Modified Triode Plasma Configuration Allowing Precise Control of Ion-Energy for Preparing High Mobility a-Si:H

1996 ◽  
Vol 420 ◽  
Author(s):  
G. Ganguly ◽  
T. Ikeda ◽  
I. Sakata ◽  
A. Matsuda
Keyword(s):  
Amorphous Silicon ◽  
High Mobility ◽  
Plasma Potential ◽  
Drift Mobility ◽  
Ion Energy ◽  
Precise Control ◽  
Langmuir Probe Measurements ◽  
Bombardment Energy ◽  
Silane Plasma ◽  
Plasma Configuration

AbstractWe have previously shown that the carrier drift mobility in amorphous silicon can be enhanced by optimizing the ion-bombardment energy during growth on conducting substrates. However, there exists a lack of reproducibility of samples exhibiting high mobility which we attribute to the rf field induced fluctuation of the plasma potential in a conventional (Te ≈ 2eV) silane plasma. Here we introduce an enclosed plasma configuration that allows us to confine the effect of the rf field and therefore obtain a low-electron-temperature (Te ≈ 0.1 eV) silane plasma as determined from Langmuir probe measurements. The measured ion-energy distributions correlate with those for electrons and the mean ion-energy can be controlled by biasing the substrate which allows us to reproducibly fabricate high drift mobility amorphous silicon.

Synthesis of Crystallized TiNi Films by Ion Irradiation

2012 ◽  
Vol 78 ◽  
pp. 87-91
Author(s):  
Noriaki Ikenaga ◽  
Yoichi Kishi ◽  
Zenjiro Yajima ◽  
Noriyuki Sakudo
Keyword(s):  
Shape Memory ◽  
Crystallization Temperature ◽  
Ion Irradiation ◽  
Deposition Process ◽  
Plasma Potential ◽  
Micro Electro Mechanical Systems ◽  
Ion Energy ◽  
Crystal Film ◽  
Irradiation Energy ◽  
New Apparatus

TiNi is well known as a typical shape-memory alloy, and is expected to be a promising material for micro actuators. In order to realize micro electro mechanical systems (MEMS) with this material, we have to get thin crystal film of the material, since the shape-memory property appears only when the structure is crystalline. In our previous studies we developed a new apparatus as well as a new deposition process for lowering the crystallization temperature by using ion irradiation. In addition, we have found that the deposited film by the process can be crystallized at very low temperature (below 473 K) without annealing but with simultaneous irradiation of Ar ions during sputter-deposition. In this study, we aim for the realization of crystallized TiNi film, which is deposited on Si substrate below 373 K substrate temperature. In order to realization the purpose, we have revealed the effect of Ar ion energy on lowering the crystallization temperature. The ion energy is measured with a quadrupole mass spectrometer (QMS) having an ion energy analyzer. The deposited TiNi films are examined with an X-ray diffraction (XRD). We found the plasma potential against the reactor chamber is important to be considered in the ion irradiation energy. The effects of ion energy for the crystallization of TiNi film are discussed.

scholarly journals Modulated photoconductivity study of electron drift mobility in amorphous silicon

2000 ◽  
Vol 87 (6) ◽  
pp. 2901-2909 ◽  
Author(s):  
K. Hattori ◽  
M. Iida ◽  
T. Hirao ◽  
H. Okamoto
Keyword(s):  
Amorphous Silicon ◽  
Drift Mobility ◽  
Electron Drift ◽  
Electron Drift Mobility

Comments on Electron and Hole Transport in the Band Tail States of Amorphous Silicon at Low Temperatures

1989 ◽  
Vol 149 ◽  
Author(s):  
M. Silver ◽  
W. E. Spear
Keyword(s):  
Amorphous Silicon ◽  
Drift Mobility ◽  
Hole Transport ◽  
Experimental Results ◽  
Exponential Tail ◽  
Band Tail ◽  
State Distribution ◽  
Temperature Drift ◽  
Model Calculations ◽  
Tail State

ABSTRACTRecent experimental results on the low temperature drift mobility in amorphous silicon are examined on the basis of the approach to hopping transport developed by Silver and Bässler. It is shown on general grounds that the main features of the experimental results cannot be explained by a purely exponential tail state distribution, but are consistent with the distribution used by Spear and Cloude (1988) in model calculations.

Ion Beam Deposition of Epitaxial Silicon Films

1997 ◽  
Vol 485 ◽  
Author(s):  
H. R. Khan ◽  
H. Frey
Keyword(s):  
Ion Beam ◽  
Silicon Films ◽  
Epitaxial Silicon ◽  
X Ray Diffraction ◽  
Ion Energy ◽  
X Ray ◽  
Ion Beam Deposition ◽  
Si Films ◽  
Silane Plasma ◽  
Beam Deposition

AbstractSilicon films of thicknesses (100 – 800 nm) are deposited on Si[111] substrate at 490°C using Si+ ions of energies (20 – 70 eV) from Silane plasma. The structure of the films depends on the energy of Si+ ions and the film grows epitaxially for ion energy <20 eV. Si films are analyzed by X-ray diffraction technique.

Measurements of ion energy and flux during ion-assisted deposition of CdTe epilayers by rf magnetron-sputtering

1991 ◽  
Vol 69 (3-4) ◽  
pp. 236-240 ◽  
Author(s):  
J. G. Cook ◽  
S. R. Das
Keyword(s):  
Voltage Drop ◽  
Rf Magnetron Sputtering ◽  
Plasma Potential ◽  
Crystallographic Structure ◽  
Substrate Bias ◽  
Rf Power ◽  
Substrate Bias Voltage ◽  
Ion Energy ◽  
Discharge Parameters ◽  
Rf Sputter Deposition

Previously we found that the crystallographic structure of CdTe films deposited by means of ion-assisted magnetron rf sputter deposition was very sensitive to the substrate bias voltage and temperature (S. R. Das et al. Can. J. Phys. 65, 864 (1987)). In this work, the ion energy and flux incident on the growing film were determined by means of rf-compensated Langmuir diagnostics. It was found that control of the film phase in the previous work was achieved largely by adjustments of ion energy and substrate temperature; the ion flux changed relatively little. The work is extended to a study of the discharge parameters as a function of rf power, using a CdTe target. The ion and electron densities are found to be sensitive to rf power, whereas the plasma potential Vp and the electron temperature are not. A well-known equation for Vp in terms of the positive excursions of the target voltage gives a poor estimate for Vp because of the voltage drop across the rf impedance of the target disc.

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