Applications of MeV Ion Implantation in Semiconductor Device Manufacturing

1994 ◽  
Vol 354 ◽  
Author(s):  
John O. Borland
Keyword(s):  
Ion Implantation ◽  
Flash Memory ◽  
Mass Production ◽  
Cost Reduction ◽  
Semiconductor Device ◽  
Design Rule ◽  
Great Promise ◽  
Manufacturing Cost ◽  
Device Performance ◽  
The World

AbstractUse of MeV ion implantation for mass production of CMOS devices at 0.5um design rule and beyond is now being accepted around the world for 16Mb DRAM, 16Mb Flash memory and CMOS logic/microprocessor technologies. Incorporating MeV well formation for twin well and triple well results in a reduction of up to 3 masking layers corresponding to process simplification and manufacturing cost reduction of 10% to 16%. For CMOS logic application, a new structure called BILLI (Buriedjmplanted Layer for Lateral Isolation) is showing great promise for latch-up free CMOS and when combined with hydrogen denuded bulk Czochraliski (CZ) grown silicon wafers, has the potential to replace epitaxial wafers with improved device performance. This paper will review MeV ion implantation use for these various CMOS applications.

A robust CUP pad structure design with thin pad metal for Cu wire bonding

2010 ◽  
Vol 2010 (1) ◽  
pp. 000656-000660
Author(s):  
ChangHee Han ◽  
SG Kim ◽  
JH Shim ◽  
DH Jiang ◽  
SW Ko ◽  
...  
Keyword(s):  
Mechanical Stress ◽  
Semiconductor Device ◽  
Wire Bonding ◽  
Structure Design ◽  
Design Rule ◽  
Strength Analysis ◽  
Manufacturing Cost ◽  
Physical Damage ◽  
Chip Size ◽  
Major Factors

In order to save the manufacturing cost of ULSI semiconductor device, there are two significant approaches; shrinking chip size by adopting CUP Pad (circuit under pad) and reducing package cost by using Cu wire bonding as a substitute for Au wire. However, these two approaches have a conflict that CUP pad is more sensitive to higher mechanical stress induced by Cu wire bonding than mechanical stress from Au wire. Thick pad metal is a way to enhance the strength of CUP pad but it brings enlargement of top metal design rule, which can increase chip size. Therefore it is highly required to develop a robust CUP pad structure with thin pad metal in order to apply Cu wire bonding without any negative effect on chip size. This study deeply investigated on the crack in CUP pad structure of ULSI with thin top metal caused by high mechanical stress of Cu wire bonding. FIB cross-sectional analysis for the crack revealed how and where the crack is started and propagated over the whole pad. Mechanism of pad crack was discovered by strain and strength analysis on each film layer which forms bonding pad structure. Cu wire bonding experiment was performed with several pad structures at various bonding conditions, the outcome of the experiment delivered major factors to enhance the strength of pad structure against physical damage during Cu wire bonding process. This study concentrates on a robust CUP pad structure of ULSI with thin pad metal for Cu wire designed with considering the major factors.

Flexible Single-Crystalline GaN Substrate by Direct Deposition of III-N Thin Films on Polycrystalline Metal Tape

2021 ◽  
Author(s):  
Shahab Shervin ◽  
Mina Moradnia ◽  
Md Kamrul Alam ◽  
Tian Tong ◽  
Mi-Hee Ji ◽  
...  
Keyword(s):  
Performance Improvement ◽  
Flexible Electronics ◽  
Cost Reduction ◽  
Semiconductor Materials ◽  
Manufacturing Cost ◽  
Device Performance ◽  
Polycrystalline Metal ◽  
Group Iii ◽  
Device Stability ◽  
Metal Tape

Flexible electronics and mechanically bendable devices based on Group III-N semiconductor materials are emerging, while there are several challenges in manufacturing-cost reduction, device stability and flexibility, and device-performance improvement. To...

scholarly journals The Main Progress of Perovskite Solar Cells in 2020–2021

2021 ◽  
Vol 13 (1) ◽  
Author(s):  
Tianhao Wu ◽  
Zhenzhen Qin ◽  
Yanbo Wang ◽  
Yongzhen Wu ◽  
Wei Chen ◽  
...  
Keyword(s):  
Solar Cells ◽  
High Efficiency ◽  
Perovskite Solar Cells ◽  
Lead Free ◽  
Manufacturing Cost ◽  
Practical Application ◽  
The World ◽  
Photovoltaic Technology

AbstractPerovskite solar cells (PSCs) emerging as a promising photovoltaic technology with high efficiency and low manufacturing cost have attracted the attention from all over the world. Both the efficiency and stability of PSCs have increased steadily in recent years, and the research on reducing lead leakage and developing eco-friendly lead-free perovskites pushes forward the commercialization of PSCs step by step. This review summarizes the main progress of PSCs in 2020 and 2021 from the aspects of efficiency, stability, perovskite-based tandem devices, and lead-free PSCs. Moreover, a brief discussion on the development of PSC modules and its challenges toward practical application is provided.

Removing W Polymer Residue from BEOL Structures Using DSP+ (Dilute Sulfuric-Peroxide-HF) Mixture – A Case Study

2012 ◽  
Vol 195 ◽  
pp. 128-131 ◽  
Author(s):  
Hun Hee Lee ◽  
Min Sang Yun ◽  
Hyun Wook Lee ◽  
Jin Goo Park
Keyword(s):  
High Speed ◽  
Semiconductor Device ◽  
Environmental Issues ◽  
Low Power Consumption ◽  
Device Performance ◽  
Metal Gate ◽  
Feature Size ◽  
High K ◽  
Removal Of Metal

As the feature size of semiconductor device shrinks continuously, various high-K metals for 3-D structures have been applied to improve the device performance, such as high speed and low power consumption. Metal gate fabrication requires the removal of metal and polymer residues after etching process without causing any undesired etching and corrosion of metals. The conventional sulfuric-peroxide mixture (SPM) has many disadvantages like the corrosion of metals, environmental issues etc., DSP+(dilute sulfuric-peroxide-HF mixture) chemical is currently used for the removal of post etch residues on device surface, to replace the conventional SPM cleaning [. Due to the increased usage of metal gate in devices in recent times, the application of DSP+chemicals for cleaning processes also increases [.

scholarly journals The synthesis of novel BODIPY compounds for DSSC applications.

2021 ◽  
Author(s):  
Devin Douglas Machin
Keyword(s):  
Fine Tuning ◽  
Great Promise ◽  
Device Performance ◽  
Dye Molecules ◽  
Dye Sensitized ◽  
Redox Active ◽  
Boron Dipyrromethene ◽  
Photovoltaic Technologies ◽  
Active Donor ◽  
Dye Molecule

The dye-sensitized solar cell (DSSC) represents one of the most promising next-generation photovoltaic technologies. In addition, the DSSC manifold provides an exceptional platform to further appreciate photoinduced electron transfer and the fundamental features required for light-harvesting. The dye molecule is a key component in the DSSC and has achieved minor success utilizing both an organic and inorganic photosensitizers. DSSC’s show great promise owing to their inexpensive synthesis tunable optical and electrochemical properties, and a plethora of design possibilities. The typical anatomy of organic and inorganic DSSC dyes are comprised of a redox-active donor/chromophore (D) that is connected, through a conjugated linker (π), to an acceptor (A) capable of anchoring to titania (TiO2). Fine tuning each of these components can shift the absorption spectrum increasing the overall device efficiency. Boron-dipyrromethene (BODIPY) is an attractive moiety to integrate into DSSC dyes. BODIPY’s rigid organic framework should be able to improve dye stability while the high extinction coefficients of BODIPY based molecules have the potential to increase device performance. Herein, we explore the synthesis and physicochemical properties of BODIPY in an attempt to synthesize efficient DSSC dye molecules and efficient photovoltaic technologies.

scholarly journals Evaluation on the adoption of transportation e-marketplace in vietnam from the demand side’ viewpoint

2021 ◽  
Vol 72 (4) ◽  
pp. 437-451
Author(s):  
Dung Pham Xuan ◽  
Giang Hoang Huong ◽  
Ha Nguyen Thi Van
Keyword(s):  
Cost Reduction ◽  
Quantitative Research ◽  
Service Providers ◽  
Transport Service ◽  
Research And Practice ◽  
Supply Chain Efficiency ◽  
Operation Costs ◽  
The World ◽  
Logistics Process ◽  
Improve Supply Chain

Studying on transportation e-marketplaces (TEMs) has today received much concern because developing TEMs helps enterprises and their customers reduce operation costs and improve supply chain efficiency. This study evaluates the adoption of TEMs in Vietnam based on the demand side’s perspective, including the viewpoint of shippers and the Transport Service Providers (TSPs). While shippers and TSPs around the world are facing various issues related to transportation and logistics process in the competitive market, TEMs is a potential solution which can offer response to those challenges such as transaction cost reduction, better transport capability, inefficiency diminishment, … In Vietnam, TEMs is still a new concept with the limitation of usage, so that the number of researches on this topic is scarce. This study followed the quantitative research method via SPSS technique of data analysis to provide a brief view of TEMs adoption in Vietnam. These insights can make contribution to both research and practice in the future.

Using a satellite-aircraft hybrid system based on the same sensor to monitor oil and gas facilities for methane emissions

2021 ◽  
Vol 61 (2) ◽  
pp. 384
Author(s):  
Hanford J. Deglint ◽  
Warren D. Shaw ◽  
Jean-Francois Gauthier
Keyword(s):  
Hybrid System ◽  
Cross Validation ◽  
Oil And Gas ◽  
The United States ◽  
Methane Emissions ◽  
Great Promise ◽  
Performance Parameters ◽  
Satellite Measurements ◽  
The World ◽  
Imaging Camera

Monitoring methane emissions from oil and gas facilities requires the combination of several technologies to gain a full understanding of the challenge at a manageable cost. The integration of frequent and affordable high resolution satellite measurements to find the larger leaks with less frequent, but more expensive, aerial surveys, forms the basis of a tiered monitoring system showing great promise to optimise leak detection and repair activities. In this extended abstract, examples of methane emissions measurements from controlled releases and at oil and gas facilities acquired with both GHGSat’s second satellite, Iris (launched in September 2020) and the airborne variant of the same sensor are presented. While the combination of different technologies is not uncommon, this system is the first in the world utilising the same sensor at two different altitudes. The performance parameters of each system are highlighted and supported with recent examples. In addition, the advantages of the hybrid system will be discussed, including the opportunity for cross-validation of measurements. Finally, the potential of such a system to be used for regulatory reporting purposes will be discussed and contrasted to the standard of performing optical gas imaging camera campaigns three times a year used in some jurisdictions, notably in Canada and the United States.

Infrastructures and Ionograms

2017 ◽  
Keyword(s):  
Data Analysis ◽  
Mass Production ◽  
Automated System ◽  
Natural Order ◽  
The Core ◽  
Ground Station ◽  
Data Flows ◽  
The World ◽  
Formed Part ◽  
Global Data

This chapter explores how the Alouette satellite’s reorientation of global data flows and mass-production of ionograms altered the natural order at the core of DRTE’s research. The satellite’s unexpected reliability demanded an automated system of data analysis. Automation, when applied to the ionogram, effaced the complexity used to characterize the ionosphere above Canada and explain violent communications disruptions. The chapter first analyzes the debates over the organization of the satellite’s global ground station network, the control of the satellite, the collaboration with NASA, and the sharing of data. It then examines how these considerations formed part of the technical design of the satellite, and specifically how they required a system for mass-producing ionograms from global data gathered around the world. The chapter’s final section focuses on the resulting problems of data analysis that this system produced and the new reading techniques devised to analyze the overwhelming number of records.

Enhancing semiconductor device performance using ordered dopant arrays

Nature ◽  
2005 ◽  
Vol 437 (7062) ◽  
pp. 1128-1131 ◽  
Author(s):  
Takahiro Shinada ◽  
Shintaro Okamoto ◽  
Takahiro Kobayashi ◽  
Iwao Ohdomari
Keyword(s):  
Semiconductor Device ◽  
Device Performance
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