A Generalized Model of Beryllium Diffusion in InGaASs Epitaxial Structures Under Point Defect Nonequilibrium Conditions

1997 ◽  
Vol 470 ◽  
Author(s):  
S. Gautier ◽  
S. Koumetz ◽  
J. Marcon ◽  
K. Ketata ◽  
M. Ketata ◽  
...  

ABSTRACTBeryllium diffusion during post-growth annealing is investigated in InGaAs epitaxial layers. Indeed, this undesirable diffusion may occur during thermal treatments of InGaAs/lnP Heterojunction Bipolar Transistors (HBT's), which can generate a limitation of frequency performances of these devices. Epitaxial structures have then been grown, one set by Chemical Beam Epitaxy (CBE), and another one by Gas Source Molecular Beam Epitaxy (GSMBE). The post-growth Rapid Thermal Annealing (RTA) was then performed, and Secondary Ion Mass Spectrometry (SIMS) has been used to characterize the Be depht profiles.In parallel with our experimental study, we propose two models of Be diffusion in InGaAs in the case of point defect nonequilibrium. First, a Kick-out Diffusion model considering neutral Be interstitial species and charged point defects has been studied. Then, a Generalized Substitutional-Interstitial Diffusion model based on simultaneous diffusion by Dissociative and Kick-out mechanisms is proposed. Good agreements between experimental depth profiles and simulated curves have been obtained.

1996 ◽  
Vol 450 ◽  
Author(s):  
S. Gautier ◽  
S. Koumetz ◽  
J. Marcon ◽  
K. Ketata ◽  
M. Ketata ◽  
...  

ABSTRACTThe subject of this work is the simulation of Be diffusion during post-growth Rapid Thermal Annealing (RTA) of InGaAs epitaxial layers grown by Chemical Beam Epitaxy (CBE). This diffusion may occur during thermal treatments of InGaAs/InP Heterojunction Bipolar Transistors (HBT's), which contributes to limit the frequency performances of these devices. In order to characterize the Be depth profiles, Secondary Ion Mass Spectrometry (SIMS) has been used. The concentration dependent diffusivity has been covered to perform an improved data fitting of Be diffusion profiles. In a first step, the solid state diffusion mechanisms have been developed, including the Substitutional-Interstitial Diffusion (SID) and, in particular, Kick-out mechanism. To explain the observed concentration profiles and related diffusion mechanisms, a Generalized Substitutional-Interstitial Diffusion model is proposed. A simultaneous diffusion by Dissociative and Kick-out mechanisms is suggested. Good agreements between experimental depth profiles and simulated curves have been obtained.


1993 ◽  
Vol 62 (16) ◽  
pp. 1884-1886 ◽  
Author(s):  
M. D. Williams ◽  
T. H. Chiu ◽  
F. G. Storz ◽  
S. C. Shunk ◽  
J. F. Ferguson

1997 ◽  
Vol 469 ◽  
Author(s):  
Masayuki Hiroi ◽  
Takeo Ikezawa ◽  
Masami Hane ◽  
Hiroshi Matsumoto

ABSTRACTAn arsenic diffusion model was proposed with the emphasis on a new deactivation process which accounts for excess interstitial silicon generation. Appropriate parameter set for the binding energies of arsenic-point defect pairs were obtained for reproducing various arsenic activation levels and interaction with boron in the case of co-diffusion. Such parameters were extracted from the data of carefully performed secondary ion mass spectroscopy with lowering the primary beam energy.


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