MeV Boron Implantation and Masking
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ABSTRACTBoron depth distributions are reported for MeV implants into silicon through a variety of masking materials. Silicon is implanted with boron through a 0.1-µm-thick layer of thermally grown silicon dioxide. Secondary ion mass spectrometry (SIMS) shows the projected ranges agree within 10% with data reported in the literature and with results from the computer program TRIM. Silicon dioxide, photoresist, and metal layers are used to mask the high-energy boron implants. The SIMS results indicate that TRIM overestimates the energy loss of MeV boron ions as they pass through photoresist and/or silicon dioxide.
2000 ◽
Vol 6
(2)
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pp. 205-211
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1984 ◽
Vol 88
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pp. 1963-1973
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2010 ◽
Vol 268
(11-12)
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pp. 1714-1717
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1991 ◽
Vol 9
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pp. 223-227
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