scholarly journals Photoluminescence between 3.36 eV and 3.41 eV from GaN Epitaxial Layers

1999 ◽  
Vol 572 ◽  
Author(s):  
R. Seitz ◽  
C. Gaspar ◽  
T. Monteiro ◽  
E. Pereira ◽  
M. A. Poisson ◽  
...  
Keyword(s):  
Optical Properties ◽  
High Temperature ◽  
Electronic Devices ◽  
Basic Material ◽  
Epitaxial Layers ◽  
Important Place ◽  
Impurity Defects ◽  
High Temperature Electronic

GaN, its alloys, QWs and MQWs have gained an important place among shortwavelength optical emitters and high temperature electronic devices [1,2]. The performance of such devices is limited by the presence of native and impurity defects. The understanding of the optical properties of the basic material allows us to improve its quality and thus increase the performance of these materials.

scholarly journals Al2O3-Based a-IGZO Schottky Diodes for Temperature Sensing

Sensors ◽  
2019 ◽  
Vol 19 (2) ◽  
pp. 224 ◽  
Author(s):  
Qianqian Guo ◽  
Fei Lu ◽  
Qiulin Tan ◽  
Tianhao Zhou ◽  
Jijun Xiong ◽  
...  
Keyword(s):  
High Temperature ◽  
Schottky Diodes ◽  
Electronic Devices ◽  
Harsh Environments ◽  
Indium Gallium Zinc Oxide ◽  
Testing Methods ◽  
Forward Current ◽  
Indium Gallium ◽  
The Relationship ◽  
High Temperature Electronic

High-temperature electronic devices and sensors that operate in harsh environments, especially high-temperature environments, have attracted widespread attention. An Al2O3 based a-IGZO (amorphous indium-gallium-zinc-oxide) Schottky diode sensor is proposed. The diodes are tested at 21–400 °C, and the design and fabrication process of the Schottky diodes and the testing methods are introduced. Herein, a series of factors influencing diode performance are studied to obtain the relationship between diode ideal factor n, the barrier height ФB, and temperature. The sensitivity of the diode sensors is 0.81 mV/°C, 1.37 mV/°C, and 1.59 mV/°C when the forward current density of the diode is 1 × 10−5 A/cm2, 1 × 10−4 A/cm2, and 1 × 10−3 A/cm2, respectively.

scholarly journals High-temperature electronic devices enabled by hBN-encapsulated graphene

2019 ◽  
Vol 114 (12) ◽  
pp. 123104 ◽  
Author(s):  
Makars Šiškins ◽  
Ciaran Mullan ◽  
Seok-Kyun Son ◽  
Jun Yin ◽  
Kenji Watanabe ◽  
...  
Keyword(s):  
High Temperature ◽  
Electronic Devices ◽  
High Temperature Electronic

DIP Test Socket Characterization for 300°C

2013 ◽  
Vol 2013 (HITEN) ◽  
pp. 000213-000219 ◽  
Author(s):  
David Shaddock ◽  
Liang Yin ◽  
Zhenzhen Shen ◽  
Zhangming Zhou ◽  
R. Wayne Johnson
Keyword(s):  
High Temperature ◽  
Electronic Devices ◽  
Circuit Board ◽  
Test Fixture ◽  
Prototype Test ◽  
Test Board ◽  
Functional Reliability ◽  
Long Lifetime ◽  
High Temperature Electronic ◽  
Dip Test

Demonstrating functional reliability testing of high temperature electronic devices for long lifetime at 300°C requires electrical test fixtures with even better reliability. Advances in complexity of SiC devices and the need for increased accelerated tests motivate the need for a reliable test fixture at high temperature. The design, fabrication and testing of a prototype test board using commercially available materials shows stability beyond 2000 hours. The approach uses an alumina circuit board with thick film conductors interconnecting an array of BeNi contacts to surface pads. The pads are connected to high temperature wires using spring loaded contacts so that the circuit board may be removed.

scholarly journals Transitioning of Steel Producers to the Steelworks 4.0 –Literature Review with Case Studies

Energies ◽  
2021 ◽  
Vol 14 (14) ◽  
pp. 4109
Author(s):  
Bożena Gajdzik ◽  
Radosław Wolniak
Keyword(s):  
Literature Review ◽  
Case Studies ◽  
Steel Industry ◽  
Industry 4.0 ◽  
Strong Dependence ◽  
Industrial Robots ◽  
Basic Material ◽  
Sources Of Information ◽  
Important Place ◽  
Steel Mills

The publication presents a picture of modern steelworks that is evolving from steelworks 3.0 to steelworks 4.0. The paper was created on the basis of secondary sources of information (desk research). The entire publication concerns the emerging opportunities for the development of the steel producers to Industry 4.0 and the changes already implemented in the steel plants. The collected information shows the support environment for changes in the steel sector (EU programs), the levels of evolution of steel mills, along with the areas of change in the steel industry and implemented investment projects. The work consists of a theoretical part based on a literature review and a practical part based on case studies. The work ends with a discussion in which the staged and segmented nature of the changes introduced in the analyzed sector is emphasized. Based on the three case studies described in the paper, a comparative analysis was conducted between them. When we tried to compare methods used in the three analyzed steel producers (capital groups): ArcelorMittal, Thyssenkrupp, and Tata Steel Group, it can be seen that in all organizations, the main problem connected with steelworks 4.0 transition is the digitalization of all processes within an organization and in the entire supply chain. This is realized using various tools and methods but they are concentrated on using technologies and methods such as artificial intelligence, drones, virtual reality, full automatization, and industrial robots. The effects are connected to better relations with customers, which leads to an increase in customer satisfaction and the organizations’ profit. The steel industry will undergo further strong changes, bringing it closer to Industry 4.0 because it occupies an important place in the economies of many countries due to the strong dependence of steel producers on the markets of the recipients (steel consumers). Steel is the basic material needed to make many products, and its properties have been valued for centuries. In addition, steel mills with positive economic, social, and environmental aspects are part of the concept of sustainability for industries and economies.

scholarly journals Temperature dependence of hardness prediction for high-temperature structural ceramics and their composites

2021 ◽  
Vol 10 (1) ◽  
pp. 586-595
Author(s):  
Ruzhuan Wang ◽  
Dingyu Li ◽  
Weiguo Li
Keyword(s):  
High Temperature ◽  
Temperature Dependence ◽  
Material Design ◽  
Theoretical Models ◽  
Ceramic Composites ◽  
Basic Material ◽  
Experimental Measurements ◽  
Control Mechanisms ◽  
Oxide Ceramics ◽  
Structural Ceramics

Abstract Hardness is one of the important mechanical properties of high-temperature structural ceramics and their composites. In spite of the extensive use of the materials in high-temperature applications, there are few theoretical models for analyzing their temperature-dependent hardness. To fill this gap in the available literature, this work is focused on developing novel theoretical models for the temperature dependence of the hardness of the ceramics and their composites. The proposed model is just expressed in terms of some basic material parameters including Young’s modulus, melting points, and critical damage size corresponding to plastic deformation, which has no fitting parameters, thereby being simple for materials scientists and engineers to use in the material design. The model predictions for the temperature dependence of hardness of some oxide ceramics, non-oxide ceramics, ceramic–ceramic composites, diamond–ceramic composites, and ceramic-based cermet are presented, and excellent agreements with the experimental measurements are shown. Compared with the experimental measurements, the developed model can effectively save the cost when applied in the material design, which could be used to predict at any targeted temperature. Furthermore, the models could be used to determine the underlying control mechanisms of the temperature dependence of the hardness of the materials.

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