Control of Thin Film Materials Properties Used in High Density Multichip Interconnect

1989 ◽  
Vol 154 ◽  
Author(s):  
J.J.H. Rechell
Keyword(s):  
Thin Film ◽  
Process Development ◽  
Chemical Properties ◽  
High Density ◽  
Internal Stresses ◽  
Multichip Modules ◽  
Materials Properties ◽  
Physico Chemical ◽  
Substrate Properties ◽  
Organic Dielectric

AbstractMost literature on High Density Multichip Interconnect (HDMI) focuses almost exclusively on processing of the organic dielectric. Nevertheless, it is only one of the components in High Density Multichip Modules.Substrate properties, metal dielectric adhesion, internal stresses in the various films, and many other physico-chemical properties of the materials, can all be affected by neighbouring layers or process parameters improperly identified. Thus, in the course of process development, the real causes of difficulties and observed phenomenas can easily be misconstrued.This paper reviews some of the relationships between the properties of the thin film metallization and their effects on the dielectric layers. It also points out to some of the difficulties that can occur when treating the dielectric and the metallic layers as separate issues.

scholarly journals Thin-film materials based on phthalocyanine derivatives: structure and physico-chemical properties

2019 ◽  
Vol 30 ◽  
pp. 08006
Author(s):  
Alexandr Kazak ◽  
Margarita Marchenkova ◽  
Antonina Smirnova ◽  
Tatiana Dubinina ◽  
Alexey Seregin ◽  
...  
Keyword(s):  
Molecular Structure ◽  
Thin Film ◽  
Water Surface ◽  
Chemical Properties ◽  
Lattice Parameter ◽  
Complexing Agent ◽  
Supramolecular Organization ◽  
Structure Parameters ◽  
Physico Chemical ◽  
Layer Packing

In order to establish the effect of the molecular structure of mix-substituted phthalocyanine derivatives on its supramolecular organization in thin-films, the floating layers of three A3B-type phthalocyanine derivatives were obtained. Their supramolecular organization was determined and it was found that the studied compounds form homogeneous stable floating layers on the water surface. Structure parameters of floating layers depend both on the length of aliphatic substituents (R = CnH2n+1) and the metal complexing agent. Ligands I and II form stable monolayer structures, which the layer packing periods increase with the elongation of aliphatic substituents: the lattice parameter (d) is 1.93 and 2.3 nm for ligands I (n = 6) and II (n = 8), correspondingly. During further compression of the formed monolayers, ligands I and II form stable bilayers, in which the arrangement of molecules remains similar to the structure of the previous monolayers. These bilayers contain minor inclusions of 3D aggregates. Metal complex III forms only stable monolayer (d = 2.06 nm), upon further compression of which 3D- aggregates included in the monolayer are formed.

An Overview of Multichip Module Technology for low Power Applications

1992 ◽  
Vol 264 ◽  
Author(s):  
Chung W. Ho ◽  
Sharon McAfee-Hunter
Keyword(s):  
Thin Film ◽  
Low Power ◽  
Manufacturing Process ◽  
High Performance ◽  
Low Cost ◽  
High Density ◽  
Point Of View ◽  
Multichip Module ◽  
Multichip Modules

AbstractThin-film multichip modules (i.e. MCM-D) can provide simple, low-cost packaging and interconnect options for interconnecting high-density, high-performance devices. The following is an overview of an MCM-D technology that can be implemented on top of several substrate materials. Tradeoffs will be discussed related to using different substrate materials and the corresponding implications from the assembly point of view. The MCM-D manufacturing process is reviewed and the subsequent reliability results are discussed.

Dalbergia Congestiflora Standl.: Wood Structure And Physico-Chemical Properties Compared With Other Central American Species Of Dalbergia

IAWA Journal ◽  
1996 ◽  
Vol 17 (3) ◽  
pp. 327-341 ◽  
Author(s):  
Hans Georg Richter ◽  
Vlf-Joachim Krause ◽  
Claudia Muche
Keyword(s):  
Chemical Properties ◽  
High Density ◽  
Central American ◽  
Wood Structure ◽  
Physico Chemical ◽  
Ray Cells ◽  
Species Groups ◽  
Central American Species ◽  
Heartwood Extractives

Wood structure and selected physico-chemical properties of a rare Mexican species, tentatively identified as Dalbergia congestiflora, are described and compared with other Central American species of Dalbergia. On account of their distinct wood structure, four species groups can be distinguished: 1) D. granadillo, D. hypoleuca, D. lineata and D. retusa ('cocobolo') are characterised by mainly apotracheal diffuse-inaggregates parenchyma, large and few vessels, high density (0.89-1.35 g/cm3), identical heartwood colour, and chemical composition of extractives (D. granadillo, D. retusa); 2) D. tucuruensis (including D. cubitquitzensis) and D. palo-escrito are identical in all aspects but distinct from the coco bolo group on account of differences in parenchyma distribution, heartwood colour and extractives composition (D. tucuruensis), and the consistently lower density (~0.80 g/cm3); 3) D. congestiflora and D. funera (= D. calderonii) differ markedly in heartwood colour and somewhat in heartwood extractives composition but share a high density and similar wood structural pattern characterised primarily by relatively small and frequent vessels, banded parenchyma and the presence of prismatic crystals in ray cells; 4) D. stevensonii is very similar in wood structure to D. tucuruensis but has a much higher density and different heartwood extractives composition. These results indicate that the combination of wood structure and chemistry of heartwood extractives may be successfully employed for intrageneric classification of Dalbergia.

Changes in chemical composition and physico-chemical properties of chick low- and high-density lipoproteins induced by supplementation of coconut oil to the diet

Biochimie ◽  
1997 ◽  
Vol 79 (6) ◽  
pp. 333-340 ◽  
Author(s):  
E.M. Talavera ◽  
M.F. Zafra ◽  
A. Gil-Villarino ◽  
M.I. Pérez ◽  
J.M. Alvarez-Pez ◽  
...  
Keyword(s):  
Chemical Composition ◽  
Chemical Properties ◽  
Coconut Oil ◽  
High Density ◽  
High Density Lipoproteins ◽  
Physico Chemical

scholarly journals Small high density lipoprotein subclasses: some of their physico-chemical properties and stability in solution.

2005 ◽  
Vol 52 (2) ◽  
pp. 515-525 ◽  
Author(s):  
Ragheb F Atmeh ◽  
Issa O Abd Elrazeq
Keyword(s):  
Surface Charge ◽  
Diffusion Coefficients ◽  
Electrical Potential ◽  
Chemical Properties ◽  
Density Lipoprotein ◽  
Polyacrylamide Gel ◽  
High Density ◽  
High Density Lipoproteins ◽  
Physico Chemical ◽  
And Diffusion

Small high density lipoproteins (SHDL) contribute to the protection from atherosclerosis, but detailed information about their properties is not available yet. We isolated four of the smallest HDL subclasses that contain apoA-I alone, the small lipoprotein A-I (SLpAI), by their separation on gradient polyacrylamide gel followed by electroelution. Their physico-chemical properties were calculated from their displacement in non-denaturing gradient polyacrylamide gel under the effect of electrical potential. The properties are: Stokes' radii 2.96-3.56 nm; molecular masses 42-70 kDa; net negative charge 7.2-13.5; surface charge densities 3139-4069 -esu.cm(-2); surface potentials 10.6-15.7 -mV; coefficients of friction 5.74-6.90 x 10(-8) g.s(-1); and diffusion coefficients 5.76-6.94 x 10(-7) cm(2).s(-1). We found that these particles were of low stability as they underwent molecular transformation into larger particles on storage. The estimated dimensions of these particles do not support ellipsoidal shape, therefore, the most probable shape is spherical; consequently, their hydrated characteristics were estimated. We conclude that these particles have high values of negative surface charge and diffusion coefficients, and are of low stability. Their small Stokes' radii were similar to each other and they are spherical and highly hydrated.

scholarly journals Branched Synthetic Constructs that Mimic the Physico-Chemical Properties of Apolipoprotein AI in Reconstituted High-Density Lipoproteins

1996 ◽  
Vol 239 (1) ◽  
pp. 74-84 ◽  
Author(s):  
Ludovic Demoor ◽  
Christophe Boutillon ◽  
Catherine Fievet ◽  
Berlinda Vanloo ◽  
Johan Baert ◽  
...  
Keyword(s):  
Chemical Properties ◽  
High Density ◽  
High Density Lipoproteins ◽  
Apolipoprotein Ai ◽  
Physico Chemical

Characterization of Polymer Dielectrics for High-Density Electronic Packaging

1990 ◽  
Vol 203 ◽  
Author(s):  
David W. Wang ◽  
Ho-Ming Tong
Keyword(s):  
High Density ◽  
Multichip Modules ◽  
Circuit Boards ◽  
Plasma Etch ◽  
Materials Properties ◽  
Thermomechanical Characteristics ◽  
Low Dielectric ◽  
Polymer Dielectrics ◽  
And Function ◽  
Film Dielectric

ABSTRACTBecause of rapid advances in semiconductor technology, polymer dielectrics are finding widespread use in high-density packaging to improve performance and processability. Notable among these materials are polyimides, benzocyclobutene resins, and fluoropolymer containing composites.Polyimides have been used extensively for chip passivation and first-level packaging. Benzocyclobutenes, processed as conventional thermosets, are being investigated as thin film dielectric for use in multichip modules. A silicon containing derivative can be used as a plasma etch stop. Polytetrafluoroethylene is used either as matrix or reinforcement in circuit boards to produce a low dielectric constant composite.Knowledge of materials properties is crucial to ensure the reliability and function of products incorporating these polymers. In this article, a few selected characterization techniques for the determination of important materials properties such as solvent diffusion, plasma etch rate, and thermomechanical characteristics will be discussed.

scholarly journals In the Search of Fundamental Inner Bond Strength of Solid Elements

2014 ◽  
Vol 2014 ◽  
pp. 1-13 ◽  
Author(s):  
Maziar Sahba Yaghmaee ◽  
Reza Riahifar
Keyword(s):  
Bond Strength ◽  
Chemical Properties ◽  
Energy Scale ◽  
Cohesion Energy ◽  
Materials Properties ◽  
Scale Free ◽  
Physico Chemical ◽  
Metallic Bond ◽  
Calculation Methodology ◽  
Bond Strengths

In order to understand the physics behind the surface properties and nano-scale phenomena, we are motivated first to investigate the inner bond strengths as well as the effect of number of neighboring atoms and their relative distance in addition to space positions (crystallography). Therefore, in order to study the effect of the nature of metallic bond on their physico-chemical properties, we first tried to investigate and introduce a mathematical model for transforming the bulk molar cohesion energy into microscopic bond strengths between atoms. Then an algorithm for estimating the nature of bond type including the materials properties and lattice scale “cutoff” has been proposed. This leads to a new fundamental energy scale free from the crystallography and number of atoms. The results of our model in case of fundamental energy scale of metals not only perfectly describe the inter relation between binding and melting phenomena but also adequately reproduce the bond strength for different bond types with respect to other estimations reported in literatures. The generalized algorithm and calculation methodology introduced here by us are suggested to be used for developing energy scale of bulk crystal materials to explain or predict any particular materials properties related to bond strengths of metallic elements.

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