Microstructural Defects of Device Quality Hot-Wire Cvd Poly-Silicon Films

1999 ◽  
Vol 557 ◽  
Author(s):  
J.K. Rath ◽  
F.D. Tichelaar ◽  
R.E.I. Schropp

AbstractTwo types of poly-Si:H thin films made by Hot Wire CVD have been evaluated with respect to utilisation in solar cells. Poly-Si:H films made at high hydrogen dilution are highly porous and have large interconnected voids. The void density is 25000/μm-3 as determined by XTEM. On the other hand, poly-Si:H layers made at low hydrogen dilution have a compact structure and a much smaller density of voids. In these films, two types of voids exist: globular voids smaller than 15 nm, and elongated voids, often located between columns of large crystals of 150-250 nm wide at the top. The density for the 5 - 15 nm spherical voids is usually -50/μm3, but larger concentrations often occur locally, up to 1000/pm3, i.e., 0.05% volume fraction. High oxygen content in the poly-Si films made at high hydrogen dilution is largely due to post deposition intrusion of water vapour through the interconnected voids. Profiled layers are made by depositing device quality poly-Si:H layers (low hydrogen dilution) on top of a seed layer (high hydrogen dilution) of high nucleation density. Cells incorporating profiled poly-Si:H films as i-layers at a deposition rate of 0.5 nm/s were made on stainless steel substrates in the configuration SS/n-μc-Si:H(PECVD)/i-poly-Si:H(HWCVD)/p-μc-Si:H(PECVD)/ITO. For our n-i-p solar cell with poly-Si i-layer we obtained an efficiency of 4.41% and a FF of 0.607. Due to native surface texture a current density of 19.95 mA/cm2 is generated in only ~1.22 μm thick i-layer without back reflector.

1998 ◽  
Vol 507 ◽  
Author(s):  
J.K. Rath ◽  
F.D. Tichelaar ◽  
H. Meiling ◽  
R.E.I. Schropp

ABSTRACTSolar cell using profiled poly-Si:H by HWCVD as i-layer in the configuration SS/n-µSi:H(PECVD)/i-poly-Si:H(HWCVD)/p-µc-Si:H(PECVD)/ITO showed 3.7% efficiency. A current of 23.6 mA/cm2 was generated in only 1.5 µm thick poly-Si:H i-layer grown at ∼5Å/s. TFTs made with the poly-Si:H films (grown at ≥ 9Å/s) exhibited remarkable stability to long duration of 23 hours of gate bias stress of ∼lMV/cm. A saturation mobility of 1.5 cm2/Vs for the TFT has been achieved. Films made at low hydrogen dilution (Poly2) showed device quality (purely intrinsic nature, ambipolar diffusion length of 568 nm, only (220) oriented growth and low ESR defect density of <1017/cm3with complete absence of signal due to conduction electrons) but with an incubation phase of amorphous initial growth, whereas the films made at high hydrogen dilution (Polyl) had a polycrystalline initial growth, though with higher defect density, incorporated oxygen and randomly oriented grains. Poly2 films are compact and hydrogen bonding is at compact Si-H sites manifested as 2000 cm−1IR vibration and high temperature hydrogen evolution peak. Exchange interaction of spins and spin pairing are observed while increasing defects in such a compact structure. A new approach has been used to integrate these two regimes of growth to make profiled poly-Si:H layers. The new layers show good electronic properties as well as complete elimination of incubation phase.


2005 ◽  
Vol 862 ◽  
Author(s):  
Xuejun Niu ◽  
Jeremy Booher ◽  
Vikram L. Dalal

AbstractNanocrystalline Ge and its alloys with C are potentially useful materials for solar cells, thin film transistors and image sensors. In this paper, we discuss the growth and properties of these materials using remote, low pressure ECR plasma deposition. The materials and devices were grown from mixtures of germane, methane and hydrogen. It was found that high hydrogen dilutions (>40:1) were needed to crystallize the films. Studies of x-ray spectra revealed that the grains were primarily <220> oriented. The grain size was a strong function of hydrogen dilution and growth temperature. Higher growth temperatures resulted in larger grain size. High hydrogen dilution tended to reduce grain size. These results can be explained by recognizing that excessive amounts of bonded H can inhibit the growth of <220> grain, which is the thermodynamically favorable direction for grain growth. Grain sizes as large as 80 nm were obtained in nc-Ge. Addition of C reduced the crystallinity. Mobility and carrier concentrations in nc-Ge were measured using Hall effect. Mobility values of ˜5cm2/V-sand carrier concentrations of ˜1x1016/cm3were obtained in larger grains. p+nn+ devices were fabricated on stainless steel substrates and compared with similar devices deposited in nc-Si:H. It was found that the voltage decreased and current increased in nc-Ge devices, in comparison with devices in nc-Si:H. Addition of C to Ge devices increased the open circuit voltage and shifted the quantum efficiency to larger photon energies, as expected.


2002 ◽  
Vol 715 ◽  
Author(s):  
R. E. I. Schropp ◽  
Y. Xu ◽  
E. Iwaniczko ◽  
G. A. Zaharias ◽  
A. H. Mahan

AbstractWe have explored which deposition parameters in Hot Wire CVD have the largest impact on the quality of microcrystalline silicon (μc-Si) made at deposition rates (Rd) < 10 Å/s for use in thin film solar cells. Among all parameters, the filament temperature (Tfil) appears to be crucial for making device quality films. Using two filaments and a filament-substrate spacing of 3.2 cm, μc-Si films, using seed layers, can be deposited at high Tfil (∼2000°C) with a crystalline volume fraction < 70-80 % at Rd's < 30 Å/s. Although the photoresponse of these layers is high (< 100), they appear not to be suitable for incorporation into solar cells, due to their porous nature. n-i-p cells fabricated on stainless steel with these i-layers suffer from large resistive effects or barriers, most likely due to the oxidation of interconnected pores in the silicon layer. The porosity is evident from FTIR measurements showing a large oxygen concentration at ∼1050 cm-1, and is correlated with the 2100 cm-1 signature of most of the Si-H stretching bonds. Using a Tfil of 1750°C, however, the films are more compact, as seen from the absence of the 2100 cm-1 SiH mode and the disappearance of the FTIR Si-O signal, while the high crystalline volume fraction (< 70-80 %) is maintained. Using this Tfil and a substrate temperature of 400°C, we obtain an efficiency of 4.9 % for cells with a Ag/ZnO back reflector, with an i-layer thickness of only ∼0.7 μm. High values for the quantum efficiency extend to very long wavelengths, with values of 33 % at 800 nm and 15 % at 900 nm, which are unequalled by a-SiGe:H alloys. Further, by varying the substrate temperature to enable deposition near the microcrystalline to amorphous transition (‘edge’) and incorporating variations in H2 dilution during deposition of the bulk, efficiencies of 6.0 % have been obtained. The Rd's of these i-layers are 8-10 Å/s, and are the highest to date obtained with HWCVD for microcrystalline layers used in cells with efficiencies of ∼6 %.


2000 ◽  
Vol 609 ◽  
Author(s):  
Norimitsu Yoshida ◽  
Takashi Itoh ◽  
Hiroki Inouchi ◽  
Hidekuni Harada ◽  
Katsuhiko Inagaki ◽  
...  

ABSTRACTHigher crystalline Si volume fractions in hydrogenated microcrystalline silicon ( µc-Si:H) films have been achieved by the hot-wire assisted plasma enhanced chemical vapor deposition (HWA-PECVD) method compared with those in films by conventional PECVD. µc-Si:H films can also be prepared by HWA-PECVD under typical conditions used for preparing hydrogenated amorphous silicon (a-Si:H) films by PECVD, in which the hydrogen-dilution ratio (H2 / SiH4) is ∼ 10. The hot wire seems to produce hydrogen radicals. As a result, the HWA- PECVD method can control hydrogen-radical densities in the RF plasma, and this method can also control the ratio of hydrogen coverage at the surface of the film.


1995 ◽  
Vol 377 ◽  
Author(s):  
A. R. Middya ◽  
A. Lloret ◽  
J. Perrin ◽  
J. Huc ◽  
J. L. Moncel ◽  
...  

ABSTRACTPolycrystalline silicon thin films have been deposited at fast growth rates (50 Å/s) by hotwire chemical vapour deposition (HW-CVD) from SiH4/H2 gas mixtures at low substrate temperature (400–500°C). The surface morphology of these films consists of 0.5 – 2.0μm dendritic grains as seen by electron microscopy. The films have a columnar morphology with grains starting from the substrate either on glass or c-Si. Even the 150 nm thick initial layer is polycrystalline. The preferential crystalline orientation of the poly-Si film is apparently not governed by the radiative source but strongly depends on the type and orientation of the substrate. A strong hydrogen dilution (>90%) of silane is essential to obtain poly-Si films with optimal crystalline structure.


2000 ◽  
Vol 609 ◽  
Author(s):  
M. Birkholz ◽  
E. Conrad ◽  
K. Lips ◽  
B. Selle ◽  
I. Sieber ◽  
...  

ABSTRACTThe preparation of μc-Si films from SiH4-H2 mixtures by electron-cyclotron resonance (ECR) CVD at deposition temperatures ≤ 400°C on foreign substrates is reported. Deposition conditions were identified for which Si films with a high degree of crystallinity were grown as was confirmed by Raman spectroscopy. A factorial analysis was carried out, for which the influence of deposition temperature, microwave power, hydrogen dilution and total pressure on film growth were investigated. Samples of optimized crystallinity were prepared in a lowpressure and high-hydrogen dilution regime. In-plane grain sizes were measured by TEM and found to be on the order of 10 - 12 nm. Next to the optimization of crystallinity several sources of impurity contamination during film deposition were identified and eliminated. Intrinsic μc-Si layers could be prepared under these conditions that exhibited a dark conductivity σd of 2 × 10-7 S/cm and photosensitivity σph/σd of 150. It is concluded that ECR CVD is capable of producing intrinsic layers with electronic properties as necessary for use in state-of-the-art n-i-p μc-Si solar cells.


2007 ◽  
Vol 989 ◽  
Author(s):  
Kamal Muthukrishnan ◽  
Vikram Dalal ◽  
Max Noack

AbstractWe report on the growth and properties of nanocrystalline Si:H grown using a remote hot wire deposition system. Unlike previous results, the temperature of the substrate is not significantly affected by the hot filament in our system. The crystallinity of the growing film and the type of grain structure was systematically varied by changing the filament temperature and the degree of hydrogen dilution. It was found that high hydrogen dilution gave rise to random nucleation and <111> grain growth, whereas lower hydrogen dilution led to preferable growth of <220> grains. Similarly, a high filament temperature gave rise to preferential <111> growth compared to lower filament temperature. The electronic properties such as defect density and minority carrier diffusion length were studied as a function of the degree of crystallinity. It was found that the lowest defect density was obtained for a material which had an intermediate range of crystallnity, as determined from the Raman spectrum. Both highly amorphous and highly crystalline materials gave higher defect densities. The diffusion lengths were measured using a quantum efficiency technique, and were found to be the highest for the mid-range crystalline material. The results suggest that having an amorphous tissue surrounding the crystalline grain helps in passivating the grain boundaries.


1998 ◽  
Vol 507 ◽  
Author(s):  
J.P. Conde ◽  
H. Silva ◽  
V. Chu

ABSTRACTBottom-gate thin film transistors (TFT) were fabricated with amorphous and microcrystalline silicon active layers deposited by hot-wire (HW) chemical vapor deposition using different levels of hydrogen dilution. As the hydrogen dilution was increased above 80%, the active layer made a transition from amorphous to microcrystalline. This transition resulted in an increase of the TFT off-current and in an increase of the TFT subthreshold slope. The TFT on- current and the TFT mobility remained at levels comparable to those of the a-Si:H HW TFTs. A comparison is made between TFTs with amorphous and microcrystalline silicon active layers prepared both by rf glow discharge and HW. HW TFTs with an active layer consisting of a thin layer deposited with high hydrogen dilution underlying a thicker amorphous silicon layer are also compared to TFTs with an active layer of the same total active layer thickness consisting only of the high hydrogen dilution film.


2004 ◽  
Vol 808 ◽  
Author(s):  
Markus Kupich ◽  
Dmitry Grunsky ◽  
Bernd Hofferberth ◽  
Bernd Schröder

ABSTRACTRecently, hot-wire deposited microcrystalline silicon has attracted increasing attention. The use of hot-wire deposited intrinsic μc-Si:H for high efficiency solar cells was demonstrated by Klein et al. [1]. Integration of high-quality intrinsic μc-Si:H into all-hot-wire nip solar cells, prepared close to the transition to amorphous growth using a tantalum catalyzer, resulted in initial and stable efficiencies of 5.4 % on simple stainless steel substrates [2]. However, the deposition rates for the absorber material in both cases remained low, at values around 1 Å/s.In the present study we report on the dependence of deposition rate and material quality on the design and area of the tantalum catalyzer. It was found that different filament geometries require considerable changes in certain deposition conditions to optimize material properties. So, for example, enlarging the catalyzer surface made it necessary to decrease the hydrogen dilution of the process gas, in order to obtain the desired microcrystalline material close to the phase transition. These changes might be understood in terms of alterations of the gas decomposition relations on the catalyzer surface. For these modified conditions, deposition rates in the range of 2.5-10 Å/s could be achieved for μc-Si:H due to the fact that a higher silane fraction of the process gas could be used. For different wire geometries, the optimized intrinsic layers were incorporated into solar cells. Using a catalyzer with modified geometry and enlarged surface area, conversion efficiencies of ν = 4.4 % could be achieved for all-μc-Si:H, all-HWCVD solar cells at a rate of about 3 Å/s.


Sign in / Sign up

Export Citation Format

Share Document