Commercial RTP-A SEMATECH Perspective

1996 ◽  
Vol 429 ◽  
Author(s):  
Tony Speranza ◽  
Terry Riley ◽  
Arun Nanda ◽  
Burt Fowler ◽  
Kenneth Torres ◽  
...  
Keyword(s):  
Process Control ◽  
Thermal Processing ◽  
Semiconductor Manufacturing ◽  
Rapid Thermal Processing ◽  
Component Technology ◽  
Tool Development ◽  
Productivity Improvement ◽  
The Past ◽  
Vertical Furnace ◽  
Cluster Tool

AbstractThis paper discusses various commercial aspects of Rapid Thermal Processing (RTP). It provides an overview of SEMATECH's efforts to improve the manufacturing viability of RTP. Over the past several years SEMATECH, a U.S. Government/Industry consortium, has identified thermal equipment and processing needs relating to semiconductor manufacturing. It has aggressively pursued solutions to these needs through specific equipment projects. These projects include: RTP Installed Base Productivity Improvement, 0.25um RTP Tool Development, and RTP Modeling and Component Technology. Also discussed are several thermal projects which focus on the performance of more traditional tools. A comparison between RTP and a vertical furnace with model based process control and a small batch fast ramp furnace is made. A brief discussion of an RTP gate stack cluster tool project is followed by a review of future thermal processing needs, including 300mm.

Rapid Thermal Processing Requirements for 0.35-µm IC Technologies and Beyond

1994 ◽  
Vol 342 ◽  
Author(s):  
Mehrdad M. Moslehi
Keyword(s):  
Process Control ◽  
Design Process ◽  
Thermal Processing ◽  
State Of The Art ◽  
Rapid Thermal Processing ◽  
Chemical Vapor ◽  
Unit Process ◽  
The Past ◽  
Cmos Ic ◽  
Manufacturing Science

ABSTRACTThis paper will present an overview of rapid thermal processing (RTP) technologies for fastcycle-time IC production. RTP has experienced significant advances in equipment design, process control capabilities, and unit process applications over the past eight years. The Microelectronics Manufacturing Science and Technology (MMST) program at TI successfully demonstrated CMOS IC production in a single-wafer factory with all-RTP thermal fabrication for various anneals, oxidations, and chemical-vapor depositions. The use of RTP in conjunction with other single-wafer processes enabled 0.35 µm IC fabrication with a 3-day cycle time. Selected RTP equipment, sensor, and process control developments will be reviewed. The RTP applications and requirements for state-of-the-art and future IC technologies will be described.

In-process control of silicide formation during rapid thermal processing

1993 ◽  
Vol 63 (1-4) ◽  
pp. 131-134 ◽  
Author(s):  
J.-M. Dilhac ◽  
C. Ganibal ◽  
N. Nolhier ◽  
P.B. Moynagh ◽  
C.P. Chew ◽  
...  
Keyword(s):  
Process Control ◽  
Thermal Processing ◽  
Rapid Thermal Processing ◽  
Silicide Formation

Integrated Rapid Thermal CVD Processing Solutions for 0.18–0.25μm Technologies

1997 ◽  
Vol 470 ◽  
Author(s):  
H. Gilboa ◽  
Y. E. Gilboa ◽  
Z. Atzmon ◽  
S. Levy ◽  
H. Spilberg ◽  
...  
Keyword(s):  
High Temperature ◽  
Flash Memory ◽  
Thermal Processing ◽  
Rapid Thermal Processing ◽  
Chemical Vapor ◽  
Wafer Cleaning ◽  
Front End ◽  
Wafer Processing ◽  
Cluster Tool ◽  
Temperature Applications

ABSTRACTThe evolution of integrated single-wafer processing for high-temperature applications in the front end of the line (FEOL) occurred with the advancements in single-wafer rapid thermal processing and its acceptance as a manufacturing technology. The Integra RTCVD cluster tool for high-temperature applications features wafer cleaning, rapid thermal processing and single wafer chemical vapor deposition steps. The paper presents integrated vapor phase clean and RTCVD applications for FLASH memory gate stack and DRAM cell.

In-Situ Fabrication and Process Control Techniques in Rapid Thermal Processing

1991 ◽  
Vol 224 ◽  
Author(s):  
Mehrdad M. Moslehi ◽  
John Kuehne ◽  
Richard Yeakley ◽  
Lino Velo ◽  
Habib Najm ◽  
...  
Keyword(s):  
Process Control ◽  
Thermal Processing ◽  
Polycrystalline Silicon ◽  
High Performance ◽  
Rapid Thermal Processing ◽  
Control Techniques ◽  
In Situ Fabrication ◽  
Concurrent Use ◽  
Process Uniformity

AbstractAdvanced rapid thermal processing (RTP) equipment and sensors have been developed for in-situ fabrication of semiconductor devices. High-performance multi-zone lamp modules have been applied to various processes including rapid thermal oxidation (RTO), chemicalvapor deposition (CVD) of tungsten and amorphous/polycrystalline silicon, silicide formation, as well as high-temperature rapid thermal annealing (RTA). Concurrent use of multizone lamps and multi-point temperature sensors allows real-time wafer temperature control and process uniformity optimization. Specific experimental results will be presented on the multi-zone lamp modules, in-situ process control sensors, and single-wafer fabrication processes.

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