Advances in stencil mask technology: control of distortion in ion-projection lithography masks

1995 ◽  
Author(s):  
John C. Wolfe ◽  
Alex R. Shimkunas ◽  
John Melngailis ◽  
Hans Loeschner ◽  
Robert D. Mohondro ◽  
...  
1999 ◽  
Vol 584 ◽  
Author(s):  
A. Heuberger ◽  
W. Bruenger

AbstractAs a result of continuous improvement of the resist process, the experimental ion projector in the Fraunhofer Institute in Berlin (manufactured by Ion Microfabrication Systems, IMS, Vienna) has been able to print 75 nm lines and spaces into 180 nm thick standard DUV resist UV II HS without pattern collapse. A new wafer flow process for more reliable open stencil mask making was developed by IMS –Chips, Stuttgart (Germany), based on SOT wafers. Resistless direct surface modification by He and Xe ions has been tested on metallic and magnetic films in the Berlin projector. This method opens up a new possibility for the production of patterned media for future magnetic storage disks.


1997 ◽  
Vol 35 (1-4) ◽  
pp. 443-446 ◽  
Author(s):  
L. Didenko ◽  
J. Melngailis ◽  
H. Löschner ◽  
G. Stengl ◽  
A. Chalupka ◽  
...  

2000 ◽  
Vol 53 (1-4) ◽  
pp. 605-608 ◽  
Author(s):  
W.H. Bruenger ◽  
M. Torkler ◽  
C. Dzionk ◽  
B.D. Terris ◽  
L. Folks ◽  
...  

2001 ◽  
Vol 57-58 ◽  
pp. 181-185 ◽  
Author(s):  
Christoph Damm ◽  
Thomas Peschel ◽  
Stephan Risse ◽  
Ulf C. Kirschstein

2000 ◽  
Author(s):  
Mathias Irmscher ◽  
Joerg Butschke ◽  
Klaus Elian ◽  
Bernd Hoefflinger ◽  
Karl Kragler ◽  
...  

2001 ◽  
Vol 57-58 ◽  
pp. 213-218
Author(s):  
F. Letzkus ◽  
J. Butschke ◽  
M. Irmscher ◽  
C. Reuter ◽  
R. Springer ◽  
...  

1986 ◽  
Vol 5 (1-4) ◽  
pp. 193-200 ◽  
Author(s):  
R. Fischer ◽  
E. Hammel ◽  
H. Löschner ◽  
G. Stengl ◽  
P. Wolf ◽  
...  

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