Low Pressure Mocvd Growth of InSb

1990 ◽  
Vol 216 ◽  
Author(s):  
B.T. Cunningham ◽  
R.P. Schneider ◽  
R.M. Biefeld
Keyword(s):  
Atmospheric Pressure ◽  
Chemical Vapor ◽  
Hole Mobility ◽  
Low Pressure ◽  
Lower Growth ◽  
Growth Pressure ◽  
Mocvd Growth ◽  
Partial Pressures ◽  
Low Pressure Mocvd ◽  
Sims Analysis

ABSTRACTLow pressure (200 Torr) metalorganic chemical vapor deposition (MOCVD) of InSb has been examined through variation of the Column III (TMIn) and Column V (TMSb or TESb) precursor partial pressures. The use of lower growth pressure significantly enhanced the range of allowable Column III and Column V partial pressures in which specular morphology InSb could be obtained without the formation of In droplets or Sb crystals. In addition, a 70% improvement in the average hole mobility was obtained, compared to InSb grown in the same reactor at atmospheric pressure. SIMS analysis revealed that Si at the substrate/epitaxial layer interface is an important impurity that may contribute to degradation of the mobility. Substitution of TESb for TMSb did not result in any improvement in the purity of the InSb.

Low Pressure MOCVD Growth and Characterization of GaAs and InP on Silicon Substrates

1988 ◽  
Vol 126 ◽  
Author(s):  
M. Razeghi ◽  
M. Defour ◽  
F. Omnes ◽  
J. Nagle ◽  
P. Maurel ◽  
...  
Keyword(s):  
Chemical Vapor ◽  
Low Pressure ◽  
Buffer Layers ◽  
Silicon Substrates ◽  
Misfit Dislocations ◽  
X Ray Diffraction ◽  
High Quality ◽  
Mocvd Growth ◽  
Vapor Deposition Technique ◽  
Low Pressure Mocvd

ABSTRACTHigh quality GaAs and InP have been grown on silicon substrates, using low pressure metalorganic chemical vapor deposition technique. The growth temperature is 550°C and the growth rate 100 A/min.Photoluminescence, X-ray diffraction and electrochemical profiling verified the high quality of these layers. The use of superlattices as buffer layers, (GaAs/GaInP) in the case of GaAs/Si and (GaInAsP/InP) in the case of InP/Si, decreased the amount of misfit dislocations in the epitaxial layer. Carrier concentrations as low as 5.1015 cm−3 have been measured by electrochemical profiling.

Low Pressure Mocvd Growth and Characterization of GaAs and InP on Silicon Substrates

1988 ◽  
Vol 116 ◽  
Author(s):  
M. Razeghi ◽  
M. Defour ◽  
F. Omnes ◽  
J. Nagle ◽  
P. Maurel ◽  
...  
Keyword(s):  
Chemical Vapor ◽  
Low Pressure ◽  
Buffer Layers ◽  
Silicon Substrates ◽  
Misfit Dislocations ◽  
X Ray Diffraction ◽  
High Quality ◽  
Mocvd Growth ◽  
Vapor Deposition Technique ◽  
Low Pressure Mocvd

AbstractHigh quality GaAs and InP have been grown on silicon substrates, using low pressure metalorganic chemical vapor deposition technique. The growth temperature is 550ºC andthe growth rate 100 A/min.Photoluminescence, X-ray diffraction and electrochemical profiling verified the high quality of these layers. The use of superlattices as buffer layers, (GaAs/GaInP) in the case of GaAs/Si and (GalnAsP/InP) in the case of InP/Si, decreased the amount of misfit dislocations in the epitaxial layer. Carrier concentrations as low as 5.1015 cm-3 have been measured by electrochemical profiling.

The Influence of Temperature Gradients on Partial Pressures in a Cvd Reactor

1993 ◽  
Vol 334 ◽  
Author(s):  
T.G.M. Oosterlaken ◽  
G.J. Leusink ◽  
G.C.A.M. Janssen ◽  
S. Radelaar ◽  
K.J. Kuijlaars ◽  
...  
Keyword(s):  
Soret Effect ◽  
Chemical Vapor ◽  
Low Pressure ◽  
Temperature Gradients ◽  
Gaseous Species ◽  
Model Calculations ◽  
Influence Of Temperature ◽  
Effect Model ◽  
Partial Pressures ◽  
Pressure Chemical

AbstractThe influence of temperature gradients on the partial pressures of a binary mixture in a cold wall low pressure chemical vapor deposition reactor was determined by Raman spectroscopy of the gaseous species in the reactor. It is demonstrated for the first time that the partial pressure of the heavy constituent in the hot region of a low pressure reactor is reduced by 35 % due to the Soret effect. Model calculations that included the Soret effect are in agreement with the experimental data.

Growth of Silicon-Germanium Alloys by Atmospheric-Pressure Chemical Vapor Deposition at Low Temperatures

1991 ◽  
Vol 220 ◽  
Author(s):  
P. D. Agnello ◽  
T. O. Sedgwick ◽  
M. S. Goorsky ◽  
J. Ott ◽  
T. S. Kuan ◽  
...  
Keyword(s):  
Silicon Germanium ◽  
Atmospheric Pressure ◽  
Chemical Vapor ◽  
Hole Mobility ◽  
Significant Feature ◽  
X Ray Diffraction ◽  
Transmission Electron ◽  
Pressure Chemical ◽  
Silicon Growth ◽  
Silicon Germanium Alloys

ABSTRACTDichlorosilanc and germane were used to grow silicon-germanium alloys at temperatures as low as 550°C at atmospheric pressure. Germanium mole fractions as high as 44% were obtained and the layers exhibit smooth surface morphology. Silicon-gcrmanium/silicon multilayers with abrupt hctero-intcrfaccs have been achieved. Cross Section Transmission Electron Microscopy, (XTEM) and High Resolution X-Ray Diffraction, (HRXRD) characterization of the hetero-interface abruptness will be presented. Recent results on two-dimensional (2-D) hole mobility structures grown by this technique will also be reported. Selective growth of silicon-germanium on oxide patterned silicon wafers was also demonstrated. A significant feature of the selective deposition is the lack of faceting at the oxide sidcwall, which has been commonly observed in high temperature silicon growth.

Low Pressure CVD Growth of AlxTi1-xN Films with Tetrakis- (Dimethylamido)Titanium (Tdmat) and Dimethyl Aluminum Hydride (DMAH) Precursors

1997 ◽  
Vol 495 ◽  
Author(s):  
Y.-M. Sun ◽  
J. Endle ◽  
J. G. Ekerdt ◽  
N. M. Russell ◽  
M. D. Healy ◽  
...  
Keyword(s):  
Photoelectron Spectroscopy ◽  
Film Growth ◽  
Aluminum Hydride ◽  
Chemical Vapor ◽  
Initial Growth ◽  
Lower Growth ◽  
Al Content ◽  
Partial Pressures ◽  
Cvd Growth ◽  
C And N

ABSTRACTAlxTi1-xN film growth has been studied by a organometallic chemical vapor deposition and in-situ X-ray photoelectron spectroscopy. Terakis(dimethylamido)titanium (TDMAT) and dimethyl aluminum hydride (DMAH) were used as the Ti, N and Al precursors. AlTiN film growth was observed on SiO2/Si(100) with substrate temperatures between 200 and 400 °C. The Al content in the film is controlled by the ratio of partial pressures of the two precursors in the gas phase. The metal to C to N ratio is approximately constant at 1:1:1 for most conditions studied. The chemical states of Ti, C, and N in AlxTi1-xN and titanium-carbo-nitride (TiCN) films are identical, while the Al chemical state is nitride at low, but increasingly carbidic at high Al concentration. The initial growth rate on SiO2 was significantly suppressed by the presence of DMAH. At lower growth temperatures, the DMAH effect is more severe. Good step coverage was observed for AlxTi1-xN on 0.3 μm vias with a 3:1 aspect ratio.

Rapid Thermal Low Pressure Metalorganic Chemical Vapor Deposition of InP and Related Materials

1993 ◽  
Vol 300 ◽  
Author(s):  
A. Katz ◽  
A. Feingold
Keyword(s):  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Low Temperatures ◽  
Metalorganic Chemical Vapor Deposition ◽  
Film Growth ◽  
Chemical Vapor ◽  
Hole Mobility ◽  
Low Pressure ◽  
Growth Conditions ◽  
Metalorganic Chemical

ABSTRACTHigh quality InP and In0.53Ga0.67As undoped and Zn-doped layers were grown by means of rapid thermal low pressure metalorganic chemical vapor deposition (RTLPMOCVD) technique, using tertiarybutylphosphine (TBP) and tertiarybutylarsine (TBA), as the phosphorus and arsenic sources. The InP films were grown at a P:In ratios of about 75 and the InGaAs films were grown at a As:In ration of about 2, low temperatures at the range of 450-550°C, pressures it the range of 1-4 tons, and growth rates of 2-3 nm/sec. All the film growth conditions were optimized to yield defect-free layers with featureless morphology, which reflected at a minimum backscattering yield (Xmin) as low as 3.1% for the InP and 3.6% for the InGaAs. These films presented a good electrical properties, as well, with hole mobility of 4200 cm2/Vs for the undoped-InP layers and 75 cm2/Vs for the undoped-InGaAs layers.

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