Rapid Thermal Process-Induced Defects : Gettering of Internal Contaminants
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AbstractWe show in this study that RTP-induced defects analysed by Deep Level Transient Spectroscopy (DLTS) are related to residual impurities present in as-grown silicon wafers. For one particular material an activation of a specific residual metallic impurity was observed in the temperature range 800 - 1000°C. This impurity can be returned to an electrically inactive precipitated form by classical thermal annealing (CTA) with a slow cooling rate or neutralized by means of low-energy hydrogen ion implantation.
2004 ◽
Vol 114-115
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pp. 307-311
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2013 ◽
Vol 740-742
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pp. 373-376
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2002 ◽
Vol 389-393
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pp. 489-492
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