Ion Projection Lithography for Nano Patterning

1999 ◽  
Vol 584 ◽  
Author(s):  
A. Heuberger ◽  
W. Bruenger
Keyword(s):  
Continuous Improvement ◽  
Magnetic Films ◽  
Magnetic Storage ◽  
Flow Process ◽  
Patterned Media ◽  
Projection Lithography ◽  
Stencil Mask ◽  
Fraunhofer Institute ◽  
Ion Projection Lithography ◽  
Nano Patterning

AbstractAs a result of continuous improvement of the resist process, the experimental ion projector in the Fraunhofer Institute in Berlin (manufactured by Ion Microfabrication Systems, IMS, Vienna) has been able to print 75 nm lines and spaces into 180 nm thick standard DUV resist UV II HS without pattern collapse. A new wafer flow process for more reliable open stencil mask making was developed by IMS –Chips, Stuttgart (Germany), based on SOT wafers. Resistless direct surface modification by He and Xe ions has been tested on metallic and magnetic films in the Berlin projector. This method opens up a new possibility for the production of patterned media for future magnetic storage disks.

Ion projection lithography for resistless patterning of thin magnetic films

2000 ◽  
Vol 53 (1-4) ◽  
pp. 605-608 ◽  
Author(s):  
W.H. Bruenger ◽  
M. Torkler ◽  
C. Dzionk ◽  
B.D. Terris ◽  
L. Folks ◽  
...  
Keyword(s):  
Magnetic Films ◽  
Projection Lithography ◽  
Thin Magnetic Films ◽  
Ion Projection Lithography

Advances in stencil mask technology: control of distortion in ion-projection lithography masks

1995 ◽  
Author(s):  
John C. Wolfe ◽  
Alex R. Shimkunas ◽  
John Melngailis ◽  
Hans Loeschner ◽  
Robert D. Mohondro ◽  
...  
Keyword(s):  
Projection Lithography ◽  
Stencil Mask ◽  
Ion Projection Lithography ◽  
Technology Control

Status of Ion Projection Lithography

2000 ◽  
Vol 636 ◽  
Author(s):  
Wilhelm H. Bruenger ◽  
Rainer Kaesmaier ◽  
Hans Loeschner ◽  
Reinhard Springer
Keyword(s):  
Process Development ◽  
Ion Beam ◽  
Magnetic Films ◽  
Exposure Dose ◽  
Storage Devices ◽  
Projection Lithography ◽  
Thin Magnetic Films ◽  
Ion Projection Lithography ◽  
The Moment ◽  
Ion Optical System

AbstractAs part of the European MEDEA project on Ion Projection Lithography (IPL), headed by Infineon Techologies, a process development tool (PDT) has been assembled at IMS, Vienna, with the final target of 50 nm resolution in a 12.5 mm exposure field at 4× demagnification. The ion-optical system (PDT-IOS) has been integrated, including the LEICA mask changer and a sophisticated metrology stage with in-situ diagnostics. In parallel, the LEICA wafer stage and the vacuum compatible off-axis ASML wafer alignment system have been realized. At the moment (Nov00) the He+ ion beam is aligned until the mask level. Ion beam proximity wafer exposures directly behind the mask show a performance of the illumination optics as predicted. 150 mm stencil masks with 125mm diameter, 3μm Si membranes, 50mm × 50mm design field, have been produced by IMS-Chips, Stuttgart. There is expectation to start the PDT-IOS test phase in Q1/01. Using the experimental ion projector at the Fraunhofer-Institute ISiT in Berlin recent resolution tests have demonstrated 50 nm lines and spaces without proximity effect in standard Shipley DUV resist UVIIHS at an exposure dose of 0.5 μC/cm2 for 75 keV He+ions. This was accomplished by 8.5 × demagnification of a new generation of stencil test masks from IMSChips. One further promising application of IPL is the resistless structuring of thin magnetic films to produce magnetic nano dots for future ≥ 100 G bit/in2 storage devices. A consortium of IBM Germany - Speichersysteme Mainz, Fraunhofer-ISiT, LEICA Jena and IMS-Chips in cooperation with IMS-Vienna has been formed to evaluate this technology.

Analysis of stencil mask distortion in ion projection lithography

1997 ◽  
Vol 35 (1-4) ◽  
pp. 443-446 ◽  
Author(s):  
L. Didenko ◽  
J. Melngailis ◽  
H. Löschner ◽  
G. Stengl ◽  
A. Chalupka ◽  
...  
Keyword(s):  
Projection Lithography ◽  
Stencil Mask ◽  
Ion Projection Lithography

Wafer stage assembly for ion projection lithography

2001 ◽  
Vol 57-58 ◽  
pp. 181-185 ◽  
Author(s):  
Christoph Damm ◽  
Thomas Peschel ◽  
Stephan Risse ◽  
Ulf C. Kirschstein
Keyword(s):  
Projection Lithography ◽  
Ion Projection Lithography

Resist technologies for ion projection lithography (IPL) stencil maskmaking

2000 ◽  
Author(s):  
Mathias Irmscher ◽  
Joerg Butschke ◽  
Klaus Elian ◽  
Bernd Hoefflinger ◽  
Karl Kragler ◽  
...  
Keyword(s):  
Projection Lithography ◽  
Ion Projection Lithography

Reference plate manufacturing process for the ion projection lithography pattern lock system

2001 ◽  
Vol 57-58 ◽  
pp. 213-218
Author(s):  
F. Letzkus ◽  
J. Butschke ◽  
M. Irmscher ◽  
C. Reuter ◽  
R. Springer ◽  
...  
Keyword(s):  
Manufacturing Process ◽  
Projection Lithography ◽  
Ion Projection Lithography ◽  
Reference Plate

A Magnetic Rotary Encoder for Patterned Media Lithography

2014 ◽  
Author(s):  
Shaomin Xiong ◽  
Yuan Wang ◽  
Xiang Zhang ◽  
David Bogy
Keyword(s):  
High Speed ◽  
New Technology ◽  
Hard Disk Drives ◽  
Magnetic Storage ◽  
Magnetic Islands ◽  
Bit Patterned Media ◽  
Patterned Media ◽  
Rotary Encoder ◽  
Digital Format ◽  
Field Programmable

Bit patterned media (BPM) is expected to enable the magnetic storage density in hard disk drives (HDDs) beyond 1 Tb/in2. BPM uses isolated magnetic islands to record the data information. However, the large volume fabrication of those patterned media disks at an affordable cost is a challenge for this new technology. A master template is the first step for patterned media fabrication. Using nano-imprint technology, the master template can be replicated to tens of thousands of pattern disks. A rotary electron beam lithography machine or plasmonic nanolithography machine is recommended to assist in the fabrication of the master template. In both systems, a high resolution encoder system for positioning in the rotary lithography machine is necessary. In this paper, a magnetic rotary encoder system is introduced. The encoder system can be operated at several thousand revolution per minute (RPM). The scale pitch is 90 nm which is one to two orders smaller than current optical encoders. The resolution is about 2.8 million counts per revolution (CPR). A flying magnetic head is used to retrieve the readback signal from the magnetic encoders. A field programmable gate array (FPGA) is implemented to finish the high speed signal processing and provide a digital format encoder signal to trigger the lithography machine at a rate of several Mega Hertz.

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