Characteristics of Short-Channel Mosfet's in Laser Crystallized Si-on-Insulator

1983 ◽  
Vol 23 ◽  
Author(s):  
K. K. Ng ◽  
G. K. Celler ◽  
E. I. Povilonis ◽  
L. E. Trimble ◽  
S. M. Sze
Keyword(s):  
Low Temperature ◽  
Grain Boundaries ◽  
Bulk Material ◽  
Silicon On Insulator ◽  
Ring Oscillators ◽  
Short Channel ◽  
Furnace Annealing ◽  
Enhanced Diffusion ◽  
Channel Lengths ◽  
Temperature Furnace

ABSTRACTData are reported on short-channel MOSFET's fabricated in laser crystallized silicon-on-insulator (SOI) structures. In this experiment, special effort was made to minimize enhanced diffusion of dopants from the source and drain regions along grain boundaries. Instead of the standard anneal used for the implant activation, rapid thermal annealing and low temperature furnace annealing were used. These modified processes yielded functional MOSFET's with channel lengths as short as 1.5 μm, and ring oscillators of 2.0 μm. A speed of 115 ps per stage was obtained in these ring oscillators which is not only the fastest ever reported on any SOI structure, but also a factor of 2 faster than that from the same circuits in bulk Si. The results demonstrate quantitatively the speed improvement of SOI over bulk material due to reduced parasitic capacitance.

Silicon Bipolar Transistors Fabricated using Ion Implantation and Laser Annealing

1980 ◽  
Vol 1 ◽  
Author(s):  
Nobuyoshi Natsuaki ◽  
Takao Miyazaki ◽  
Makoto Ohkura ◽  
Toru Nakamura ◽  
Masao Tamura ◽  
...  
Keyword(s):  
Low Temperature ◽  
Laser Pulse ◽  
Laser Irradiation ◽  
Ruby Laser ◽  
Laser Annealing ◽  
Bipolar Transistors ◽  
Pulse Irradiation ◽  
Irradiation Effects ◽  
Furnace Annealing ◽  
Temperature Furnace

ABSTRACTBipolar transistors with laser annealed base and emitter, as well as those with furnace annealed base and laser annealed emitter, have been successfully fabricated using Q-switched ruby laser pulse irradiation. The performance of laser asannealed transistors is rather poor. However, it can be improved, to some extent, by relatively low temperature furnace annealing after laser irradiation. DC and RF characteristics of laser annealed transistors are presented in conjunction with laser irradiation effects on the characteristics of conventionally fabricated transistors.

Effect of Nitrogen Implants on Boron Transient Enhanced Diffusion

2000 ◽  
Vol 610 ◽  
Author(s):  
Omer Dokumaci ◽  
Paul Ronsheim ◽  
Suri Hegde ◽  
Dureseti Chidambarrao ◽  
Lahir Shaik-Adam ◽  
...  
Keyword(s):  
Low Temperature ◽  
Boron Diffusion ◽  
High Nitrogen ◽  
Enhanced Diffusion ◽  
Transient Enhanced Diffusion ◽  
High Boron ◽  
Buried Layer ◽  
Higher Doses ◽  
Low Nitrogen ◽  
Temperature Furnace

AbstractThe effect of nitrogen implants on boron transient enhanced diffusion was studied for nitrogen-only, boron-only, and boron plus nitrogen implants. A boron buried layer was used as a detector for interstitial supersaturation in the samples. Boron dose ranged from 1×1014 to 1×1015 cm−2 and N2+ dose from 5×1013 and 5×1014 cm−2. The energies were chosen such that the location of the nitrogen and boron peaks matched. After the implants, RTA and low temperature furnace anneals were carried out. The diffusivity enhancements were extracted from the buried layer profiles by simulation. Nitrogen-only implants were found to cause significant enhanced diffusion on the buried boron layer. For lower doses, the enhancement of the nitrogen implant is about half as that of boron whereas the enhancements are equal at higher doses. Nitrogen coimplant with boron increases the transient enhanced diffusion of boron at low boron doses, which implies that nitrogen does not act as a strong sink for excess interstitials unlike carbon. At high boron doses, nitrogen co-implant does not significantly change boron diffusion. Sheet resistance measurements indicate that low nitrogen doses do not affect the activation of boron whereas high nitrogen doses either reduce the activation of boron or the mobility of the holes.

Cobalt Contamination in Silicon

2005 ◽  
Vol 108-109 ◽  
pp. 571-576 ◽  
Author(s):  
Maria Luisa Polignano ◽  
Daniele Caputo ◽  
Davide Codegoni ◽  
Vittorio Privitera ◽  
M. Riva
Keyword(s):  
Low Temperature ◽  
Cobalt Concentration ◽  
High Concentration ◽  
Furnace Annealing ◽  
Type Silicon ◽  
P Type ◽  
Temperature Furnace

The properties of cobalt as a contaminant in p-type silicon are studied by using cobaltimplanted wafers annealed by RTP or by RTP plus a low temperature furnace annealing. It is shown that after RTP most cobalt is under the form of CoB pairs. A quantification of cobalt contamination is provided based upon SPV measurements and optical pair dissociation. However, this quantification fails in furnace-annealed wafers because of the formation of a different level. It is shown that the CoB level is located near the band edges, whereas the level formed upon a low temperature furnace annealing is located near midgap. Besides, when the cobalt concentration is high enough a small fraction of cobalt is in a level different from the CoB pair even in RTP samples. This level can probably be identified with a previously observed midgap level. It is suggested that the same level is formed in RTP plus low temperature furnace annealed samples and in high concentration RTP annealed samples, and that this level may consist in some cobalt agglomerate.

Transient Annealing of Boron Implanted Devices

1983 ◽  
Vol 23 ◽  
Author(s):  
S. R. Wilson ◽  
W. M. Paulson ◽  
C. J. Varker ◽  
A. Lowe ◽  
R. B. Gregory ◽  
...  
Keyword(s):  
Bipolar Transistors ◽  
Ring Oscillators ◽  
Short Channel Effects ◽  
Leakage Currents ◽  
Short Channel ◽  
Low Leakage ◽  
Channel Effects ◽  
Recombination Lifetimes ◽  
Implanted Devices ◽  
Temperature Furnace

ABSTRACTShallow-junction semiconductor devices have been fabricated using ion implantation and transient annealing with a Varian IA-200 isothermal annealer. Boron implanted diodes, npn bipolar transistors and CMOS ring oscillators have been fabricated and are compared to furnace annealed devices. Boron implanted diodes have been annealed with the RIA and yield acceptably low leakage currents, comparable to furnace annealed devices. The RIA devices have recombination lifetimes of ∼10 μsec. The bipolar transistors subjected to a transient anneal have good base-collector and emitterbase junctions as well as gains of ∼100 in good agreement with the design of the device. MOSFETs and CMOS ring oscillators were fabricated using self-aligned polysilicon gates. The transient annealed devices were equal or superior to devices which were furnace annealed at 800°C for 10 min. The low temperature furnace anneal was necessary to minimize short channel effects. The transient anneal resulted in ring oscillators which were a factor of two faster than furnace samples that were annealed.

Formation of NiSi-Silicided p + n Shallow Junctions Using Implant Through Silicide and Low Temperature Furnace Annealing

2003 ◽  
Vol 765 ◽  
Author(s):  
Chao-Chun Wang ◽  
Chiao-Ju Lin ◽  
Mao-Chieh Chen
Keyword(s):  
Activation Energy ◽  
Low Temperature ◽  
Thermal Annealing ◽  
Reverse Bias ◽  
Reverse Current ◽  
Furnace Annealing ◽  
Silicide Layer ◽  
Shallow Junctions ◽  
Higher Temperature ◽  
Temperature Furnace

AbstractNiSi-silicided p+n shallow junctions are fabricated using BF2+ implantation into/through thin NiSi silicide layer (ITS technology) followed by low temperature furnace annealing (from 550 to 800°C). The NiSi film agglomerates following a thermal annealing at 600°C, and may result in the formation of discontinuous islands at a higher temperature. The incorporation of fluorine atoms in the NiSi film can retard the formation of film agglomeration and thus improve the film's thermal stability. A forward ideality factor of about 1.02 and a reverse current density of about 1nA/cm2 can be attained for the NiSi(310Å)/p+n junctions fabricated by BF2+ implantation at 35 keV to a dose of 5×1015cm-2 followed by a 650°C thermal annealing; the junction formed is about 60nm measured from the NiSi/Si interface. Activation energy measurements show that the reverse bias junction currents are dominated by the diffusion current, indicating that most of the implanted damages can be recovered after annealing at a temperature as low as 650°C.

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