Amorphous Silicon-Carbon Alloys and Amorphous Carbon from Direct Methane and Ethylene Activation by ECR

1997 ◽  
Vol 467 ◽  
Author(s):  
J. P. Conde ◽  
V. Chu ◽  
F. Giorgis ◽  
C. F. Pirrt ◽  
S. Arekat
Keyword(s):  
Carbon Source ◽  
Amorphous Silicon ◽  
Gas Flow ◽  
Electron Cyclotron Resonance ◽  
Chemical Vapor ◽  
Plasma Stream ◽  
Ecr Plasma ◽  
Silicon Carbon ◽  
Gas Flow Ratio ◽  
Hydrogenated Amorphous

ABSTRACTHydrogenated amorphous silicon-carbon alloys are prepared using electron-cyclotron resonance (ECR) plasma-enhanced chemical vapor deposition. Hydrogen is introduced into the source resonance cavity as an excitation gas. Silane is introduced in the main chamber in the vicinity of the plasma stream, whereas the carbon source gases, methane or ethylene, are introduced either with the silane or with the hydrogen as excitation gases. The effect of the type of carbon-source gas, excitation gas mixture and silane-to-carbon source gas flow ratio on the deposition rate, bandgap, subgap density of states, spin density and hydrogen evolution are studied.

Amorphous Silicon-Carbon alloys Deposited by Electron-Cyclotron Resonance PECVD

1996 ◽  
Vol 420 ◽  
Author(s):  
V. Chu ◽  
J. P. Conde
Keyword(s):  
Carbon Source ◽  
Amorphous Silicon ◽  
Cyclotron Resonance ◽  
Urbach Energy ◽  
Electron Cyclotron Resonance ◽  
Chemical Vapor ◽  
Electron Cyclotron ◽  
Ecr Plasma ◽  
Hydrogen Dilution ◽  
Silicon Carbon

AbstractHydrogenated amorphous silicon-carbon alloys are prepared using electron-cyclotron resonance (ECR) plasma-enhanced chemical-vapor deposition. Hydrogen is used as the excitation gas in the resonance chamber while silane and methane (or ethylene) are introduced in the main chamber. A minimum of 95% hydrogen dilution is used. The microwave power is kept constant at 150 W. The effect of the type of carbon source gas, silane to carbon source gas ratio, deposition pressure, substrate temperature and hydrogen dilution on the deposition rate, bandgap and Urbach energy are studied. The photoconductivity and the Urbach energy of the ECR-deposited films are compared to those prepared with glow discharge with the same bandgap.

High Rate Deposition of Hydrogenated Amorphous Silicon Films by ECR Plasma CVD

1989 ◽  
Vol 165 ◽  
Author(s):  
S. Ozaki ◽  
T. Akahori ◽  
T. Tani ◽  
S. Nakayama
Keyword(s):  
Amorphous Silicon ◽  
Gas Flow ◽  
Electron Cyclotron Resonance ◽  
Hydrogenated Amorphous Silicon ◽  
Dark Conductivity ◽  
Utilization Efficiency ◽  
High Rate ◽  
Plasma Cvd ◽  
Ecr Plasma ◽  
Hydrogenated Amorphous

AbstractA new electron cyclotron resonance (ECR) plasma CVD system has been developed in order to obtain high deposition rates. By using this system, hydrogenated amorphous silicon (a-Si:H) films have been prepared at a deposition rate of 1.0. μ m/min. The utilization efficiency of SiH4 gas is 16% under such conditions. Films prepared at 1.0 μ m/min have high photoconductivity (σ ph) of 10-6 S/cm and low dark conductivity (σ d) of 10-12 S/cm, leading to a high photosensitivity of σ ph/σ d=106. Both high microwave power and high SiH4 gas flow rates are essential to the high rate deposition of sufficiently photosensitive a-Si:H films. Annealing at 300° C improves the photosensitivity up to σ ph/σ d=107.

Effect of Nitrogen Doping on the Structure and Optical Properties of N-Type Hydrogenated Amorphous Silicon Thin Films

2011 ◽  
Vol 383-390 ◽  
pp. 6980-6985
Author(s):  
Mao Yang Wu ◽  
Wei Li ◽  
Jun Wei Fu ◽  
Yi Jiao Qiu ◽  
Ya Dong Jiang
Keyword(s):  
Thin Films ◽  
Optical Properties ◽  
Amorphous Silicon ◽  
Photoelectron Spectroscopy ◽  
Gas Flow ◽  
Hydrogenated Amorphous Silicon ◽  
Chemical Vapor ◽  
Silicon Thin Films ◽  
Frequency Plasma ◽  
Hydrogenated Amorphous

Hydrogenated amorphous silicon (a-Si:H) thin films doped with both Phosphor and Nitrogen are deposited by ratio frequency plasma enhanced chemical vapor deposition (PECVD). The effect of gas flow rate of ammonia (FrNH3) on the composition, microstructure and optical properties of the films has been investigated by X-ray photoelectron spectroscopy, Raman spectroscopy and ellipsometric spectra, respectively. The results show that with the increase of FrNH3, Si-N bonds appear while the short-range order deteriorate in the films. Besides, the optical properties of N-doped n-type a-Si:H thin films can be easily controlled in a PECVD system.

Hydrogenated amorphous silicon carbon nitride films prepared by PECVD technology: properties

2012 ◽  
Vol 63 (5) ◽  
pp. 333-335 ◽  
Author(s):  
Jozef Huran ◽  
Albín Valovič ◽  
Michal Kučera ◽  
Angela Kleinová ◽  
Eva Kovačcová ◽  
...  
Keyword(s):  
Amorphous Silicon ◽  
Amorphous Materials ◽  
Carbon Nitride ◽  
Hydrogenated Amorphous Silicon ◽  
Electrical Characterization ◽  
Chemical Vapor ◽  
Silicon Carbon ◽  
Two Peaks ◽  
Hydrogenated Amorphous ◽  
Silicon Carbon Nitride

Hydrogenated amorphous silicon carbon nitride films were grown by plasma enhanced chemical vapor deposition (PECVD) technique. The flow rates of SiH4 , CH4 and NH3 gases were 6 sccm, 30 sccm and 8 sccm, respectively. The deposition temperatures were 350, 400 and 450 ◦C. The RBS and ERD results showed that the concentrations of Si, C, N and H are practically the same in the films deposited at substrate temperatures in the range 350-450 ◦C. In photoluminescence spectra we identified two peaks and assigned them to radiative transitions typical for amorphous materials, ie band to band and defect-related ones. The electrical characterization consists of I(V ) measurement in sandwich configuration for voltages up to 100 V. From electrical characterization, it was found that with increased deposition temperature the resistivity of the amorphous SiCN film was reduced.

Growth of Er Doped si Films by Electron Cyclotron Resonance Plasma Enhanced Chemical Vapor Deposition

1993 ◽  
Vol 301 ◽  
Author(s):  
Jim L. Rogers ◽  
Walter J. Varhue ◽  
Edward Adams
Keyword(s):  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Cyclotron Resonance ◽  
Electron Cyclotron Resonance ◽  
Hydrogen Plasma ◽  
Chemical Vapor ◽  
Electron Cyclotron ◽  
Plasma Stream ◽  
Ecr Plasma ◽  
Si Films

ABSTRACTThin Si films doped with Er have been grown at low temperature by plasma enhanced chemical vapor deposition. The Er gas source is a sublimed organo-metallic compound fed into the process chamber. High doping concentrations without precipitation are possible because of the low deposition temperatures. The process relies on the beneficial effects of low energy ion bombardment to reduce the growth temperature. The ions as well as reactive chemical species are produced by an electron cyclotron resonance (ECR) plasma stream source. A hydrogen plasma stream is used to perform an in-situ pre-deposition clean to remove oxide from the Si surface. Film crystallinity and impurity concentration are determined by Rutherford backscattering spectrometry.

ECR RIE-Enhanced Low Pressure Plasma Etching of GaN/InGaN/AlGaN Heterostructures

1996 ◽  
Vol 1 ◽  
Author(s):  
Bedwyr Humphreys ◽  
Matthew Govett
Keyword(s):  
Etch Rate ◽  
Gas Flow ◽  
Electron Cyclotron Resonance ◽  
Plasma Source ◽  
Group V ◽  
Group Iii ◽  
Ecr Plasma ◽  
Selective Etch ◽  
Process Chemistry ◽  
Gas Flow Ratio

A room temperature (RT) plasma etch process has been developed to non-selectively etch GaN/InGaN/AlGaN structures, grown on sapphire substrates, using an electron cyclotron resonance (ECR) plasma source with RIE enhancement. The process chemistry chosen was Cl2/CH4 based in order to facilitate the formation of volatile etch by-products, typically to form group III halides and group V hydrides, although indium is more likely to form an organo-metallic compound as opposed to a chloride. A characteristic of this process is the very smooth sidewall features obtained and the controllability of the etch profile via ECR power, table bias and/or gas flow ratio. Typical results obtained using a RT process were etch rate above 100 nm/min., selectivity to resist mask above 30:1 and smooth anisotropic profile at low ion-energies (below 100 eV). The process etch rate showed a characteristic increase with increasing table bias (above 130 nm/min.) with only small changes in the relative etch rate of each compound (i.e. selectivity maintained at roughly 1:1), however, this etch does rely upon competing etching and deposition mechanisms and thus too large a variation in one parameter without a corresponding compensation with another leads to a rough surface and a more selective etch. The process has also been demonstrated using a metal mask (e.g. Ni) and present work is progressing onto other gas combinations and the use of high temperature electrodes.

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