Onset of Misfit Dislocation Generation in As-Grown and Annealed Sil-XGex/Si Films

1988 ◽  
Vol 130 ◽  
Author(s):  
M. P. Scott ◽  
S. S. Laderman ◽  
T. I. Kamins ◽  
S. J. Rosner ◽  
K. Nauka ◽  
...  
Keyword(s):  
Misfit Dislocation ◽  
Chemical Vapor ◽  
Misfit Dislocations ◽  
Epitaxial Silicon ◽  
Dislocation Generation ◽  
Transmission Electron ◽  
Vapor Deposition Technique ◽  
Si Films ◽  
Reaction Processing ◽  
Thermal Stability Of

AbstractX-ray topography and transmission electron microscopy were used to quantify misfit-dislocation spacings in as-grown Si1-xGex films formed by Limited Reaction Processing (LRP), which is a chemical vapor deposition technique. These analysis techniques were also used to study dislocation formation during annealing of material grown by both LRP and by molecular beam epitaxy (MBE). The thickness at which misfit dislocations first appear in as-grown material was similar for both growth techniques. The thermal stability of capped and uncapped films was also investigated after rapid thermal annealing in the range of 625 to 1000°C. Significantly fewer misfit dislocations were observed in samples containing an epitaxial silicon cap. Some differences in the number of misfit dislocation generated in CVD and MBE films were observed after annealing uncapped layers at temperatures between 625 and 825°C.

Thermal Stability of Si/Si0.85Ge0.15/Si Modulation Doped Double Heterostructures

1989 ◽  
Vol 160 ◽  
Author(s):  
P.J. Wang ◽  
B.S. Meyerson ◽  
P.M. Fahey ◽  
F. LeGoues ◽  
G.J. Scilla ◽  
...  
Keyword(s):  
Thermal Stability ◽  
High Vacuum ◽  
Chemical Vapor ◽  
Ultra High Vacuum ◽  
Misfit Dislocations ◽  
Two Dimensional ◽  
Double Heterostructures ◽  
Vapor Deposition Technique ◽  
P Type ◽  
Thermal Stability Of

AbstractThe thermal stability of Si/Si0.85Ge0.15/Si p-type modulation doped double heterostructures grown by the Ultra High Vacuum/ Chemical Vapor Deposition technique has been examined by Hall measurement, transmission electron microscopy, secondary ion mass spectroscopy, and Raman spectroscopy. As deposited heterostructures showed two-dimensional hole gas formation at the abrupt Si/SiGe and SiGe/Si interfaces. Annealing at 800 °C. for 1 hr. caused the diffusion of boron acceptors to the heterointerfaces, degrading the hole mobilities observed in the two dimensional hole gas. Rapid redistribution of boron, causing a loss of the 2 dimensional carrier behavior, was observed after a 900 °C, 0.5 hr. anneal. Neither Ge interdiffusion nor the generation of misfit dislocations were observed in the annealed heterostructures, evincing the defect-free crystal quality of these as-grown strained heteroepitaxial layers. The superior stability of these heterostructures have strong positive implications for Si:Ge heterojunction devices.

scholarly journals Comparative Study on the Quality of Microcrystalline and Epitaxial Silicon Films Produced by PECVD Using Identical SiF4 Based Process Conditions

Materials ◽  
2021 ◽  
Vol 14 (22) ◽  
pp. 6947
Author(s):  
Mario Moreno ◽  
Arturo Ponce ◽  
Arturo Galindo ◽  
Eduardo Ortega ◽  
Alfredo Morales ◽  
...  
Keyword(s):  
Thin Film ◽  
Volume Fraction ◽  
Crystalline Silicon ◽  
Chemical Vapor ◽  
Process Conditions ◽  
Epitaxial Silicon ◽  
Microcrystalline Silicon ◽  
Transmission Electron ◽  
Si Films

Hydrogenated microcrystalline silicon (µc-Si:H) and epitaxial silicon (epi-Si) films have been produced from SiF4, H2 and Ar mixtures by plasma enhanced chemical vapor deposition (PECVD) at 200 °C. Here, both films were produced using identical deposition conditions, to determine if the conditions for producing µc-Si with the largest crystalline fraction (XC), will also result in epi-Si films that encompass the best quality and largest crystalline silicon (c-Si) fraction. Both characteristics are of importance for the development of thin film transistors (TFTs), thin film solar cells and novel 3D devices since epi-Si films can be grown or etched in a selective manner. Therefore, we have distinguished that the H2/SiF4 ratio affects the XC of µc-Si, the c-Si fraction in epi-Si films, and the structure of the epi-Si/c-Si interface. Raman and UV-Vis ellipsometry were used to evaluate the crystalline volume fraction (Xc) and composition of the deposited layers, while the structure of the films were inspected by high resolution transmission electron microscopy (HRTEM). Notably, the conditions for producing µc-Si with the largest XC are different in comparison to the fabrication conditions of epi-Si films with the best quality and largest c-Si fraction.

Low Pressure MOCVD Growth and Characterization of GaAs and InP on Silicon Substrates

1988 ◽  
Vol 126 ◽  
Author(s):  
M. Razeghi ◽  
M. Defour ◽  
F. Omnes ◽  
J. Nagle ◽  
P. Maurel ◽  
...  
Keyword(s):  
Chemical Vapor ◽  
Low Pressure ◽  
Buffer Layers ◽  
Silicon Substrates ◽  
Misfit Dislocations ◽  
X Ray Diffraction ◽  
High Quality ◽  
Mocvd Growth ◽  
Vapor Deposition Technique ◽  
Low Pressure Mocvd

ABSTRACTHigh quality GaAs and InP have been grown on silicon substrates, using low pressure metalorganic chemical vapor deposition technique. The growth temperature is 550°C and the growth rate 100 A/min.Photoluminescence, X-ray diffraction and electrochemical profiling verified the high quality of these layers. The use of superlattices as buffer layers, (GaAs/GaInP) in the case of GaAs/Si and (GaInAsP/InP) in the case of InP/Si, decreased the amount of misfit dislocations in the epitaxial layer. Carrier concentrations as low as 5.1015 cm−3 have been measured by electrochemical profiling.

Microstructural Characterization of GaN Grown on SiC

2019 ◽  
Vol 25 (6) ◽  
pp. 1383-1393
Author(s):  
Sabyasachi Saha ◽  
Deepak Kumar ◽  
Chandan K. Sharma ◽  
Vikash K. Singh ◽  
Samartha Channagiri ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Raman Spectroscopy ◽  
Surface Morphology ◽  
Chemical Vapor ◽  
Microstructural Characterization ◽  
Organic Chemical ◽  
Nucleation Layer ◽  
Transmission Electron ◽  
Vapor Deposition Technique ◽  
Metal Organic

AbstractGaN films have been grown on SiC substrates with an AlN nucleation layer by using a metal organic chemical vapor deposition technique. Micro-cracking of the GaN films has been observed in some of the grown samples. In order to investigate the micro-cracking and microstructure, the samples have been studied using various characterization techniques such as optical microscopy, atomic force microscopy, Raman spectroscopy, scanning electron microscopy and transmission electron microscopy (TEM). The surface morphology of the AlN nucleation layer is related to the stress evolution in subsequent overgrown GaN epilayers. It is determined via TEM evidence that, if the AlN nucleation layer has a rough surface morphology, this leads to tensile stresses in the GaN films, which finally results in cracking. Raman spectroscopy results also suggest this, by showing the existence of considerable tensile residual stress in the AlN nucleation layer. Based on these various observations and results, conclusions or propositions relating to the microstructure are presented.

Rapid Thermal Processing of Buried Sil−xGex Strained Layers; Photoluminescence Decay and Misfit Dislocation Generation.

1990 ◽  
Vol 198 ◽  
Author(s):  
D.C. Houghton ◽  
N.L. Rowell
Keyword(s):  
Quantum Wells ◽  
Misfit Dislocation ◽  
Thermal Processing ◽  
Internal Quantum Efficiency ◽  
Dislocation Nucleation ◽  
Multiple Quantum ◽  
Misfit Dislocations ◽  
Dislocation Generation ◽  
Strained Layers ◽  
Wide Range

ABSTRACTThe thermal constraints for device processing imposed by strain relaxation have been determined for a wide range of Si-Ge strained heterostructures. Misfit dislocation densities and glide velocities in uncapped Sil-xGex alloy layers, Sil-xGex single and multiple quantum wells have been measured using defect etching and TEM for a range of anneal temperatures (450°C-1000°C) and anneal times (5s-2000s). The decay of an intense photoluminescence peak (∼ 10% internal quantum efficiency ) from buried Si1-xGex strained layers has been correlated with the generation of misfit dislocations in adjacent Sil-xGex /Si interfaces. The misfit dislocation nucleation rate and glide velocity for all geometries and alloy compositions (0<x<0.25) were found to be thermally activated processes with activation energies of (2.5±0.2)eV and (2.3-0.65x)eV, respectively. The time-temperature regime available for thermal processing is mapped out as a function of dislocation density using a new kinetic model.

Microstructural and Electrical Characterization of Misfit Dislocations at the InAs/GaP Heterointerface

1997 ◽  
Vol 500 ◽  
Author(s):  
V. Gopal ◽  
T. P. Chin ◽  
A. L. Vasiliev ◽  
J. M. Woodall ◽  
E. P. Kvam
Keyword(s):  
Misfit Dislocation ◽  
Lattice Mismatch ◽  
Electrical Characterization ◽  
Growth Conditions ◽  
Misfit Dislocations ◽  
Ir Detectors ◽  
Mbe Growth ◽  
Transmission Electron ◽  
Hall Effect Measurements ◽  
Edge Dislocations

ABSTRACTInAs is a narrow band gap semiconductor with potential for such applications as IR detectors, low temperature transistors, etc‥ However, the lack of suitable substrates has hampered progress in the development of InAs based devices. In the present study, InAs was grown by Molecular Beam Epitaxy on (001) GaP substrates. Though this system has a high lattice mismatch, (∼11%), certain MBE growth conditions result in 80% relaxed InAs layers on GaP with the mismatch accommodated predominantly by 90° pure edge dislocations. Misfit dislocation microstructures were studied using Transmission Electron Microscopy. Electrical characterization using lateral conductance and Hall effect measurements were also performed. Preliminary results indicate the possibility of misfit dislocation related conductivity. The possible correlation between interface structure and electrical properties is discussed.

Curvature Evaluation of Si/3C-SiC/Si Hetero-Structure Grown by Chemical Vapor Deposition

2014 ◽  
Vol 778-780 ◽  
pp. 255-258
Author(s):  
Ruggero Anzalone ◽  
Massimo Camarda ◽  
Andrea Severino ◽  
Nicolo’ Piluso ◽  
Francesco La Via
Keyword(s):  
Sacrificial Layer ◽  
Chemical Vapor ◽  
Drift Region ◽  
Free Standing ◽  
Hetero Structure ◽  
Wafer Curvature ◽  
Transmission Electron ◽  
Standing Structure ◽  
Optical Profilometer ◽  
Si Films

In this work we analyzed the variation of wafer curvature due to the growth of thin Si layers on top of 3C-SiC/Si films. The final Si/3C-SiC/Si hetero-structure, allows not only to have a deeper understanding of the stress within the different layers, but can also be used for MEMS applications, using the Si film as sacrificial layer in order to obtain 3C-SiC free-standing structure, or for electronic application, e.g. using the thin Si layer as high quality MOSFET channel and the SiC layer as the drift region. In details, the influence on wafer curvature by the growth of thin Si layer on top on the 3C-SiC/Si film as been studied by optical profilometer. A theoretical model was also applied in order to fit the measured curvature of the hetero-structure and optimize the system. Finally, in order to study the morphology of the hetero-structure micro-Raman spectroscopy and Transmission Electron Microscopy (TEM) measurements has been performed.

Direct Observations of Relaxation of Si/SiGe/Si on Insulator

2010 ◽  
Vol 1262 ◽  
Author(s):  
Tongda Ma ◽  
Hailing Tu
Keyword(s):  
Misfit Dislocation ◽  
Room Temperature ◽  
Sige Layer ◽  
Misfit Strain ◽  
Misfit Dislocations ◽  
Cross Sectional ◽  
Direct Observations ◽  
Transmission Electron ◽  
Dislocation Behavior ◽  
Film Specimen

AbstractMicrostructural evolution is directly observed when the cross-sectional film specimen of Si/SiGe/Si on insulator (Si/SiGe/SOI) is heated from room temperature (R.T., 291 K) up to 1113 K in high voltage transmission electron microscope (HVEM). The misfit dislocation at the lower interface of the SiGe layer begins to extend downwards even at 913 K. The lower interface takes the lead in roughening against the upper interface of the SiGe layer. The roughened interface is ascribed to elastic relaxation. As misfit strain is partially transferred to SOI top Si layer and misfit dislocation is prolonged at the lower interface, the roughened interface turns smooth again. Thereafter, the misfit dislocations are introduced into the upper roughened interface of the SiGe layer to release the increased misfit strain. It is suggested that the microscopic relaxation of the SiGe layer is related to dislocation behavior and strain transfer.

Hot-Wire Chemical Vapor Deposition for Epitaxial Silicon Growth On Large-Grained Polycrystalline Silicon Templates

2003 ◽  
Vol 762 ◽  
Author(s):  
M. S. Mason ◽  
C.M. Chen ◽  
H.A. Atwater
Keyword(s):  
Epitaxial Growth ◽  
Polycrystalline Silicon ◽  
Solid Phase ◽  
Chemical Vapor ◽  
Growth Conditions ◽  
Solid Phase Epitaxy ◽  
Epitaxial Silicon ◽  
Hot Wire ◽  
Transmission Electron ◽  
Silicon Growth

AbstractWe investigate low-temperature epitaxial growth of thin silicon films on Si [100] substrates and polycrystalline template layers formed by selective nucleation and solid phase epitaxy (SNSPE). We have grown 300 nm thick epitaxial layers at 300°C on silicon [100] substrates using a high H2:SiH4 ratio of 70:1. Transmission electron microscopy confirms that the films are epitaxial with a periodic array of stacking faults and are highly twinned after approximately 240 nm of growth. Evidence is also presented for epitaxial growth on polycrystalline SNSPE templates under the same growth conditions.

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