High-Growth Rate a-Si:H Deposited by Hot-Wire CVD

1994 ◽  
Vol 336 ◽  
Author(s):  
P. Brogueira ◽  
V. Chu ◽  
J.P. Conde

ABSTRACTWe present a study of the optoelectronic and structural properties of a-Si:H deposited by Hot-Wire chemical vapor deposition (HW-CVD) from SiH4 and H2 at “Medium” (Tfil ≃ 1500°C) and “high” (Tfil ≃ 1900 °C) filament temperatures. For each tungsten filament temperature regime, the following deposition parameters are varied: (i) pressure (p ∼ 10−2 — 0.5 Torr); (ii) substrate temperature (Tsub ∼ 180 — 270 °C); (iii) silane flow rate (FsiH4 ∼ 1 — 10 ccm) and (iv) hydrogen flow rate (FH2 ∼ 0 — 10 seem). Films deposited at Tfil ∼ 1900 °C in a low pressure regime (p ∼ 2.7 × 10−2Torr) using flows of 5 sccm for both H2 and SiH4 had high deposition rates (rd ∼ 8 Ås−1). These films showed an optical bandgap, E9Tauc ≃ 1.7 eV, a dark conductivity σd ∼ 10−8Scm−1 with an activation energy Eα,σd ≃ 0.8 eV, and photoconductivity σph ≥ 10−5Scm−1 (σph ∼ 10−5). Films deposited at Tju = 1500 °C and p ≃ 0.3 Torr, showed 1.7 < E9Tauc < 2 eV, 10−5 < σd < 10−3Scm−1, 0.2 < Eα,σ d < 0.5 eV and σph/Σd < 102. For the same Tfit and p ∼ 3 × 10−2 — 0.1 Torr, the films show 1.7 < E9Tauc < 2 eV, 10−3 < Σd < 10−1Scm−1 and σph/σd < 1. Films deposited using molybdenum and rhenium filaments at Tfil ≃ 1900 °C show E9Tauc ≃ 1.7 eV and σd ∼ σph ∼ 10−7Scm−1

1997 ◽  
Vol 467 ◽  
Author(s):  
V. Chu ◽  
J. Jarego ◽  
H. Silva ◽  
T. Silva ◽  
M. Boucinha ◽  
...  

ABSTRACTHigh-quality thin film transistors (TFT) with hydrogenated amorphous silicon (a-Si:H) deposited by hot-wire (HW) chemical vapor deposition as the active layer at growth rates above 20 Å/s are compared to TFTs with a-Si:H deposited by RF glow discharge at 1 Å/s. The subgap absorption measured by the constant photocurrent method and steady-state photoconductivity measured between source and drain are used to characterize the a-Si:H in the TFT. The activation energy of the dark conductivity is measured as a function of the gate voltage to obtain the position of the Fermi level. The effect of a bias stress on the TFT transfer curve is obtained.


2001 ◽  
Vol 664 ◽  
Author(s):  
A. R. Middya ◽  
U. Weber ◽  
C. Mukherjee ◽  
B. Schroeder

ABSTRACTWe report on ways to develop device quality microcrystalline silicon (μc-Si:H) intrinsic layer with high growth rate by hot-wire chemical vapor deposition (HWCVD). With combine approach of controlling impurities and moderate H-dilution [H2/SiH4 ͌ 2.5], we developed, for the first time, highly photosensitive (103 μc-Si:Hfilms with high growth rate (>1 nm/s); the microstructure of the film is found to be close to amorphous phase (fc ͌ 46 ̻± 5%). The photosensitivity systematically decreases with fc and saturates to 10 for fc> 70%. On application of these materials in non-optimized pin [.proportional]c-Si:H solar cell structure yields 700 mV open-circuit voltage however, surprisingly low fill factor and short circuit current. The importance of reduction of oxygen impurities [O], adequate passivation of grain boundary (GB) as well as presence of inactive GB of (220) orientation to achieve efficient [.proportional]c-Si:H solar cells are discussed.


2003 ◽  
Vol 762 ◽  
Author(s):  
Yueqin Xu ◽  
Brent P. Nelson ◽  
D.L. Williamson ◽  
Lynn M. Gedvilas ◽  
Robert C. Reedy

AbstractWe have found that narrow-bandgap—1.25 < Tauc Gap < 1.50 eV—amorphous silicon germanium (a-SiGe:H) alloys grown by hot-wire chemical vapor deposition (hot-wire CVD) can be improved by lowering both substrate and filament temperatures. We systematically study films deposited using a one-tungsten filament, decreasing filament temperature (Tf) from our standard temperature of 2150° down to 1750°C, and fixing all other deposition parameters. By decreasing Tfat the fixed substrate temperature (Ts) of 180°C, the Ge-H bonding increases, whereas the Si-H2bonding is eliminated. Films with higher Ge-H bonding and less Si-H2have improved photoconductivity. For the series of films deposited using the same germane gas fraction at 35%, the energy where the optical absorption is 1x104(E04) drops from 1.54 to 1.41 eV with decreasing Tf. This is mainly due to the combination of an increasing Ge solid fraction (x) in the film, and an improved homogeneity and compactness due to significant reduction of microvoids, which was confirmed by small angle X-ray scattering (SAXS). We also studied a series of films grown by decreasing the Tsfrom our previous standard temperature of 350°C down to 125°C, fixing all other deposition parameters including Tfat 1800°C. By decreasing Ts, both the total hydrogen content (CH) and the Ge-H bonding increased, but the Si-H2bonding is not measurable in the Tsrange of 180°-300°C. The E04 increases from 1.40 to 1.51 eV as Tsdecreased from 350° to 125°C, mainly due to the increased total hydrogen content (CH). At the same time, the photo-to-dark conductivity ratio increases almost three orders of magnitude over this range of Ts.


1995 ◽  
Vol 377 ◽  
Author(s):  
Shuangying Yu ◽  
Sadanand Deshpande ◽  
Erdogan Gulari ◽  
Jerzy Kanicki

ABSTRACTIn this study, we have deposited polycrystalline silicon (poly-Si) thin films by hot-wire Chemical Vapor Deposition (CVD) using hydrogen and disilane as the reactive gases. We selectively activate hydrogen and let disilane bypass the hot tungsten filament assembly and enter the reactor downstream from hydrogen. This may provide a better process chemistry, and by this approach, we have deposited poly-Si films at a substrate temperature as low as 310°C and at a growth rate as high as 100 Å/min. The substrate temperature is more than 2000C lower and the growth rate is more than twice higher compared to those of LPCVD poly-Si films. The effect of hydrogen flow rate, disilane flow rate and substrate temperature on the deposition rate and structural properties of the polysilicon films are investigated. The deposited films are characterized by transmission electron microscopy, scanning electron microscopy, Raman spectroscopy and X-ray diffraction.


1997 ◽  
Vol 471 ◽  
Author(s):  
D. Endisch ◽  
K. Barth ◽  
J. Lau ◽  
G. Peterson ◽  
A. E. Kaloyeros ◽  
...  

ABSTRACTSrS:Ce is an important material for full color electroluminescent (EL) flat panel displays. Using a combination of SrS:Ce/ZnS:Mn and appropriate color filters high quality full color displays have been demonstrated [1]. Major issues for commercially viable process integration of SrS:Ce are the combination of high luminance, high growth rate, and process temperatures below 600°C for compatibility with low cost glass substrates. This work describes the process development and optimization of metal-organic chemical vapor deposition (MOCVD) of SrS:Ce. MOCVD is a promising candidate for deposition of SrS:Ce because it can provide the required growth rates and allows control of crystal structure and stoichiometry. Growth of SrS:Ce was performed in the temperature range from 400°C to 530°C using Sr(tmhd)2, Ce(tmhd)4, and H2S as precursors. The structure of the SrS:Ce was found to be strongly dependent on the H2S flow. A brightness of 15 fL and an efficiency of 0.22 lm/W has been achieved (40 V above threshold voltage, 60 Hz AC). Film analysis included Rutherford backscattering (RBS), X-ray diffraction (XRD), atomic force microscopy (AFM), and EL measurements. Results on the correlation between process parameters, film structure, grain size and EL performance will be presented.


2007 ◽  
Vol 989 ◽  
Author(s):  
Yasutoshi YASHIKI ◽  
Seiichi KOUKETSU ◽  
Shinsuke MIYAJIMA ◽  
Akira YAMADA ◽  
Makoto KONAGAI

AbstractEffects of boron doping on microcrystalline germanium carbon alloy (μc-Ge1-xCx:H) thin films have been investigated. We deposited boron-doped p-type μc-Ge1-xCx:H thin films by hot-wire chemical vapor deposition technique using hydrogen diluted monomethylgermane (MMG) and diborane (B2H6). A dark conductivity of 1.3 S/cm and carrier concentration of 1.7 x 1020 cm-3 were achieved with B2H6/MMG ratio of 0.1. Furthermore, the activation energy decreased from 0.37 to 0.037 eV with increasing B2H6/MMG ratio from 0 to 0.1. We also fabricated p-type μc-Ge1-xCx:H/n-type c-Si heterojunction diodes. The diodes showed rectifying characteristics. The typical ideality factor and rectifying ratio were 1.4 and 3.7 x 103 at ¡Ó 0.5 V, respectively.


2010 ◽  
Vol 1251 ◽  
Author(s):  
Denis Reso ◽  
Mindaugas Silinskas ◽  
Bodo Kalkofen ◽  
Marco Lisker ◽  
Edmund P. Burte

AbstractGe-Sb-Te (GST) thin films were deposited by chemical vapor deposition (CVD) and hot-wire chemical vapor deposition (HW CVD). Several precursor sets (tetraethylgermanium - trimethylantimony - dimethyltellurium (TEGe-TMSb-DMTe), tetraisopropylgermanium - triisopropylantimony - di-tertiarybutyltellurium (TiPGe-TiPSb-DtBTe) and tetraallylgermanium - triisopropylantimony - diisopropyltellurium (TAGe-TiPSb-DiPTe)) were tested for CVD. For the TEGe-TMSb-DMTe precursor set tellurium and germanium could be detected in the films for all deposition temperatures investigated, while Sb was found only in the films deposited at elevated temperature higher than 550 °C. The deposition temperature could be reduced by using two other precursor sets (TiPGe-TiPSb-DtBTe and TAGe-TiPSb-DiPTe). The Ge content, however, could not be sufficiently increased to obtain stoichiometric Ge2Sb2Te5 films. Therefore, the hot wire or catalytic method was applied to improve the decomposition of the precursors. In this case, the desired composition (e.g. Ge2Sb2Te5) was obtained at each investigated temperature by adjusting dosing and deposition parameters. Additionally, film roughness (as low as 2 nm) and deposition rates could be optimized by adjusting deposition temperature and pressure.


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