Mechanical Behavior of Eutectic Sn-Ag and Sn-Zn Solders

1995 ◽  
Vol 390 ◽  
Author(s):  
Hareesh Mavoori ◽  
Semyon Vaynman ◽  
Jason Chin ◽  
Brian Moran ◽  
Leon M. Keer ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Numerical Simulation ◽  
Stress Relaxation ◽  
Tensile Stress ◽  
Mechanical Behavior ◽  
Constitutive Modeling ◽  
Empirical Modeling ◽  
Damage Models ◽  
Simulation Based ◽  
Semi Empirical

ABSTRACTEutectic Sn-Ag and Sn-Zn solders are currently being investigated as the basis for replacement of Sn-Pb solders. Some mechanical properties of these solder systems - fatigue, tensile, stress relaxation and creep are presented here along with some damage feature observations for eutectic Sn-Ag solder. Semi-empirical modeling, constitutive modeling and numerical simulation based on damage models have been carried out for lifetime prediction. Preliminary agreement of this numerical simulation with experimental results appears encouraging, but the models need further refinement.

Constitutive modeling for the mechanical behavior of rubber with filler particles

2021 ◽  
Author(s):  
Sankalp Gour ◽  
Deepu Kumar Singh ◽  
Deepak Kumar ◽  
Vinod Yadav
Keyword(s):  
Mechanical Properties ◽  
Carbon Black ◽  
Mechanical Behavior ◽  
Experimental Observation ◽  
Continuum Mechanics ◽  
Constitutive Modeling ◽  
Carbon Nanoparticles ◽  
Material Behavior ◽  
Experimental Results ◽  
Filler Particles

Abstract The present study deals with the constitutive modeling for the mechanical behavior of rubber with filler particles. An analytical model is developed to predict the mechanical properties of rubber with added filler particles based on experimental observation. To develop the same, a continuum mechanics-based hyperelasticity theory is utilized. The model is validated with the experimental results of the chloroprene and nitrile butadiene rubbers filled with different volume fractions of carbon black and carbon nanoparticles, respectively. The findings of the model agree well with the experimental results. In general, the developed model will be helpful to the materialist community working in characterizing the material behavior of tires and other rubber-like materials.

Isothermal Stress Relaxation in Al, Alcu and A1vpd Films

1996 ◽  
Vol 436 ◽  
Author(s):  
J. P. Lokker ◽  
J. F. Jongste ◽  
G. C. A. M. Janssen ◽  
S. Radelaar
Keyword(s):  
Stress Relaxation ◽  
Integrated Circuits ◽  
Tensile Stress ◽  
Thermal Cycling ◽  
Mechanical Behavior ◽  
Mechanical Stress ◽  
Plasma Etching ◽  
Isothermal Treatment ◽  
Aluminum Metallization ◽  
Curvature Measurements

AbstractMechanical stress and its relaxation in aluminum metallization in integrated circuits (IC) are a major concern for the reliability of the material. It is known that adding Cu improves the reliability but complicates plasma etching and increases corrosion sensitivity. The mechanical behavior of AlVPd, AlCu and Al blanket films is investigated by wafer curvature measurements. During thermal cycling between 50°C and 400°C the highest tensile stress is found in AlVPd. In a subsequent experiment, the cooling was interrupted at several temperatures to investigate the stress behavior during an eight hour isothermal treatment. Isothermal stress relaxation has been observed in the three types of films and is discussed.

scholarly journals Effects of Conventional and Severe Shot Peening on Residual Stress and Fatigue Strength of Steel AISI 1060 and Residual Stress Relaxation Due to Fatigue Loading: Experimental and Numerical Simulation

2020 ◽  
Author(s):  
Erfan Maleki ◽  
Gholam Hossein Farrahi ◽  
Kazem Reza Kashyzadeh ◽  
Okan Unal ◽  
Mario Gugaliano ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Numerical Simulation ◽  
Residual Stress ◽  
Stress Relaxation ◽  
Shot Peening ◽  
Fatigue Behavior ◽  
Fatigue Loading ◽  
Experimental Investigations ◽  
Residual Stress Relaxation ◽  
Severe Shot Peening

Abstract This study investigates and compares the effects of different shot peening treatments including conventional and severe shot peening on microstructure, mechanical properties, fatigue behavior, and residual stress relaxation of AISI 1060 steel. Shot peening treatments were applied with two Almen intensities of 17 and 21 A and a wide ranges of coverage (100%–1500%). Various microstructural observations were carried out to analyze the evolution of microstructure. Microhardness, residual stress and surface roughness measurements and also axial fatigue test were performed. Moreover, the extent of the residual stress relaxation during cyclic loading was investigated by means of XRD measurements. Furthermore, numerical simulation of residual stress relaxation due to fatigue loading was carried out and validated against experimental investigations. The comparison indicated a good agreement for the surface residual stress relaxation up to 100 cycles. The experimental results indicated the efficiency of severe shot peening processes in obtaining nanostructured surface layer and achieving superior mechanical properties and fatigue behavior. Also, residual stress measurements revealed that stress relaxation started with a high rate at the initial stages of loading and gradually increased at higher number of cycles which was lower in the case of severely shot peened samples compared to the conventionally treated ones. Graphic Abstract

scholarly journals The Mechanical Properties of Rat Tail Tendon

1959 ◽  
Vol 43 (2) ◽  
pp. 265-283 ◽  
Author(s):  
Bernard J. Rigby ◽  
Nishio Hirai ◽  
John D. Spikes ◽  
Henry Eyring
Keyword(s):  
Mechanical Properties ◽  
Simple Model ◽  
Stress Relaxation ◽  
Connective Tissue ◽  
Mechanical Behavior ◽  
Biological Significance ◽  
Connective Tissue Disorders ◽  
Stress Relaxation Behavior ◽  
Tail Tendon ◽  
Rat Tail

The load-strain and stress-relaxation behavior of wet rat tail tendon has been examined with respect to the parameters strain, rate of straining, and temperature. It is found that this mechanical behavior is reproducible after resting the tendon for a few minutes after each extension so long as the strain does not exceed about 4 per cent. If this strain is exceeded, the tendon becomes progressively easier to extend but its length still returns to the original value after each extension. Extensions of over 35 per cent can be reached in this way. Temperature has no effect upon the mechanical behavior over the range 0–37°C. Just above this temperature, important changes take place in the mechanical properties of the tendon which may have biological significance. The application of the techniques used here to studies of connective tissue disorders is suggested. Some of the mechanical properties of tendon have been interpreted with a simple model.

Experimental and Numerical Simulation of the Mechanical Behavior of Stratospheric Balloons Materials

2008 ◽  
Vol 33-37 ◽  
pp. 597-602
Author(s):  
Pierre Vialettes ◽  
Lina Zhou ◽  
Bing Pan ◽  
Zhuo Zhuang
Keyword(s):  
Mechanical Properties ◽  
Numerical Simulation ◽  
Low Temperature ◽  
Mechanical Behavior ◽  
Future Development ◽  
Earth Observation ◽  
Tsinghua University ◽  
First Results ◽  
Experimental Facilities ◽  
Manufacture Company

The school of aerospace of Tsinghua University has started a project to develop new kind of stratospheric balloons for earth observation. These balloons will be designed to stand in the same position during a few days at 20 kilometers of altitude. To reach this goal, the first step is to select adapted materials for the balloon envelope. The materials for stratospheric balloons application should have specific properties adapted to the environment such as mechanical, thermo-optical, and permeability properties. Thus, we have asked a material manufacture company to develop and manufacture a material adapted to our application. In this paper, we will present the first results concerning the mechanical properties of the material. Experimental facilities have been developed to test the mechanical behavior of the materials at room and low temperature. The future development of the project will be to identify behavior law adapted to our material that fits with the experimental results.

scholarly journals A Multiscale Simulation Method and Its Application to Determine the Mechanical Behavior of Heterogeneous Geomaterials

2017 ◽  
Vol 2017 ◽  
pp. 1-12 ◽  
Author(s):  
Shengwei Li ◽  
Heping Xie ◽  
Ru Zhang ◽  
Mingzhong Gao ◽  
Zetian Zhang ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Numerical Simulation ◽  
Finite Element ◽  
Mechanical Behavior ◽  
Molecular Simulation ◽  
Heterogeneous Material ◽  
Simulation Method ◽  
Multiscale Simulation ◽  
Mechanical Behaviors ◽  
Finite Element Numerical Simulation

To study the micro/mesomechanical behaviors of heterogeneous geomaterials, a multiscale simulation method that combines molecular simulation at the microscale, a mesoscale analysis of polished slices, and finite element numerical simulation is proposed. By processing the mesostructure images obtained from analyzing the polished slices of heterogeneous geomaterials and mapping them onto finite element meshes, a numerical model that more accurately reflects the mesostructures of heterogeneous geomaterials was established by combining the results with the microscale mechanical properties of geomaterials obtained from the molecular simulation. This model was then used to analyze the mechanical behaviors of heterogeneous materials. Because kernstone is a typical heterogeneous material that comprises many types of mineral crystals, it was used for the micro/mesoscale mechanical behavior analysis in this paper using the proposed method. The results suggest that the proposed method can be used to accurately and effectively study the mechanical behaviors of heterogeneous geomaterials at the micro/mesoscales.

Isothermal Stress Relaxation In Al, AlCu and AlVPd Films

1996 ◽  
Vol 428 ◽  
Author(s):  
J. P. Lokker ◽  
J. F. Jongste ◽  
G. C. A. M. Janssen ◽  
S. Radelaar
Keyword(s):  
Stress Relaxation ◽  
Integrated Circuits ◽  
Tensile Stress ◽  
Thermal Cycling ◽  
Mechanical Behavior ◽  
Mechanical Stress ◽  
Plasma Etching ◽  
Isothermal Treatment ◽  
Aluminum Metallization ◽  
Curvature Measurements

AbstractMechanical stress and its relaxation in aluminum metallization in integrated circuits (IC) are a major concern for the reliability of the material. It is known that adding Cu improves the reliability but complicates plasma etching and increases corrosion sensitivity. The mechanical behavior of AIVPd, AlCu and Al blanket films is investigated by wafer curvature measurements. During thermal cycling between 50°C and 400°C the highest tensile stress is found in AIVPd. In a subsequent experiment, the cooling was interrupted at several temperatures to investigate the stress behavior during an eight hour isothermal treatment. Isothermal stress relaxation has been observed in the three types of films and is discussed.

MODELISATION DE L'INFLUENCE DU TRAITEMENT THERMIQUE SUR LES PROPRIETES MECANIQUES DES ALLIAGES ALUMINIUM-CUIVRE (Al-Cu)

2015 ◽  
Vol 10 (2) ◽  
pp. 2753-2761
Author(s):  
Saad El Madani ◽  
S. ELHAMZI ◽  
A. IBNLFASSI ◽  
L. ZERROUK ◽  
O. BEN LENDA ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Mechanical Behavior ◽  
Solidification Process ◽  
Traitement Thermique ◽  
Homogenization Process ◽  
Fundamental Reason ◽  
Segregation Phenomenon ◽  
Proprietes Mecaniques ◽  
Cooling Velocity ◽  
Copper Effect

In order to master and improve the quality and properties of the final products, the major industrial challenge lies in the possibility of controlling the morphology, size of microstructures that reside within the molded pieces, as well as their defects; this is the fundamental reason according to which we are more and more interested in mastering the growth and germination of such alloys, as well as the developing structures, at the time of solidification process. The modeling reveals as a valuable aid in the mastery of the formation of such heterogeneousness: segregation cells that are incompatible with industrial requirements.   The whole work focuses upon the modeling of the segregation phenomenon of the four hypoeutectic alloys, Al1%Cu, Al2%Cu, Al3%Cu et Al4%Cu, as well as the copper effect upon certain mechanical properties of aluminum. Usually, the microstructure and mechanical behavior of such alloys as Al-Cu are directly influenced by some parameters such as composition, cooling velocity and homogenization process.

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