A Novel Process for Fabricating Force Sensors for Atomic Force Microscopy

1992 ◽  
Vol 276 ◽  
Author(s):  
M. M. Farooqui ◽  
A. G. R. Evans
Keyword(s):  
Single Crystal Silicon ◽  
Force Sensing ◽  
Precise Location ◽  
Crystal Silicon ◽  
Resonant Frequencies ◽  
Force Microscopy ◽  
Atomic Force ◽  
Highly Sensitive ◽  
Mask Design ◽  
Alignment Errors

ABSTRACTThe new technique of scanned force microscopy which enables imaging surface features with sub nanometre resolution has been made possible by the development of highly sensitive, hysteresis free force sensing cantilevers and the availability extremely sharp probing tips. Such cantilevers with integral tips can be micromachined using IC compatible technology, and several processes have been described in literature for their fabrication. These are based on different etching schemes, and require two or more masking stages. A novel process using a single mask is described here for the fabrication of single crystal silicon cantilevers with integral sensing tips. The cantilever thickness can be tailored to provide a range of force constants and resonant frequencies, and the tip profile can be varied from pyramidal to highly cusped. As only a single mask is used in the fabrication, there are no mask alignment errors and precise location of the tip is thereby achieved. This eliminates any twist in the cantilever during scanning which could give rise to distorted imaging. The complete fabrication process and the mask design is described together with SEM photographs of the first batch of devices, which have been evaluated by retrofitting to a commercial atomic force microscope.

Non Destructive Determination of the Threading Dislocation Density of Smooth Simox Substrates using Atomic Force Microscopy

2000 ◽  
Vol 6 (S2) ◽  
pp. 1088-1089
Author(s):  
A. Domenicucci ◽  
R. Murphy ◽  
D. Sadanna ◽  
S. Klepeis
Keyword(s):  
Atomic Force Microscopy ◽  
High Temperature ◽  
Single Crystal Silicon ◽  
Silicon Layer ◽  
High Dose ◽  
Threading Dislocation ◽  
Crystal Silicon ◽  
Force Microscopy ◽  
Atomic Force ◽  
High Temperature Anneal

Atomic force microscopy (AFM) has been used extensively in recent years to study the topographic nature of surfaces in the nanometer range. Its high resolution and ability to be automated have made it an indispensable tool in semiconductor fabrication. Traditionally, AFM has been used to monitor the surface roughness of substrates fabricated by separation by implanted oxygen (SIMOX) processes. It was during such monitoring that a novel use of AFM was uncovered.A SIMOX process requires two basic steps - a high dose oxygen ion implantation (1017 to 1018 cm-3) followed by a high temperature anneal (>1200°C). The result of these processes is to form a buried oxide layer which isolates a top single crystal silicon layer from the underlying substrate. Pairs of threading dislocations can form in the top silicon layer during the high temperature anneal as a result of damage caused during the high dose oxygen implant.

Experimental Study on the Surface Cutting Mechanical Properties of Single Crystal Silicon in Micro-Nano Scale

2015 ◽  
Vol 1088 ◽  
pp. 779-782
Author(s):  
Xiao Jing Yang ◽  
Yong Li ◽  
Wei Xing Zhang
Keyword(s):  
Mechanical Properties ◽  
Single Crystal ◽  
Cutting Force ◽  
Silicon Surface ◽  
Single Crystal Silicon ◽  
Constant Load ◽  
Crystal Silicon ◽  
Force Microscopy ◽  
Atomic Force ◽  
The Impact

The experiment of cutting mechanical properties of single crystal silicon surface in the micro-nanoscale is researched using nanoindenter and atomic force microscopy. The result of the experiment shows that: in the constant load, the impact of different scratching velocity for single crystal silicon surface scratch groove width and chip accumulation volume are not big; but the cutting force and friction coefficient are not increases with the scratching velocity increases; when the scratching speed is certain, the size of load has a greater impact on the cutting mechanical properties of single crystal silicon surface, with the increase of the load, the cutting force increases, but the cutting force is not linearly growth.

Microtribological Studies by Using Atomic Force and Friction Force Microscopy and its Applications

1994 ◽  
Vol 332 ◽  
Author(s):  
Bharat Bhushan ◽  
Vilas N. Koinkar ◽  
J. Ruan
Keyword(s):  
Single Crystal ◽  
Friction Force ◽  
Single Crystal Silicon ◽  
Test Duration ◽  
Friction Force Microscopy ◽  
Crystal Silicon ◽  
Wear Rates ◽  
Force Microscopy ◽  
Atomic Force ◽  
Nanoindentation Hardness

ABSTRACTWe have used atomic force microscopy (AFM) and friction force microscopy (FFM) techniques for microtribological studies including microscale friction, nanowear, nanoscratching and nanoindentation hardness measurements. The microscale friction studies on a gold ruler sample demonstrated that the local variation in friction correspond to a change of local surface slope, and this correlation is explained by a friction mechanism. Directionality effect is also observed as the sample was scanned in either direction. Nanoscratching, nanowear and nanoindentation hardness studies were performed on single-crystal silicon. Wear rates of single crystal silicon are approximately constant for various loads and test duration. Nanoindentation hardness studies show that AFM technique allows the hardness measurements of surface monolayers and ultra thin films in multilayered structures at very shallow depths and low loads. The AFM technique has also been shown to be useful for nanofabrication.

Electrostatic Aerosol Deposition Method for the Formation of an Ensemble of Monodisperse Particles on a Substrate

2016 ◽  
Vol 41 ◽  
pp. 53-62
Author(s):  
Alexey A. Efimov ◽  
Anna A. Lizunova ◽  
Elena G. Kalinina ◽  
Valentin S. Sukharev ◽  
Victor V. Ivanov
Keyword(s):  
Particle Density ◽  
Single Crystal Silicon ◽  
Aerosol Deposition ◽  
Crystal Silicon ◽  
Force Microscopy ◽  
Atomic Force ◽  
Transmission Electron ◽  
Aerosol Deposition Method ◽  
Single Crystal Silicon Substrate ◽  
Microscopy Data

We have developed an aerosol-based technique for deposition of monodisperse ensembles of spherical SiO2 nanoparticles on the surface of single-crystal silicon substrate (1 cm2) with an average surface particle density of about 2.1±0.4 particles per μm2. The obtained samples of monodisperse ensembles SiO2 nanoparticles was characterized by scanning and transmission electron microscopy. The ensemble of deposited nanoparticles is characterized by a narrow size distribution with a modal size of 26.6 nm and a full width at half maximum of 3.5 nm according to the atomic force microscopy data. We have demonstrated the use of the obtained test structure to determine the effective radius of the tip of an atomic force microscope.

scholarly journals Microstructure and Mechanical Properties of Electroplated Cu Thin Films

2000 ◽  
Vol 649 ◽  
Author(s):  
A.A. Volinsky ◽  
J. Vella ◽  
I.S. Adhihetty ◽  
V. Sarihan ◽  
L. Mercado ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Elastic Modulus ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Single Crystal Silicon ◽  
Tensile Tests ◽  
Crystal Silicon ◽  
Cu Films ◽  
Force Microscopy ◽  
Atomic Force

ABSTRACTCopper films of different thicknesses of 0.2, 0.5, 1 and 2 microns were electroplated on top of the adhesion-promoting barrier layers on <100> single crystal silicon wafers. Controlled Cu grain growth was achieved by annealing films in vacuum.The Cu film microstructure was characterized using Atomic Force Microscopy and Focused Ion Beam Microscopy. Elastic modulus of 110 to 130 GPa and hardness of 1 to 1.6 GPa were measured using the continuous stiffness option (CSM) of the Nanoindenter XP. Thicker films appeared to be softer in terms of the lower modulus and hardness, exhibiting a classical Hall-Petch relationship between the yield stress and grain size. Lower elastic modulus of thicker films is due to the higher porosity and partially due to the surface roughness. Comparison between the mechanical properties of films on the substrates obtained by nanoindentation and tensile tests of the freestanding Cu films is made.

Scanning and transmission electron microscopies of single-crystal silicon microworn/machined using atomic force microscopy

1997 ◽  
Vol 12 (12) ◽  
pp. 3219-3224 ◽  
Author(s):  
Vilas N. Koinkar ◽  
Bharat Bhushan
Keyword(s):  
Electron Microscopy ◽  
Atomic Force Microscopy ◽  
Single Crystal ◽  
Single Crystal Silicon ◽  
Crystal Silicon ◽  
Plan View ◽  
Force Microscopy ◽  
Electron Microscopies ◽  
Atomic Force ◽  
Transmission Electron

Atomic force microscopy (AFM) is commonly used for microwear/machining studies of materials at very light loads. To understand material removal mechanism on the microscale, scanning electron microscopy (SEM) and transmission electron microscopy (TEM) studies were conducted on the microworn/machined single-crystal silicon. SEM studies of micromachined single-crystal silicon indicate that at light loads material is removed by ploughing. Fine particulate debris is observed at light loads. At higher loads, cutting type and ribbon-like debris were observed. This debris is loose and can be easily removed by scanning with an AFM tip. TEM images of a wear mark generated at 40 μN show bend contours in and around the wear mark, suggesting that there are residual stresses. Dislocations, cracks, or any special features were not observed inside or outside wear marks using plan-view TEM. Therefore, material is mostly removed in a brittle manner or by chipping without major dislocation activity, crack formation, and phase transformation at the surface. However, presence of ribbon-like debris suggests some plastic deformation as well.

Probe-Type Microforce Sensor for Mirco/Nano Experimental Mechanics

2008 ◽  
Vol 33-37 ◽  
pp. 943-948 ◽  
Author(s):  
Xi De Li ◽  
Zhao Zhang
Keyword(s):  
Single Crystal Silicon ◽  
Force Sensor ◽  
Radius Of Curvature ◽  
Probe Type ◽  
Crystal Silicon ◽  
Atomic Force ◽  
Highly Sensitive ◽  
Small Force ◽  
Force Resolution ◽  
P Type

In recent years with the development of MEMS and NEMS, various micro and nano scale experiments are required. In general, the smaller the sample, the smaller the force is in the measurement. But it is difficult to load and measure such small force. We developed a probe-type loading and force sensor system to measure micro/nano samples. The system employs a semiconductor strain gauge of a cantilever type sensor and a micro manipulator. A highly sensitive, stable sensing cantilever beam made of single crystal silicon is ion implanted to form the P-type resistor (strain sensor). A tungsten probe with 100 nm radius of curvature was attached to the end of the cantilever as the micro loading tip. We constructed the measurement system and investigated its properties, such as linearity, dynamic response and stability. We also employed microspeckle interferometry to calibrate the force sensor. In preliminary experiments, we successfully obtained the force resolution 0.7 μN and applied our probe-type microforce sensor to calibrate an atomic force microscope (AFM) probe beam and test a single silkworm filament.

Diamond Tip Cantilever for Micro/Nano Machining Based on AFM

2006 ◽  
Vol 505-507 ◽  
pp. 79-84 ◽  
Author(s):  
Jeong Woo Park ◽  
Deug Woo Lee ◽  
Noboru Takano ◽  
Noboru Morita
Keyword(s):  
Silicon Substrate ◽  
Single Crystal Silicon ◽  
Industrial Applications ◽  
Crystal Silicon ◽  
Force Microscopy ◽  
Atomic Force ◽  
Scanning Path ◽  
Wet Chemical ◽  
Micro Cantilever ◽  
Micro Structures

Nano-scale fabrication of silicon substrate based on the use of atomic force microscopy (AFM) was demonstrated. A specially designed cantilever with diamond tip allows the formation of damaged layer on silicon substrate by a simple scratching process. A thin damaged layer forms in the substrate along scanning path of the tip. The damaged layer withstands against wet chemical etching in aqueous KOH solution. Diamond tip acts as a patterning tool like mask film for lithography process. Hence these sequential processes, called tribo-nanolithography, TNL, can fabricate 2D or 3D micro structures in nanometer range. This study demonstrates the fabrication processes of the micro cantilever and diamond tip as a tool for TNL. The developed TNL tools show outstanding machinability against single crystal silicon wafer. Hence, they are expected to have a possibility for industrial applications as a micro-to-nano machining tool.

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