Ion Beam Mixing and Thermal Demixing of Co/Cu Multilayers

1997 ◽  
Vol 504 ◽  
Author(s):  
M. Cai ◽  
T. Veres ◽  
R. W. Cochrane ◽  
S. Roorda ◽  
R. Abdouche ◽  
...  
Keyword(s):  
Thermal Annealing ◽  
Giant Magnetoresistance ◽  
Low Dose ◽  
Ion Beam ◽  
Ion Bombardment ◽  
Ex Situ ◽  
Ion Beam Irradiation ◽  
X Ray ◽  
Interlayer Structure ◽  
Subsequent Thermal Annealing

ABSTRACTX-ray reflectivity and magnetotransport studies have been used to probe the effects of ion-beam irradiation and subsequent thermal annealing on the structure and giant magnetoresistance (GMR) in Co/Cu multilayers. Low-dose ion bombardment produces interfacial mixing which is accompanied by a systematic suppression of the anti ferromagnetic (AF) coupling and the GMR. For ion doses not exceeding 5 × 1014 ions/cm2, subsequent thermal annealing restores the abrupt interlayer structure as well as the GMR. The combination of low-dose ion bombardment and thermal annealing provides an ex situ technique to modify interface structure reversibly over a gnificant range.

In situ X-ray Scattering Study of the Formation of Au Nano Crystals During Thermal Annealing

2007 ◽  
Vol 1027 ◽  
Author(s):  
Do Young Noh ◽  
Ki-Hyun Ryu ◽  
Hyon Chol Kang
Keyword(s):  
Thermal Annealing ◽  
Bragg Reflection ◽  
Ex Situ ◽  
X Ray ◽  
Force Microscopy ◽  
X Ray Scattering ◽  
Atomic Force ◽  
Au Thin Films ◽  
Ray Scattering

AbstractThe transformation of Au thin films grown on sapphire (0001) substrates into nano crystals during thermal annealing was investigated by in situ synchrotron x-ray scattering and ex situ atomic force microscopy (AFM). By monitoring the Au(111) Bragg reflection and the low Q reflectivity and comparing them with ex situ AFM images, we found that polygonal-shape holes were nucleated and grow initially. As the holes grow larger and contact each other, their boundary turns into Au nano crystals. The Au nano crystals have a well-defined (111) flat top surface and facets in the in-plane direction.

Silicide Formation at HfO2/Si and ZrO2/Si Interfaces Induced by Ar+ Ion Bombardment

2003 ◽  
Vol 786 ◽  
Author(s):  
Yu. Lebedinskii ◽  
A. Zenkevich ◽  
D. Filatov ◽  
D. Antonov ◽  
J. Gushina ◽  
...  
Keyword(s):  
Metal Oxide ◽  
Ion Beam ◽  
Ion Bombardment ◽  
Ex Situ ◽  
Silicide Formation ◽  
Ion Etching ◽  
Silicide Layer ◽  
Layer 2 ◽  
Silicon Interface

ABSTRACTThe effect of ion bombardment with Ar+ at the energy E=2.5 keV on HfO2/Si and ZrO2/Si interfaces has been investigated in situ with XPS by growing thin metal oxide layers and further ion etching them. It is shown that a silicide layer ∼2 nm in thickness is forming, and Ar+ ion beam affects MeO2/Si (Me=Hf, Zr) interface at thickness ≤3 nm. Ex situ AFM/STM corroborates the formation of silicide layer at metal oxide/silicon interface.

Influence of Low-Dose Ion-Beam Mixing on CoSi2 Formation

1992 ◽  
Vol 268 ◽  
Author(s):  
Ikasko C. Dehm ◽  
H. Ryssel
Keyword(s):  
Thermal Annealing ◽  
Rapid Thermal Annealing ◽  
Low Dose ◽  
Ion Beam ◽  
Ion Beam Mixing ◽  
Annealing Temperatures ◽  
Critical Dose ◽  
Incomplete Reaction ◽  
Abrupt Interface ◽  
Complete Formation

ABSTRACTIn this study, the critical dose for ion-beam mixing of Co and Si with Ge-ions which results in homogenous CoSi2 formation after rapid thermal annealing was found. For this purpose, Co was deposited by sputtering on chemically cleaned, <100>-oriented Si and subsequently mixed with Ge ions at doses in the range of 2. 1014 to 1. 1015 cm−2. Silicidation was performed in a rapid thermal annealing (RTA) system at temperatures between 700° and 100°C. Rutherford backscattering measurements showed that annealing at 700°C results in an incomplete reaction when ion-beam mixing at a dose of 2.1014 cm−2 or no ion-beam mixing was performed. After annealing at 1000°C, TEM samples revealed an inhomogeneous CoSi2 film consisting of large grains embedded in the Si. Mixing at doses at or above 5.1014 cm−2 and subsequent RTA at 700°C resulted in uniform CoSi2 layers. Higher annealing temperatures cause larger grains and resistivity values as low as 18 μΩcm. Therefore, we demonstrated that the critical dose leading to complete formation of smooth CoSi2 films with abrupt interface is 5.1014 cm−2 which is nearly the same value as the amorphization dose of Ge in Si.

Ion Beam Study of Early Stages of Growth of GaN films on Sapphire

2002 ◽  
Vol 743 ◽  
Author(s):  
Eugen M. Trifan ◽  
David C. Ingram
Keyword(s):  
Photoelectron Spectroscopy ◽  
Ion Beam ◽  
Ex Situ ◽  
Crystallographic Axis ◽  
In Situ Characterization ◽  
X Ray ◽  
Ion Channeling ◽  
Stages Of Growth ◽  
Early Stages

ABSTRACTAn innovative approach for in-situ characterization has been used in this work to investigate the composition, growth mode, morphology and crystalline ordering of the early stages of growth of GaN films grown on sapphire by MOCVD for substrate temperatures in the range of 450°C to 1050°C. We have performed in-situ characterization by Rutherford Backscattering Spectroscopy (RBS), Ion Channeling, X-ray Photoelectron Spectroscopy (XPS), and Low Energy Electron Diffraction. Ex-situ the films have been characterized by Scanning Electron Microscopy (SEM), X-ray Diffraction (XRD) and thickness profilometry. The films have been grown in an in-house designed and build MOCVD reactor that is attached by UHV lines to the analysis facilities. RBS analysis indicated that the films have the correct stoichiometry, have variable thickness and for low substrate temperature completely cover the substrate while for temperatures 850°C and higher islands are formed that may cover as few as 5 percent of the substrate. From Ion Channeling and LEED we have determined the crystallographic phase to be wurtzite. The crystalline quality increases with higher deposition temperature and with thickness. The films are epitaxialy grown with the <0001> crystallographic axis and planes of the GaN films aligned with the sapphire within 0.2 degrees.

Doping properties of the Ion-Beam-Sputtered SiGe Film

1996 ◽  
Vol 441 ◽  
Author(s):  
Wen-Jie Qi ◽  
Zhi-Sheng Wang ◽  
Zhi-Guang Gu ◽  
Guo-Ping Ru ◽  
Guo-Bao Jialig ◽  
...  
Keyword(s):  
Ion Implantation ◽  
Thermal Annealing ◽  
Rapid Thermal Annealing ◽  
Ion Beam ◽  
X Ray Diffraction ◽  
Electrical Measurements ◽  
Polycrystalline Structure ◽  
X Ray ◽  
Post Annealing ◽  
And Diffusion

AbstractThe ion-beam-sputtered polycrystalline SiGe film and its doping properties have been studied. Boron and phosphorus have been doped into the sputtered poly-SiGe film by ion implantation and diffusion. To activate the implanted impurities, both rapid thermal annealing and fiirnace annealing have been used. The electrical measurements show that boron and plhosphorus can be doped into sputtered SiGe films and effectively activated by both ion implantation with post-annealing and diffiision. Hall mobilities as high as 31 cm2/V-s and 20 cm2/V.s have been obtained in B-difflhsed and P-diffused SiGe films, respectively. The x-ray diffraction spectra of the sputtered Sifie filhn show its typical polycrystalline structure with (111), (220) and (311) as the preferential orientations.

scholarly journals Effects of X-ray and carbon ion beam irradiation on membrane permeability and integrity in Saccharomyces cerevisiae cells

2015 ◽  
Vol 56 (2) ◽  
pp. 294-304 ◽  
Author(s):  
Guozhen Cao ◽  
Miaomiao Zhang ◽  
Jianshun Miao ◽  
Wenjian Li ◽  
Jufang Wang ◽  
...  
Keyword(s):  
Saccharomyces Cerevisiae ◽  
Membrane Permeability ◽  
Ion Beam ◽  
Beam Irradiation ◽  
Ion Beam Irradiation ◽  
Carbon Ion ◽  
X Ray ◽  
Carbon Ion Beam
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