Electrical and Structural Properties of Cobalt Annealed on Silicon-Germanium Epilayers

1992 ◽  
Vol 281 ◽  
Author(s):  
G. Sarcona ◽  
F. Lin ◽  
M. K. Hatalis ◽  
A. F. Cserhati ◽  
Eva Austin ◽  
...  
Keyword(s):  
Silicon Germanium ◽  
Sige Layer ◽  
Dc Magnetron Sputtering ◽  
Sheet Resistivity ◽  
Resistivity Measurements ◽  
Transmission Electron ◽  
Structural And Electrical Properties ◽  
Heterojunction Diodes ◽  
Increasing Temperature ◽  
Anneal Temperature

ABSTRACTThe structural and electrical properties of cobalt annealed on heteroepitaxial, strained-layer silicon-germanium were studied by transmission electron microscopy, four-point-probe and four-terminal resistor resistivity measurements, and junction diodes. The I50nm thick epitaxial p-Si0.87Ge0.13 was grown by UHV-CVD at 590°C. Cobalt was deposited by DC magnetron sputtering. The cobalt was rapid-thermally annealed at various temperatures in forming gas.The cobalt film and the SiGe layer reacted, as illustrated by changes in their film thicknesses, and increased interfacial roughness. The roughness and reacted-film thickness increased with increasing temperature. The sheet resistances of the samples were dependant on the anneal temperature and time. Films formed by annealing at 700°C, 3 min, were 80nm thick, and had 2.8ω/sq sheet resistivity, corresponding to 20μω-cm resistivity. The contact was ohmic, with contact resistivity of l.6×10−4ω-cm2. SiGe/ Si heterojunction diodes contacted by the reacted film, containing Co, Si, and Ge, were compared to diodes contacted by aluminum.

Observations of Damage and Transport of Hydrogen in Ion Bombarded Polycrystalline Silicon

1984 ◽  
Vol 33 ◽  
Author(s):  
D. J. Sharp ◽  
J. K. G. Panitz ◽  
C. H. Seager
Keyword(s):  
Polycrystalline Silicon ◽  
Ion Beam ◽  
Columnar Structure ◽  
Hydrogen Transport ◽  
Transport Mechanisms ◽  
Sheet Resistivity ◽  
Near Surface ◽  
Resistivity Measurements ◽  
Transmission Electron ◽  
Defect Passivation

ABSTRACTA combination of chemical etching and sheet resistivity measurements showed that intense (1.4 mA/cm2 ) low energy (1400 eV) ion beam hydrogenation of polycrystalline silicon having a columnar structure can produce electrical defect passivation to depths in the order of 100 μm. Transmission electron micrographs disclose surface and near-surface features resulting from the ion beam bombardment which suggest that one of the hydrogen transport mechanisms may be defect induced.

The Characterization of Initial Growth of Polycrystalline Silicon Germanium Films on Zirconium Oxide

2001 ◽  
Vol 686 ◽  
Author(s):  
Dong-Won Kim ◽  
Freek Prins ◽  
Kil-Soo Ko ◽  
C. H. Lee ◽  
Dim-Lee Kwong ◽  
...  
Keyword(s):  
Surface Roughness ◽  
Photoelectron Spectroscopy ◽  
Silicon Germanium ◽  
Interface Reaction ◽  
Chemical Vapor ◽  
Sige Layer ◽  
Growth Characteristics ◽  
Initial Growth ◽  
Temperature Range ◽  
Transmission Electron

AbstractIn this study, the initial growth characteristics of a SiGe film realized by ultrahigh-vacuum chemical vapor deposition (UHV CVD) using GeH4 and Si2H6 on high-K gate oxide, ZrO2, has been investigated in the temperature range from 475°C to 550°C. The influence of surface reactions on growth characteristics such as the incubation of growth, roughness of the SiGe layer, and the interface reaction of the SiGe film with ZrO2were studied using atomic force microscopy (AFM), X-ray photoelectron spectroscopy (XPS) and transmission electron microscopy (TEM). From our analysis we conclude that ZrO2 reacts with Si and forms zirconium silicide in the temperature range between 500°C and 550°C. The surface roughness of amorphous SiGe layers increase from 0.5nm to 1.5nm by increasing Ge content from 0.1 to 0.3. A further increase of surface roughness is observed from less than 1nm to 5nm as SiGe layer transitions from an amorphous to a poly crystalline layer.

Low-Temperature LPCVD MEMS Technologies

2002 ◽  
Vol 729 ◽  
Author(s):  
Roger T. Howe ◽  
Tsu-Jae King
Keyword(s):  
Silicon Germanium ◽  
Polycrystalline Silicon ◽  
Rf Mems ◽  
Sige Layer ◽  
Copper Metallization ◽  
Si Films ◽  
P Type ◽  
Mems Process ◽  
Post Deposition

AbstractThis paper describes recent research on LPCVD processes for the fabrication of high-quality micro-mechanical structures on foundry CMOS wafers. In order to avoid damaging CMOS electronics with either aluminum or copper metallization, the MEMS process temperatures should be limited to a maximum of 450°C. This constraint rules out the conventional polycrystalline silicon (poly-Si) as a candidate structural material for post-CMOS integrated MEMS. Polycrystalline silicon-germanium (poly-SiGe) alloys are attractive for modular integration of MEMS with electronics, because they can be deposited at much lower temperatures than poly-Si films, yet have excellent mechanical properties. In particular, in-situ doped p-type poly-SiGe films deposit rapidly at low temperatures and have adequate conductivity without post-deposition annealing. Poly-Ge can be etched very selectively to Si, SiGe, SiO2 and Si3N4 in a heated hydrogen peroxide solution, and can therefore be used as a sacrificial material to eliminate the need to protect the CMOS electronics during the MEMS-release etch. Low-resistance contact between a structural poly-SiGe layer and an underlying CMOS metal interconnect can be accomplished by deposition of the SiGe onto a typical barrier metal exposed in contact windows. We conclude with directions for further research to develop poly-SiGe technology for integrated inertial, optical, and RF MEMS applications.

Microstructural Evolution of AI/Ni and Ni/AI Bilayer Thin Films

1990 ◽  
Vol 202 ◽  
Author(s):  
J. A. Barnard ◽  
E. Haftek ◽  
A. Waknis ◽  
M. Tan
Keyword(s):  
Electron Microscopy ◽  
Thin Films ◽  
Electron Diffraction ◽  
Microstructural Evolution ◽  
Interplanar Spacing ◽  
Dc Magnetron Sputtering ◽  
Varying Thickness ◽  
Transmission Electron ◽  
Reverse Sequence ◽  
Carbon Coated

ABSTRACTThe growth and microstructural evolution of Al/Ni and Ni/AI bilayer thin films have been investigated as a function of Al and Ni layer thickness and thermal treatment by transmission electron microscopy. Studies were also made of Al and Ni single layers of varying thickness. All films were grown by dc magnetron sputtering using carbon coated Cu TEM grids as substrates. For the bilayers, the Al thickness was fixed at either 3.5 or 7.0 nm while the Ni thickness was varied systematically from 3.2 to 12.8 nm. Deposition sequence significantly influenced bilayer microstructure even in as-deposited samples. Al/Ni bilayers generally exhibited a finer microstructure than Ni/AI. In the 3.5 nm Al/Ni bilayers no conclusive electron diffraction evidence was found for elemental Al while for the reverse sequence both Al and NiAl3 diffraction rings were found. In the 7.0 nm Al/Ni bilayers diffraction rings due to Al were observed. The reverse sequence again produced both Al and NiAl3 diffraction rings. Interestingly, diffraction rings due to the Ni layers were found for all samples but were consistently measured at positions corresponding to a 2.5–3.5% increase in interplanar spacing. Annealing at 385°C produced evidence for generalized grain growth and strong accentuation of the electron diffraction rings due to the NiAl3 phase. Again, deposition significantly influenced annealed bilayer microstructure. For the Al/Ni sequence annealing produced polycrystalline N1AI3 island-like structures, while for Ni/AI bilayers, annealing promoted the growth of small NiAl3 crystals uniformly distributed in the film.

Effects of fluorine incorporation on the structural and electrical properties of Diamond-like carbon

2015 ◽  
Vol 1734 ◽  
Author(s):  
Kento Nakanishi ◽  
Jun Otsuka ◽  
Masanori Hiratsuka ◽  
Chen Chung Du ◽  
Akira Shirakura ◽  
...  
Keyword(s):  
Thin Film ◽  
Solar Cells ◽  
Electrical Properties ◽  
Flow Rate ◽  
Gas Flow ◽  
Diamond Like Carbon ◽  
Gas Flow Rate ◽  
Sheet Resistivity ◽  
Nitrogen Doped ◽  
Structural And Electrical Properties

ABSTRACTDiamond-like carbon (DLC) has widespread attention as a new material for its application to thin film solar cells and other semiconducting devices. DLC can be produced at a lower cost than amorphous silicon, which is utilized for solar cells today. However, the electrical properties of DLC are insufficient for this purpose because of many dangling bonds in DLC. To solve this problem, we investigated the effects of the fluorine incorporation on the structural and electrical properties of DLC.We prepared five kinds of fluorinated DLC (F-DLC) thin film with different amounts of fluorine. Films were deposited by the radio-frequency plasma enhanced chemical vapor deposition (RF-PECVD) method. C6H6 and C6HF5 were used as source gases. The total gas flow rate was constant and the gas flow rate ratio R (=C6H6 / (C6H6 + C6HF5)) was changed from 0 to 1 in 0.25 ratio steps. We also prepared nitrogen doped DLC (F-DLC) on p-Si using N2 gas as a doping gas to form nitrogen doped DLC (F-DLC) / p-Si heterojunction diodes.X-ray photoelectron spectroscopy (XPS) showed that fluorine concentration in the DLC films was controlled. Moreover, the XPS analysis of the C1s spectrum at R=2/4 showed the presence of CF bonding. At R=1, CF2 bonding was observed in addition to CF bonding. The sheet resistivity of the films changed from 3.07×1012 to 4.86×109 Ω. The minimum value was obtained at R=2/4. The current-voltage characteristics indicated that nitrogen doped F-DLC of 2/4 and p-Si heterojunction diode exhibited the best rectification characteristics and its energy conversion efficiency had been maximized. This is because of a decrease of dangling bonds density by ESR analysis and an increase of sp2 structures by Raman analysis. When the fluorine is over certain content, the sheet resistivity increases because chain structures become larger, which is due to the CF2 bonding in F-DLC prevents ring structures. Many C2F4 species were observed and it may become precursors of the chain structure domains, such as (CF2)n.In this study, we revealed effects of fluorine incorporation on DLC and succeeded in increasing its conductivity and improving rectification characteristics of DLC/ p-Si hetero-junction diodes. Our results indicate that DLC fluorination is effective for the semiconducting material, such as solar cell applications.

scholarly journals Structural and Electrical Properties of ZnO Varistor with Different Particle Size for Initial Oxides Materials

2019 ◽  
Vol 2 (2) ◽  
pp. 20-31 ◽  
Author(s):  
Susan A Amin
Keyword(s):  
Electrical Conductivity ◽  
Particle Size ◽  
Nonlinear Coefficient ◽  
Hexagonal Wurtzite Structure ◽  
The Other ◽  
Breakdown Field ◽  
Residual Voltage ◽  
Structural And Electrical Properties ◽  
Increasing Temperature ◽  
Initial Starting

We report here structural, electrical and dielectric properties of ZnO varistors prepared with two different particle sizes for initial starting oxides materials (5 µm and 200 nm). It is found that the particle size of ZnO does not influence the hexagonal wurtzite structure of ZnO, while the lattice parameters, crystalline diameter, grain size and Zn-O bond length are affected. The nonlinear coefficient, breakdown field and barrier height are decreased from 18.6, 1580 V/cm and 1.153 eV for ZnO micro to 410 V/cm, 7.26 and 0.692 eV for ZnO nano.  While, residual voltage and electrical conductivity of upturn region are increased from 2.08 and 2.38x10-5 (Ω.cm)-1 to 4.55 and 3.03x10-5 (Ω.cm)-1. The electrical conductivity increases by increasing temperature for both varistors, and it is higher for ZnO nano than that of ZnO micro.  The character of electrical conductivity against temperature is divided into three different regions over the temperature intervals as follows; (300 K ≤ T ≤ 420 K), (420 K ≤ T ≤ 580 K) and (580 K ≤ T ≤ 620 K), respectively. The activation energy is increased in the first region from 0.141 eV for ZnO micro to 0.183 eV for ZnO nano and it is kept nearly constant in the other two regions. On the other hand, the average conductivity deduced through dielectric measurements is increased from 2.54x10-7 (Ω.cm)-1 for ZnO micro to 49x10-7 (Ω.cm)-1. Similar behavior is obtained for the conductivities of grains and grain boundaries. The dielectric constant decreases as the frequency increases for both varistors, and it is higher for ZnO nano than that of ZnO micro. These results are discussed in terms of free excited energy and strength of link between grains of these varistors.

In situ transmission electron microscope measurements of solid Al-solid Pb and solid Al-liquid Pb surface-energy anisotropy in rapidly solidified Al-5% Pb (by mass)

1987 ◽  
Vol 414 (1847) ◽  
pp. 499-507 ◽  
Keyword(s):  
Electron Microscope ◽  
Melting Point ◽  
Surface Energy ◽  
Transmission Electron Microscope ◽  
Room Temperature ◽  
Transmission Electron ◽  
Increasing Temperature ◽  
Rapidly Solidified ◽  
Al Matrix

Alloys of Al-5% Pb and Al-5% Pb-0.5% Si (by mass) have been manufactured by rapid solidification and then examined by transmission electron microscopy. The rapidly solidified alloy microstructures consist of 5-60 nm Pb particles embedded in an Al matrix. The Pb particles have a cube-cube orientation relation with the Al matrix, and are cub-octahedral in shape, bounded by {100} Al, Pb and {111} Al, Pb facets. The equilibrium Pb particle shape and therefore the anisotropy of solid Al-solid Pb and solid Al-liquid Pb surface energies have been monitored by in situ heating in the transmission electron microscope over the temperature range between room temperature and 550°C. The ani­sotropy of solid Al-solid Pb surface energy is constant between room temperature and the Pb melting point, with a {100} Al, Pb surface energy about 14% greater than the {111} Al, Pb surface energy, in good agreement with geometric near-neighbour bond energy calculations. The {100} AI, Pb facet disappears when the Pb particles melt, and the anisotropy of solid Al-liquid Pb surface energy decreases gradually with increasing temperature above the Pb melting point, until the Pb particles become spherical at about 550°C.

Microstructural Characterization of Pt/Ti and RuO2 Electrodes on SiO2/Si Annealed in the Oxygen Ambient

1996 ◽  
Vol 433 ◽  
Author(s):  
Jeong Soo Lee ◽  
Hyun JA Kwon ◽  
Young Woo Jeong ◽  
Hyun HA Kim ◽  
Kyu HO Park ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Film Surface ◽  
Microstructural Characterization ◽  
Silicide Phase ◽  
X Ray Diffraction ◽  
Transmission Electron ◽  
Degree Of Oxidation ◽  
Thin Interlayer ◽  
Increasing Temperature

AbstractMicrostructures and interdiffusions of Pt/Ti/SiO2/Si and RuO2/SiO2/Si during annealing in O2 were investigated using x-ray diffraction, Auger electron spectroscopy, scanning electron microscopy, and transmission electron microscopy. The degree of oxidation and the interdiffusion of elements have remarkably increased with increasing temperature above 500 °C for the Pt/Ti/SiO2/Si case. The generation of Pt hillocks commenced at 500 °C. The Pt-silicide phase was also observed near the TiOx/SiO2 interface. The microstructural variations occurred to only a small amount for the RuO2/SiO2/Si case over the temperature range 300 – 700 °C. While there was no hillock formation, the RuO2 film surface was roughened by the thermal grooving phenomenon. A thin interlayer phase was found at the RuO2/SiO2 interface.

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