to low temperature cofired ceramic (LTCC) technology. The proposed structure of PIFA is implemented on PCB to gain all these advantages. Replacing conventional PCB line in PIFA by the meandering line and meandering shorting strip improves the efficiency of the PIFA as well as the bandwidth. As a case study, design and measurement results of the proposed PIFA are presented.

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