Interfacial Structure and Mechanical Properties of Compositionally-Modulated Au-Ni thin Films

1994 ◽  
Vol 343 ◽  
Author(s):  
Shefford P. Baker ◽  
James A. Bain ◽  
Bruce M. Clemens ◽  
William D. Nix
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Elastic Stiffness ◽  
Lattice Parameter ◽  
Film Plane ◽  
Interfacial Structure ◽  
X Ray Diffraction ◽  
Electron Image ◽  
Average Lattice ◽  
Interaction Stress

ABSTRACTSeveral characteristics of compositionally-modulated Au-Ni thin films have been observed to vary with composition wavelength for wavelengths between 0.9 and 4.0 nm. The average lattice parameter normal to the film plane displays a maximum, the elastic stiffness shows a minimum and the substrate interaction stress in the film goes through a compressive peak in this regime. These variations are all consistent with a model in which deviations from bulk behavior are confined to the interfaces in the material. In this paper, we present the results of microstructural analyses of these films. Symmetric and asymmetric θ–2θ x-ray diffraction scans were conducted with scattering vectors oriented at a variety of angles to the film normal. Rocking curve analyses were also conducted. Features arising from the composition modulation in symmetric scans are quite sharp. However, asymmetric scans and rocking curves indicate that these films have a relatively poor {111} texture. Data from all scans provide clear evidence that Au intermixes preferentially into Ni. These results are supported by computer simulations of the diffraction spectra and the results of electron-image and -diffraction analyses. These measurements provide a consistent explanation for the mechanical properties of these films.

Microstructure and Mechanical Properties of Cr1-xAlxN Coating

2012 ◽  
Vol 531 ◽  
pp. 3-6
Author(s):  
C.L. Zhong ◽  
L.E. Luo
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Magnetron Sputtering ◽  
Lattice Parameter ◽  
Reactive Magnetron ◽  
X Ray Diffraction ◽  
X Ray ◽  
Al Content ◽  
Compound Coating ◽  
Cubic Structure

A series of Cr1-xAlxN coatings were deposited by reactive magnetron sputtering. The content, microstructure and the hardness of the thin films were characterized respectively with energy dispersive X-ray spectroscopy (EDS), X-ray diffraction (XRD) and nanoindentor. The effect of Al content on the microstructure and hardness was studied. It was found that Cr1-xAlxN compound coating exhibits a cubic structure with (1 1 1) preferred orientations and that the lattice parameter of Cr1-xAlxN coatings decrease with the increase of Al content. The hardness of Cr1-xAlxN compound coating is higher than that of CrN and increases with the increase of Al content.

Mechanical properties of compositionally modulated Au-Ni thin films: Nanoindentation and microcantilever deflection experiments

1994 ◽  
Vol 9 (12) ◽  
pp. 3131-3144 ◽  
Author(s):  
Shefford P. Baker ◽  
William D. Nix
Keyword(s):  
Mechanical Properties ◽  
Elastic Stiffness ◽  
Lattice Parameter ◽  
Constant Thickness ◽  
Cantilever Beams ◽  
Strongly Correlated ◽  
Depth Sensing ◽  
Average Lattice ◽  
Micrometer Scale ◽  
Data Analysis Methods

The mechanical properties of compositionally modulated Au-Ni films were investigated by submicrometer depth-sensing indentation and by deflection of micrometer-scale cantilever beams. Films prepared by sputter deposition with composition wavelengths between 0.9 and 4.0 nm were investigated. Strength was found to be high and invariant with composition wavelength. Experimental and data analysis methods were developed to provide more accurate and precise measurements of elastic stiffness. Large enhancements in stiffness (the “supermodulus effect”) were not observed. Rather, relatively small but significant minima were observed at a composition wavelength of about 1.6 nm by both techniques. These variations were found to be strongly correlated with variations in the average lattice parameter normal to the plane of the film. Both structural and mechanical property variations are consistent with a simple model in which the film consists of bulk-like Au and Ni layers with interfaces of constant thickness.

Mechanical Properties of Compositionally Modulated Au-Ni thin films using Indentation and Microbeam Deflection Techniques

1990 ◽  
Vol 188 ◽  
Author(s):  
Shefford P. Baker ◽  
Alan F. Jankowski ◽  
Soonil Hong ◽  
William D. Nix
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Narrow Range ◽  
Structural Characteristics ◽  
Lattice Parameter ◽  
Beam Deflection ◽  
Test Material ◽  
Si Substrates ◽  
Indentation Tests ◽  
Average Lattice

ABSTRACTThe “supermodulus effect” has been reported as an anomalous increase of as much as several hundred percent in the elastic moduli of compositionally-modulated thin metal films in a narrow range of modulation wavelength. The direct measurement of this effect has, however, been limited due to the very small dimensions of the test material. The mechanical properties of compositionally-modulated Au-Ni thin films (one of the first systems in which the supermodulus effect was reported) were studied on their substrates by indentation and microbeam-deflection techniques using a Nanoindenter. The films were fabricated by alternately sputtering Au and Ni onto [100] Si substrates for the indentation tests and onto prefabricated SiO2 cantilever beams with an initial Cr layer (for adhesion) for the beam deflection tests. All of the films have strong [111] textures and exhibit the structural characteristics of the films for which the modulus enhancement was reported. In particular, an increase in the average lattice parameter normal to the plane of the film over a narrow range of modulation wavelengths near 2 nm was noted. The modulation wavelengths range from 0.8 to 4.5 nm. The results from both indentation and microbeam deflection tests reveal no unusual plastic or elastic properties in these samples.

scholarly journals Elaboration of nitride thin films by reactive sputtering

2006 ◽  
Vol 59 (2) ◽  
pp. 225-232 ◽  
Author(s):  
Pierre Yves Jouan ◽  
Arnaud Tricoteaux ◽  
Nicolas Horny
Keyword(s):  
Thin Films ◽  
Compressive Stress ◽  
Bias Voltage ◽  
Substrate Surface ◽  
Lattice Parameter ◽  
X Ray Diffraction ◽  
X Ray ◽  
A Value ◽  
Dc Reactive Magnetron Sputtering ◽  
Nitrogen Contents

The aim of this paper is first a better understanding of DC reactive magnetron sputtering and its implications, such as the hysteresis effect and the process instability. In a second part, this article is devoted to an example of specific application: Aluminium Nitride. AlN thin films have been deposited by reactive triode sputtering. We have studied the effect of the nitrogen contents in the discharge and the RF bias voltage on the growth of AlN films on Si(100) deposited by triode sputtering. Stoichiometry and crystal orientation of AlN films have been characterized by means of Fourier-transform infrared spectroscopy, X-ray diffraction and secondary electron microscopy. Dense and transparent AlN layers were obtained at high deposition rates. These films have a (002) orientation whatever the nitrogen content in the discharge, but the best crystallised ones are obtained at low value (10%). A linear relationship was observed between the AlN lattice parameter "c" (perpendicular to the substrate surface) and the in-plane compressive stress. Applying an RF bias to the substrate leads to a (100) texture, and films become amorphous. Moreover, the film's compressive stress increases up to a value of 8GPa before decreasing slowly as the bias voltage increases.

Microstructure and Mechanical Properties of Chromium Carbide Coatings Deposited by Magnetron Sputtering Technique

2019 ◽  
Vol 397 ◽  
pp. 118-124
Author(s):  
Linda Aissani ◽  
Khaoula Rahmouni ◽  
Laala Guelani ◽  
Mourad Zaabat ◽  
Akram Alhussein
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Magnetron Sputtering ◽  
Structural Properties ◽  
Annealing Temperature ◽  
Diffusion Mechanism ◽  
X Ray Diffraction ◽  
Chromium Carbides ◽  
X Ray ◽  
Mechanical And Structural Properties

From the hard and anti-corrosions coatings, we found the chromium carbides, these components were discovered by large studies; like thin films since years ago. They were pointed a good quality for the protection of steel, because of their thermal and mechanical properties for this reason, it was used in many fields for protection. Plus: their hardness and their important function in mechanical coatings. The aim of this work joins a study of the effect of the thermal treatment on mechanical and structural properties of the Cr/steel system. Thin films were deposited by cathodic magnetron sputtering on the steel substrates of 100C6, contain 1% wt of carbon. Samples were annealing in vacuum temperature interval between 700 to 1000 °C since 45 min, it forms the chromium carbides. Then pieces are characterising by X-ray diffraction, X-ray microanalysis and scanning electron microscopy. Mechanical properties are analysing by Vickers test. The X-ray diffraction analyse point the formation of the Cr7C3, Cr23C6 carbides at 900°C; they transformed to ternary carbides in a highest temperature, but the Cr3C2 doesn’t appear. The X-ray microanalysis shows the diffusion mechanism between the chromium film and the steel sample; from the variation of: Cr, Fe, C, O elements concentration with the change of annealing temperature. The variation of annealing temperature shows a clean improvement in mechanical and structural properties, like the adhesion and the micro-hardness.

Preparation of AlN thin films by means of CVD using iodide source under atmospheric pressure

2007 ◽  
Vol 1040 ◽  
Author(s):  
Hiroki Iwane ◽  
Naoki Wakiya ◽  
Naonori Sakamoto ◽  
Takato Nakamura ◽  
Hisao Suzuki
Keyword(s):  
Thin Films ◽  
Residual Stress ◽  
Sapphire Substrate ◽  
Atmospheric Pressure ◽  
Chemical Vapor ◽  
Lattice Parameter ◽  
X Ray Diffraction ◽  
Cross Sectional ◽  
X Ray ◽  
Aluminum Iodide

AbstractEpitaxial aluminum nitride (AlN) thin films were successfully prepared on the (0001) sapphire substrate by chemical vapor deposition (CVD) using aluminum iodide (AlI3) and ammonia (NH3) under atmospheric pressure at 750 ºC. The crystallographic relationship between AlN thin films and Al2O3 substrate is in the following; AlN(0001)//Al2O3(0001) and AlN[1010]//Al2O3[1120]. Lattice parameters of AlN thin film measured by X-ray diffraction revealed that c=0.498 and a=0.311 nm, respectively. Residual stress estimated by modified sin2ψ method was 0.38 GPa in compressive stress. Cross-sectional TEM observation revealed that an interlayer lies between the AlN films and the sapphire substrate. It was suggested that relaxation of residual stress caused by the mismatching of lattice parameter and thermal expansion coefficient was brought about by the interlayer.

RESIDUAL STRESS DEVELOPMENT IN CU THIN FILMS WITH AND WITHOUT AlN PASSIVATION BY CYCLIC PLANE BENDING

2010 ◽  
Vol 24 (15n16) ◽  
pp. 2530-2536
Author(s):  
MITSUHIKO SHINOHARA ◽  
TAKAO HANABUSA ◽  
KAZUYA KUSAKA
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Diffraction Method ◽  
Micro Electro Mechanical System ◽  
Passivation Layer ◽  
X Ray Diffraction ◽  
Cu Films ◽  
Cu Film ◽  
Bending Fatigue Test ◽  
Plane Bending

Since the thin film technology is applied to micro-machines, MEMS (micro electro-mechanical system), optical devices and others, the evaluation of mechanical properties in thin films becomes to be important. On the other hand, there are differences in mechanical properties between bulk materials and thin films, but studies in this field have not yet been made enough. The present paper reports on the evaluation of the mechanical properties of Cu thin films with and without AlN passivation layer. Specimens with different thickness of Cu film were subjected to cyclic plane bending fatigue test. Residual stresses developed in the Cu films were measured in a sequence of bending cycles using X-ray diffraction method in order to understand the effect of film thickness and passivation layer on mechanical properties of Cu thin films.

scholarly journals Microstructure, Stress and Texture in Sputter Deposited TiN Thin Films: Effect of Substrate Bias

2014 ◽  
Vol 996 ◽  
pp. 855-859 ◽  
Author(s):  
Jay Chakraborty ◽  
Tias Maity ◽  
Kishor Kumar ◽  
S. Mukherjee
Keyword(s):  
Thin Films ◽  
Film Growth ◽  
Profile Analysis ◽  
Lattice Parameter ◽  
Line Profile Analysis ◽  
Substrate Bias ◽  
X Ray Diffraction ◽  
Strain Anisotropy ◽  
X Ray ◽  
Tin Thin Films

Titanium nitride thin films deposited by reactive dc magnetron sputtering under various substrate bias voltages have been investigated by X-ray diffraction. TiN thin films exhibits lattice parameter anisotropy for all bias voltages. Preferential entrapment of argon atoms in TiN lattice has been identified as the major cause of lattice parameter anisotropy. Bombardment of argon ions during film growth has produced stacking faults on {111} planes of TiN crystal. Stacking fault probability increases with increasing substrate bias voltages. X-ray diffraction line profile analysis indicates strain anisotropy in TiN thin films. Diffraction stress analysis by d-sin2ψ method reveals pronounced curvature in the plot of inter-planar spacing (d) (or corresponding lattice parameter (a)) versus sin2ψ. Direction dependent elastic grain interaction has been considered as possible source of the observed anisotropic line broadening.

Effect of Deposition Time on Structure of TiAlN Thin Films Deposited by Reactive DC Magnetron Co-Sputtering

2017 ◽  
Vol 866 ◽  
pp. 318-321 ◽  
Author(s):  
Nirun Witit-Anun ◽  
Adisorn Buranawong
Keyword(s):  
Thin Films ◽  
Elemental Composition ◽  
Deposition Time ◽  
Lattice Parameter ◽  
X Ray Diffraction ◽  
X Ray ◽  
Titanium Aluminum ◽  
Titanium Aluminum Nitride ◽  
Deposited Films ◽  
Section Analysis

Titanium aluminum nitride (TiAlN) thin films were deposited by reactive DC magnetron co-sputtering technique on Si substrate. The effect of deposition time on the structure of the TiAlN films was investigated. The crystal structure, surface morphology, thickness and elemental composition were characterized by X-ray diffraction (XRD), field emission scanning electron microscopy (FE-SEM) and energy dispersive X-ray spectroscopy (EDS) technique, respectively. The results showed that, all the as-deposited films were formed as a (Ti,Al)N solid solution. The as-deposited thin films exhibited a nanostructure with a crystallite size of less than 30 nm. The film thickness increase from 115 nm to 329 nm, while the lattice parameter decrease from 4.206 Å to 4.196 Å, with increasing of the deposition time. Cross section analysis by FE-SEM showed compact columnar and dense morphology as a result of increasing the deposition time. The elemental composition of the as-deposited films varied with the deposition time.

Synthesis and Characterization of Amorphous Metallic Alloy Thin Films for MEMS Applications

2003 ◽  
Vol 806 ◽  
Author(s):  
Senthil N Sambandam ◽  
Shekhar Bhansali ◽  
Venkat R. Bhethanabotla
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Surface Morphology ◽  
X Ray Diffraction ◽  
Micro Electro Mechanical Systems ◽  
Force Microscopy ◽  
Target Composition ◽  
Atomic Force ◽  
Deposition Parameters ◽  
Afm Analysis

ABSTRACTMicrostructures of multi-component amorphous metallic glass alloys are becoming increasingly important due to their excellent mechanical properties and low coefficient of friction. In this work, thin films of Zr-Ti-Cu-Ni-Be have been deposited by DC magnetron sputtering in view of exploring their potential technological applications in fields such as Micro Electro Mechanical Systems (MEMS). Their structure, composition, surface morphology, mechanical properties viz., hardness and Young's modulus were analyzed using X-Ray Diffraction (XRD), Atomic Force Microscopy (AFM), Scanning Electron Microscopy (SEM) and Nanoindentation. Influence of the deposition parameters of sputtering pressure and power upon the composition and surface morphology of these films has been evidenced by SEM, and AFM analysis, showing that such a process yields very smooth films with target composition at low sputtering pressures. These studies are useful in understanding the multicomponent sputtering process.

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