Microtribological Studies by Using Atomic Force and Friction Force Microscopy and its Applications

1994 ◽  
Vol 332 ◽  
Author(s):  
Bharat Bhushan ◽  
Vilas N. Koinkar ◽  
J. Ruan
Keyword(s):  
Single Crystal ◽  
Friction Force ◽  
Single Crystal Silicon ◽  
Test Duration ◽  
Friction Force Microscopy ◽  
Crystal Silicon ◽  
Wear Rates ◽  
Force Microscopy ◽  
Atomic Force ◽  
Nanoindentation Hardness

ABSTRACTWe have used atomic force microscopy (AFM) and friction force microscopy (FFM) techniques for microtribological studies including microscale friction, nanowear, nanoscratching and nanoindentation hardness measurements. The microscale friction studies on a gold ruler sample demonstrated that the local variation in friction correspond to a change of local surface slope, and this correlation is explained by a friction mechanism. Directionality effect is also observed as the sample was scanned in either direction. Nanoscratching, nanowear and nanoindentation hardness studies were performed on single-crystal silicon. Wear rates of single crystal silicon are approximately constant for various loads and test duration. Nanoindentation hardness studies show that AFM technique allows the hardness measurements of surface monolayers and ultra thin films in multilayered structures at very shallow depths and low loads. The AFM technique has also been shown to be useful for nanofabrication.

Experimental Study on the Surface Cutting Mechanical Properties of Single Crystal Silicon in Micro-Nano Scale

2015 ◽  
Vol 1088 ◽  
pp. 779-782
Author(s):  
Xiao Jing Yang ◽  
Yong Li ◽  
Wei Xing Zhang
Keyword(s):  
Mechanical Properties ◽  
Single Crystal ◽  
Cutting Force ◽  
Silicon Surface ◽  
Single Crystal Silicon ◽  
Constant Load ◽  
Crystal Silicon ◽  
Force Microscopy ◽  
Atomic Force ◽  
The Impact

The experiment of cutting mechanical properties of single crystal silicon surface in the micro-nanoscale is researched using nanoindenter and atomic force microscopy. The result of the experiment shows that: in the constant load, the impact of different scratching velocity for single crystal silicon surface scratch groove width and chip accumulation volume are not big; but the cutting force and friction coefficient are not increases with the scratching velocity increases; when the scratching speed is certain, the size of load has a greater impact on the cutting mechanical properties of single crystal silicon surface, with the increase of the load, the cutting force increases, but the cutting force is not linearly growth.

Scanning and transmission electron microscopies of single-crystal silicon microworn/machined using atomic force microscopy

1997 ◽  
Vol 12 (12) ◽  
pp. 3219-3224 ◽  
Author(s):  
Vilas N. Koinkar ◽  
Bharat Bhushan
Keyword(s):  
Electron Microscopy ◽  
Atomic Force Microscopy ◽  
Single Crystal ◽  
Single Crystal Silicon ◽  
Crystal Silicon ◽  
Plan View ◽  
Force Microscopy ◽  
Electron Microscopies ◽  
Atomic Force ◽  
Transmission Electron

Atomic force microscopy (AFM) is commonly used for microwear/machining studies of materials at very light loads. To understand material removal mechanism on the microscale, scanning electron microscopy (SEM) and transmission electron microscopy (TEM) studies were conducted on the microworn/machined single-crystal silicon. SEM studies of micromachined single-crystal silicon indicate that at light loads material is removed by ploughing. Fine particulate debris is observed at light loads. At higher loads, cutting type and ribbon-like debris were observed. This debris is loose and can be easily removed by scanning with an AFM tip. TEM images of a wear mark generated at 40 μN show bend contours in and around the wear mark, suggesting that there are residual stresses. Dislocations, cracks, or any special features were not observed inside or outside wear marks using plan-view TEM. Therefore, material is mostly removed in a brittle manner or by chipping without major dislocation activity, crack formation, and phase transformation at the surface. However, presence of ribbon-like debris suggests some plastic deformation as well.

Non Destructive Determination of the Threading Dislocation Density of Smooth Simox Substrates using Atomic Force Microscopy

2000 ◽  
Vol 6 (S2) ◽  
pp. 1088-1089
Author(s):  
A. Domenicucci ◽  
R. Murphy ◽  
D. Sadanna ◽  
S. Klepeis
Keyword(s):  
Atomic Force Microscopy ◽  
High Temperature ◽  
Single Crystal Silicon ◽  
Silicon Layer ◽  
High Dose ◽  
Threading Dislocation ◽  
Crystal Silicon ◽  
Force Microscopy ◽  
Atomic Force ◽  
High Temperature Anneal

Atomic force microscopy (AFM) has been used extensively in recent years to study the topographic nature of surfaces in the nanometer range. Its high resolution and ability to be automated have made it an indispensable tool in semiconductor fabrication. Traditionally, AFM has been used to monitor the surface roughness of substrates fabricated by separation by implanted oxygen (SIMOX) processes. It was during such monitoring that a novel use of AFM was uncovered.A SIMOX process requires two basic steps - a high dose oxygen ion implantation (1017 to 1018 cm-3) followed by a high temperature anneal (>1200°C). The result of these processes is to form a buried oxide layer which isolates a top single crystal silicon layer from the underlying substrate. Pairs of threading dislocations can form in the top silicon layer during the high temperature anneal as a result of damage caused during the high dose oxygen implant.

Interaction Force Between Thin Film Disk Media and Elastic Solids Investigated by Atomic Force Microscope

1990 ◽  
Vol 112 (3) ◽  
pp. 567-572 ◽  
Author(s):  
T. Miyamoto ◽  
R. Kaneko ◽  
Y. Ando
Keyword(s):  
Thin Film ◽  
Single Crystal ◽  
Single Crystal Silicon ◽  
Static Friction ◽  
Interaction Force ◽  
Elastic Solids ◽  
Crystal Silicon ◽  
Interaction Forces ◽  
Liquid Lubricant ◽  
Atomic Force

Atomic force microscopy is used to investigate the interaction force between the sharp tips of various elastic solids and four different samples. The samples are: thin film disk media coated with functional liquid lubricant having diol end groups, unlubricated disk media, a single-crystal silicon wafer, and Au evaporated onto single-crystal silicon. Relationships between the interaction and static friction force of disk media and a taper flat type head slider are examined. The interaction force between a disk medium coated with a functional liquid lubricant greater than 11.0 nm thick and tungsten tips with radii of 5 μm-100 μm is caused by the functional liquid lubricant meniscus, as pointed out by McFarlane and Tabor. However, at a thickness of several nanometers, the interaction force has a lower value than that for lubricant thicknesses above 11.0 nm. The interaction force has a minimum value of 0.4 μN at the functional liquid lubricant thickness of 2.0 nm. Mean interaction forces of the tungsten, Al2O3 − TiC and Si3N4 tips on a disk medium coated with a 2.0-nm-thick functional liquid lubricant are less than 0.1 times those for an unlubricated disk medium. Interaction forces of the SiC tip show very low values, even when the disk medium is unlubricated. Static friction force between a thin-film disk medium and a head or sphere is dependent on the interaction force between the medium and a tip that is made of the same material as the head or sphere. The use of an atomic force microscope (AFM), may allow the surface structure to be more thoroughly analyzed.

A Comparison of Lateral Calibration Techniques for Quantitative Friction Force Microscopy

2005 ◽  
Author(s):  
K. S. Kanaga Karuppiah ◽  
Sriram Sundararajan
Keyword(s):  
Friction Force ◽  
Lateral Force ◽  
Silicon Sample ◽  
Friction Force Microscopy ◽  
Friction Behavior ◽  
Force Microscopy ◽  
Atomic Force ◽  
Force Calibration ◽  
Calibration Techniques ◽  
Ultra High Molecular Weight

A comparison of two lateral force calibration techniques for friction force microscopy is presented. We used methods developed by Ogletree et.al. [1] and Ruan and Bhushan [2] to measure the friction response between the atomic force microscope (AFM) probe and a silicon sample and to obtain lateral force calibration factors. The factors were used to characterize the friction behavior and interfacial shear strength of a silicon nitride (Si3N4) probe-ultra high molecular weight polyethylene (UHMWPE) interface.

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