Application of Thin-Film Micromachining for Large-Area Substrates
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AbstractSurface micromachining is used with amorphous silicon, microcrystalline silicon, silicon nitride and aluminum films as structural materials to form bridge and cantilever structures. Low temperature processing (between 110 and 250 °C) allowed fabrication of structures and devices on glass substrates. Two processes involving different materials as the sacrificial layer are presented: silicon nitride and photoresist. The mechanical integrity of the fabricated structures is discussed. As examples of possible device applications of this technology, air-gap thin film transistors and the electrostatic actuation of bridges and cantilevers are presented.
2001 ◽
Vol 15
(17n19)
◽
pp. 667-670
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1987 ◽
Vol 97-98
◽
pp. 903-906
◽
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