Particulate Removal from Silicon Substrates in Megasonic-Assisted Dilute SC1 Chemistry

1997 ◽  
Vol 477 ◽  
Author(s):  
Ismail Kashkoush ◽  
Eric Brause ◽  
Robert Grant ◽  
Rich Novak
Keyword(s):  
Real World ◽  
Lower Cost ◽  
Bath Temperature ◽  
Silicon Wafers ◽  
Silicon Substrates ◽  
Particle Removal ◽  
Dilute Solutions ◽  
Cost Of Ownership ◽  
Particulate Removal ◽  
Removal System

ABSTRACTThis paper demonstrates the use of megasonic energy to enhance particulate removal in dilute SC1 solutions. Ideal, as well as “real world”, particles were deposited on silicon wafers to challenge the SCl/megasonic particle removal system. Different dilute SCI concentrations were used, e.g., 1:4:20, 1:10:120, and 1:1:100. Bath temperature was varied between 50 and 70°C with megasonic energy kept constant at 800 W. Results showed that the megasonic energy enhanced the particle removal even in dilute solutions. The chemical concentrations were shown to be a significant factor and must be monitored or controlled in dilute SC1 solutions for particle removal to take place. A lower cost of ownership can be obtained from these techniques as a result of using dilute chemicals and extending current bath lives.

CO2 laser-assisted particle removal from silicon surfaces

1996 ◽  
Vol 74 (S1) ◽  
pp. 95-99
Author(s):  
J. B. Héroux ◽  
S. Boughaba ◽  
E. Sacher ◽  
M. Meunier
Keyword(s):  
Co2 Laser ◽  
Laser Fluence ◽  
Final Concentration ◽  
Silicon Surfaces ◽  
Silicon Substrates ◽  
Particle Removal ◽  
Particle Counter ◽  
Raster Scan ◽  
Alumina Particles ◽  
Removal System

A CO2 laser particle removal system was built that enables the removal of 0.1 μm alumina particles from silicon substrates. This system has raster scan capabilities to clean large surfaces, which were analysed using a particle counter. After deposition and removal of 0.1 μm alumina particles, the final concentration is less than 25 particles cm−2 for particle clusters between 0.1 and 10 μm. The efficiency of particle removal is nearly independent of the laser fluence between 0.65 and 2.9 J cm−2 and drops suddenly below 0.65 J cm−2.

scholarly journals Real-World Cost-Effectiveness: Lower Cost of Treating Patients to Glycemic Goal with Liraglutide versus Exenatide

2014 ◽  
Vol 31 (2) ◽  
pp. 202-216 ◽  
Author(s):  
Mitch DeKoven ◽  
Won Chan Lee ◽  
Jonathan Bouchard ◽  
Marjan Massoudi ◽  
Jakob Langer
Keyword(s):  
Cost Effectiveness ◽  
Real World ◽  
Lower Cost

Bonding of 2 mm thick silicon wafers using LTCC as an intermediate layer

2012 ◽  
Vol 2012 (CICMT) ◽  
pp. 000436-000440 ◽  
Author(s):  
S. Günschmann ◽  
M. Fischer ◽  
T. Bley ◽  
I. Käpplinger ◽  
W. Brode ◽  
...  
Keyword(s):  
High Pressure ◽  
Wafer Bonding ◽  
Silicon Surface ◽  
Silicon Wafers ◽  
Anodic Bonding ◽  
Silicon Substrates ◽  
Infrared Transmission ◽  
Fusion Bonding ◽  
Internal Side ◽  
Bonding Technique

For the fabrication of a micro fluidic high pressure oil sensor (400 bar) based on an infrared transmission measuring principle the bonding of 2 mm silicon wafers is necessary. Conventional bonding techniques such as silicon fusion bonding or anodic bonding are not suitable for bonding thick and inflexible silicon wafers, because these techniques can not compensate for the wafer bow. We present a new bonding procedure for silicon substrates thicker than 1 mm using a silicon adapted LTCC tape as an intermediate leveling layer. The wafers are preprocessed by etching a nano structured silicon surface on the internal side. The silicon wafers are aligned and stacked with pre-structured green LTCC tapes by an optical stacking unit. During the hot isostatic lamination at 55 bar the structured LTCC tape is adjusted to the silicon. A subsequent pressure assisted sintering leads to a wafer bonding strength up to 5000 N/cm2. With the bonding technique it is possible to create cavities and channels between the thick wafers by the use of punched and laser cut LTCC. The fabrication steps of the sandwich build-up especially the sequential lamination and the optical adjusting procedure of the flexible (LTCC) and inflexible (2 mm Wafer) substrates will be explained in detail. A method to reduce the shrinkage and distortion of the green LTCC during handling is demonstrated. The distribution of the bonding and bursting strength of the single fluidic systems on a complete sandwich substrate is analyzed.

The Future of Solder Joint Encapsulant

2015 ◽  
Vol 2015 (1) ◽  
pp. 000644-000648
Author(s):  
Mary Liu ◽  
Wusheng Yin
Keyword(s):  
High Temperature ◽  
Low Temperature ◽  
Solder Joint ◽  
Thermal Cycling ◽  
Lower Cost ◽  
Solder Joints ◽  
Cost Of Ownership ◽  
The Future ◽  
High Temperature Solder

Solder joint encapsulant adhesives have been successfully used to enhance the strength of solder joints and improve thermal cycling as well as drop performance in finished products. The use of solder joint encapsulant adhesives can eliminate the need for underfill materials and the underfill process altogether, thus simplifying rework, which results in a lower cost of ownership. Solder joint encapsulant adhesives include: low temperature and high temperature solder joint encapsulant adhesives, and their derivatives. Each solder joint encapsulant adhesive has: unfilled and filled solder joint encapsulant adhesives, and solder joint encapsulant paste. Each solder joint encapsulant product has been designed for different applications. In this paper, we are going to discuss the details and future of solder joint encapsulant adhesives.

Ultrasonic and Hydrodynamic Techniques for Particle Removal from Silicon Wafers

1989 ◽  
pp. 297-306 ◽  
Author(s):  
V. B. Menon ◽  
L. D. Michaels ◽  
R. P. Donovan ◽  
D. S. Ensor
Keyword(s):  
Silicon Wafers ◽  
Particle Removal

Generation and Structural Analysis of Silicon Nanoparticles

1994 ◽  
Vol 358 ◽  
Author(s):  
Ping Li ◽  
Klaus Sattler
Keyword(s):  
Structural Analysis ◽  
Atomic Force Microscope ◽  
Silicon Nanoparticles ◽  
Pyrolytic Graphite ◽  
Silicon Wafers ◽  
Silicon Substrates ◽  
Size Distributions ◽  
Particle Interactions ◽  
Atomic Force ◽  
Silicon Vapor

ABSTRACTWe have generated 20 to 100 nm sized silicon nanoparticles and analyzed their morphologies using an atomic force microscope (AFM). The particles are formed by deposition of silicon vapor onto silicon wafers and highly oriented pyrolytic graphite (HOPG). On silicon substrates, the particles are close to spherical with relatively narrow size distributions and they are randomly located. On graphite substrates the particles are arranged in chains. Within the chains they show strong deformations in the contact areas. We relate this to covalent inter-particle interactions.

Particle Removal Efficiency and Damage Analysis on Silicon Wafers after Megasonic Cleaning in Solvents

2009 ◽  
Vol 23 (12) ◽  
pp. 1709-1721 ◽  
Author(s):  
Francesca Barbagini ◽  
Sandip Halder ◽  
Tom Janssens ◽  
Karine Kenis ◽  
Kurt Wostyn ◽  
...  
Keyword(s):  
Removal Efficiency ◽  
Silicon Wafers ◽  
Damage Analysis ◽  
Particle Removal ◽  
Megasonic Cleaning

Study on the Design of Particle Removal System for Autonomous Robotic Vehicle

2013 ◽  
Vol 694-697 ◽  
pp. 1646-1651
Author(s):  
Bagus Bhirawa Putra ◽  
He Xu ◽  
Liu Zhao Jie
Keyword(s):  
Embedded System ◽  
Design Methodology ◽  
Wide Spectrum ◽  
Autonomous Vehicle ◽  
Particle Removal ◽  
Future Developments ◽  
Jet Nozzle ◽  
The Embedded System ◽  
Robotic Vehicle ◽  
Removal System

The robustness of an autonomous robotic vehicle (ARV) and the embedded supporting architecture permit the investigation of a wide spectrum of research options for particle removal and cleaning apparatus. Applications for particle removal are aimed at supporting the autonomous vehicle in performing its mission, especially in areas considered hazardous, hence emphasize the importance of the embedded system in which the development of air and water jet nozzle is being introduced. By understanding the present basic theory and design methodology, this would capture the outline for future developments of the novelty in particle removal methods especially in an autonomous robotic vehicle (ARV). Accordingly, it can be ascertained that at the same time the main line of the research on particle removal methods remains clear, still in a correspondence research context it is relatively easy to identify alternative subjects which are worthwhile to investigate further.

Sign in / Sign up

Export Citation Format

Share Document