Mosaic Crystal Tilts and Their Relationship to Dislocation Structure, Surface Roughness and Growth Conditions in Relaxed SiGe Layers

1998 ◽  
Vol 533 ◽  
Author(s):  
D. J. Wallis ◽  
D. J. Robbins ◽  
A. J. Pidduck ◽  
G. M. Williams ◽  
A. Churchill ◽  
...  

AbstractIn recent years the growth of virtual substrates using graded SiGe buffer layers has shown great promise for the development of high performance devices. Whilst significant progress has been made in the control of growth conditions to produce low threading dislocation densities of the order suitable for commercial exploitation, several technological problems still have to be overcome. An example of such problems are cosmetic surface defects such as pits and the cross hatched surface roughness associated with mosaic crystal tilts. The work described here utilises a variety of techniques, including X-ray diffraction reciprocal space maps, TEM, AFM and SIMS to provide a comparison between several SiGe virtual substrates grown using low pressure-CVD at high (≈800°C) and low (≈6000°C) temperatures, and at different grade rates (5–50% Ge μm−1). The growth conditions are seen to have a strong effect on the crystal tilts present in the layers with the low temperature layers showing a much larger spread of mosaic tilts. The origin of these tilts is seen to occur during the early stages of the relaxation process irrespective of growth temperature and at similar Ge fractions for all samples. TEM imaging close to the initial growth interface shows that dislocation pileups occur in this region and also suggest that the pileups have a characteristic spacing of 1–2μm. A similar characteristic length scale is also observed in the surface roughness by AFM, the form of which is seen to depend upon the growth conditions.

1998 ◽  
Vol 510 ◽  
Author(s):  
A.Y. Kim ◽  
E.A. Fitzgerald

AbstractTo engineer high-quality Inx(AlyGa1−y)1−x P/Ga1−xP graded buffers, we have explored the effects of graded buffer design and MOVPE growth conditions on material quality. We demonstrate that surface roughness causes threading dislocation density (TDD) to increase with continued grading: dislocations and roughness interact in a recursive, escalating cycle to form pileups that cause increasing roughness and dislocation nucleation. Experiments show that V/III ratio, temperature, and grading rate can be used to control dislocation dynamics and surface roughness in InxGa1−xP graded buffers. Control of these parameters individually has resulted in x = 0.34 graded buffers with TDD = 5 × 106 cm−2and roughness = 15 nm and a simple optimization has resulted in TDD = 3 × 106 cm −2and roughness = 10 un. Our most recent work has focused on more sophisticated optimization and the incorporation of aluminum for x > 0.20 to keep the graded buffer completely transparent above 545 nm. Given our results, we expect to achieve transparent, device-quality Inx(AlyGa1−y)1−x P/GaP graded buffers with TDD < 106 cm−2


2013 ◽  
Vol 860-863 ◽  
pp. 890-893
Author(s):  
Zhi Wen Zhou ◽  
Yue Zhong Zhang ◽  
Xiao Xia Shen

Ge epilayers on low temperature (LT) Ge buffer layers were grown by ultrahigh vacuum chemical vapor deposition using the two-step approach. Effects of the growth temperature and the thickness of the low temperature Ge buffers were studied. It was demonstrated that it was unable to obtain flat LT Ge buffers just through lowering the growth temperature due to the ultraslow grow rate that 3D islands formation couldnt be prohibited. However, the rough LT Ge surface was smoothed by subsequent growth at elevated temperature if the LT Ge layer was thick enough and the compressive strain was relaxed largely, and the detrimental Si-Ge intermixing was effectively prohibited as well. When using proper growth conditions for the low temperature Ge buffer, thick Ge epilayer with a low threading dislocation density and a smooth surface was obtained.


2001 ◽  
Vol 673 ◽  
Author(s):  
Y. H. Luo ◽  
J. Wan ◽  
J. L. Liu ◽  
K. L. Wang

ABSTRACTIn this work, SiGe films on low temperature Si buffer layers were grown by solid-source molecular beam epitaxy and characterized by atomic force microscope, photoluminescence and Raman spectroscopy. Effects of the growth temperature and the thickness of the low temperature Si buffer were studied. It was demonstrated that using proper growth conditions of the low temperature Si buffer, the Si buffer became tensily strained and gave rise to the compliant effect. High-quality SiGe films with low threading dislocation density have been obtained.


Author(s):  
S. Yegnasubramanian ◽  
V.C. Kannan ◽  
R. Dutto ◽  
P.J. Sakach

Recent developments in the fabrication of high performance GaAs devices impose crucial requirements of low resistance ohmic contacts with excellent contact properties such as, thermal stability, contact resistivity, contact depth, Schottky barrier height etc. The nature of the interface plays an important role in the stability of the contacts due to problems associated with interdiffusion and compound formation at the interface during device fabrication. Contacts of pure metal thin films on GaAs are not desirable due to the presence of the native oxide and surface defects at the interface. Nickel has been used as a contact metal on GaAs and has been found to be reactive at low temperatures. Formation Of Ni2 GaAs at 200 - 350C is reported and is found to grow epitaxially on (001) and on (111) GaAs, but is shown to be unstable at 450C. This paper reports the investigations carried out to understand the microstructure, nature of the interface and composition of sputter deposited and annealed (at different temperatures) Ni-Sb ohmic contacts on GaAs by TEM. Attempts were made to correlate the electrical properties of the films such as the sheet resistance and contact resistance, with the microstructure. The observations are corroborated by Scanning Auger Microprobe (SAM) investigations.


2020 ◽  
Vol XVII (2) ◽  
pp. 23-33
Author(s):  
Faisal Hafeez ◽  
Salman Hussain ◽  
Wasim Ahmad ◽  
Mirza Jahanzaib

This paper presents the study to investigate the effects of binder ratio, in-gate length and pouring height on hardness, surface roughness and casting defects of sand casting process. Taguchi methodology with L9 orthogonal array was employed to design the experimentation. Sand casting of six blade impeller using A356 alloy was performed and empirical models for all the above response measures were formulated. Confirmatory tests and analysis of variance results confirmed the accuracy of the model. Binder ratio was found to be the most significant parameter affecting casting surface defects and surface roughness. This was followed by pouring height and in-gate length.


Author(s):  
zhikun zhang ◽  
lianlian xia ◽  
Lizhao Liu ◽  
Yuwen Chen ◽  
zuozhi wang ◽  
...  

Large surface roughness, especially caused by the large particles generated during both the transfer and the doping processes of graphene grown by chemical vapor deposition (CVD) is always a critical...


Author(s):  
Huihuang Chen ◽  
Weng Fu ◽  
Zhigang Geng ◽  
Jie Zeng ◽  
Bo Yang

CO2 electrochemical reduction (CO2ER) into valuable chemical feedstocks holds great promise for energy supply and environmental remediation but remains a challenge due to the lack of high-performance electrocatalysts. Inductive effect,...


2020 ◽  
Vol 148 ◽  
pp. 106745
Author(s):  
S.J. Gutiérrez-Ojeda ◽  
R.C. de Oliveira ◽  
H.N. Fernández-Escamilla ◽  
R. Ponce-Pérez ◽  
J. Guerrero-Sánchez ◽  
...  

1996 ◽  
Vol 423 ◽  
Author(s):  
J. C. Roberts ◽  
F. G. Mcintosh ◽  
M. Aumer ◽  
V. Joshkin ◽  
K. S. Boutros ◽  
...  

AbstractThe emission wavelength of the InxGa1−xN ternary system can span from the near ultraviolet through red regions of the visible spectrum. High quality double heterostructures with these InxGa1−xN active layers are essential in the development of efficient optoelectronic devices such as high performance light emitting diodes and laser diodes. We will report on the MOCVD growth and characterization of thick and thin InGaN films. Thick InxGa1−xN films with values of x up to 0.40 have been deposited and their photoluminescence (PL) spectra measured. AlGaN/InGaN/AlGaN double heterostructures (DHs) have been grown that exhibit PL emission in the violet, blue, green and yellow spectral regions, depending on the growth conditions of the thin InGaN active layer. Preliminary results of an AllnGaN/InGaN/AllnGaN DH, with the potential of realizing a near-lattice matched structure, will also be presented.


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