Transient Enhanced Diffusion of Arsenic by Self-Implantation —The role of As-I clusters—

2000 ◽  
Vol 610 ◽  
Author(s):  
Ryangsu Kim ◽  
Takenori Aoki ◽  
Yoshikazu Furuta ◽  
Hiroyuki Kobyashi ◽  
Jianxin Xia ◽  
...  

AbstractTransient enhanced diffusion of implanted arsenic in silicon with/without additional self-implantation has been investigated. The experimental results show the suppression of As diffusion with Si self-implantation during initial stage of annealing in contrast to the prediction of conventional models. The results suggest that the arsenic and self-interstitial atoms might form immobile clusters during Si implantation or initial stage of annealing. After the clusters dissolve for further annealing, the transient enhanced diffusion of As increases with silicon implantation dose as expected from the “+1” model. These results clarify that interstitials/ As-I clusters play a major role in transient arsenic diffusion.

2004 ◽  
Vol 810 ◽  
Author(s):  
A. Halimaoui ◽  
J. M. Hartmann ◽  
C. Laviron ◽  
R. El-Farhane ◽  
F. Laugier

ABSTRACTPreviously published articles have shown that co-implanted fluorine reduces transient enhanced diffusion of boron. However, it is not yet elucidated whether this effect is due to interaction of fluorine with point-defects or boron atoms. In this work, we have used boron redistribution in a shallow Delta-doped Si structures in order to get some insights into the role of fluorine in the boron diffusion. The structures consisted of 3 boron-doped layers separated by 40nm-thick undoped silicon. The samples were given to Ge preamorphization and F co-implant. SIMS depth profiling was used to analyse boron redistribution after annealing. The results we obtained strongly suggest that fluorine is not interacting with point-defects. The reduction in boron TED is most probably due to boron-fluorine interaction.


2000 ◽  
Vol 76 (7) ◽  
pp. 855-857 ◽  
Author(s):  
G. Mannino ◽  
N. E. B. Cowern ◽  
F. Roozeboom ◽  
J. G. M. van Berkum

1994 ◽  
Vol 354 ◽  
Author(s):  
Atsuki ONO ◽  
Hitoshi ABIKO ◽  
Isarai SAKAI

AbstractSIMS measurements revealed that high energy boron-implantation causes transient enhanced diffusion (TED) of a shallow dopant profile due to Si interstitials even for a relatively low dose of ∼2E13cm-2. By systematic analysis, it is found that this anomalous diffusion is most significant in 700∼800°C annealing, and it takes place in the initial stage (less than 30sec for 800°C) of annealing. Moreover, this anomalous diffusion is more considerable than the enhanced diffusion during oxidation (OED) in practical device fabrication processes. It is found that rapid thermal annealing (RTA) at 1000-1100°C is effective for suppressing the transient enhanced diffusion and realizing a shallow channel profile for deep sub-micron devices.


2008 ◽  
Vol 103 (10) ◽  
pp. 103525
Author(s):  
Luis Felipe Giles ◽  
Chris Stapelmann ◽  
Hans Cerva ◽  
Franz Jahnel ◽  
Caroline Demeurisse ◽  
...  

Author(s):  
C. Bonafos ◽  
A. Martinez ◽  
M.M. Faye ◽  
C. Bergaud ◽  
D. Mathiot ◽  
...  

1996 ◽  
Vol 438 ◽  
Author(s):  
A. Claverie ◽  
C. Bonafos ◽  
M. Omri ◽  
B. De Mauduit ◽  
G. Ben Assayag ◽  
...  

AbstractTransient Enhanced Diffusion (TED) of dopants in Si is the consequence of the evolution, upon annealing, of a large supersaturation of Si self-interstitial atoms left after ion bombardment. In the case of amorphizing implants, this supersaturation is located just beneath the c/a interface and evolves through the nucleation and growth of End-Of-Range (EOR) defects.For this reason, we discuss here the relation between TED and EOR defects. Modelling of the behavior of these defects upon annealing allows one to understand why and how they affect dopant diffusion. This is possible through the development of the Ostwald ripening theory applied to extrinsic dislocation loops. This theory is shown to be readily able to quantitatively describe the evolution of the defect population (density, size) upon annealing and gives access to the variations of the mean supersaturation of Si self-interstitial atoms between the loops and responsible for TED. This initial supersaturation is, before annealing, at least 5 decades larger than the equilibrium value and exponentially decays with time upon annealing with activation energies that are the same than the ones observed for TED. It is shown that this time decay is precisely at the origin of the transient enhancement of boron diffusivity through the interstitial component of boron diffusion. Side experiments shed light on the effect of the proximity of a free surface on the thermal behavior of EOR defects and allow us to quantitatively describe the space and time evolutions of boron diffusivity upon annealing of preamorphised Si layers.


1999 ◽  
Vol 568 ◽  
Author(s):  
D. Stiebel ◽  
P. Pichler ◽  
H. Ryssel

ABSTRACTWe present new experimental results on the transient enhanced diffusion (TED) of boron after ion implantation. The investigation is focussed on effects that influence TED of shallow profiles in the absence of {311}-defects. Under these conditions, TED is mainly determined by the formation of boron-interstitial complexes (BIC). In addition, effects from the proximity of the surface become more and more important. Insight into the behavior of the dopant atoms is obtained by the comparison with simulations.


1995 ◽  
Vol 67 (16) ◽  
pp. 2302-2304 ◽  
Author(s):  
D. R. Lim ◽  
C. S. Rafferty ◽  
F. P. Klemens

2004 ◽  
Vol 84 (11) ◽  
pp. 1862-1864 ◽  
Author(s):  
G. Impellizzeri ◽  
J. H. R. dos Santos ◽  
S. Mirabella ◽  
F. Priolo ◽  
E. Napolitani ◽  
...  

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