Laser Induced Chemical Etching of Composite Structure of Ferrite and Sendust

1988 ◽  
Vol 129 ◽  
Author(s):  
S. Nagatomo ◽  
M. Takai ◽  
Y. F. Lu ◽  
S. Namba

ABSTRACTMaskless etching of the composite structure of Mn-Zn ferrite and sendust (Fe-Si-Al alloy) was performed by focused argon-ion-laser irradiation in a CCl4 atmosphere and aqueous solutions. Only a mixture of KOH and NaOH aqueous solutions was found to smoothly etch the composite structure by thermochemical reaction using laser irradiation. A maximum etching rate of 14 μm/sec was obtained for sendust-on-ferrite substrates.

1979 ◽  
Vol 35 (2) ◽  
pp. 121-124 ◽  
Author(s):  
J. F. McClelland ◽  
R. N. Kniseley

1999 ◽  
Vol 06 (02) ◽  
pp. 219-223
Author(s):  
S. K. BHADRA ◽  
T. BANDYOPADHYAY ◽  
A. K. MAITI ◽  
K. GOSWAMI

Thin films of chalcogenides are synthesized by CW argon ion laser irradiation of separate Ge/Se and Se/Te film sandwiches according to near stoichiometric proportions. The compound formation and crystalline transition of amorphous Se film are characterized by observing photomicrographs and optical absorption spectra. The composite film of bilayer Ge/Se does not form compounds but deposits as separate elements under equivalent laser fluence.


1993 ◽  
Vol 73 (12) ◽  
pp. 8088-8096 ◽  
Author(s):  
Xianfan Xu ◽  
Scott L. Taylor ◽  
Hee K. Park ◽  
Costas P. Grigoropoulos

1989 ◽  
Vol 17 (9) ◽  
pp. 642-651 ◽  
Author(s):  
Kaoru SUZUKI ◽  
Shigeyuki MASUTANI ◽  
Tetsuya TANIYAMA ◽  
Junji NAKATA ◽  
Takaya MASUTANI

1988 ◽  
Vol 47 (4) ◽  
pp. 319-325 ◽  
Author(s):  
Yong Feng Lu ◽  
M. Takai ◽  
S. Nagatomo ◽  
S. Namba

Author(s):  
Dianzhong Wen

This paper a System of argon-ion laser enhanced anisotropic etching is designed. A basic description of the structure and principle of the system will first be presented. This system can be described as enhanced etching rate of silicon. It also has the important advantage of not requiring the silicon is covered with a thick of oxide or other masked for any plane of silicon crystal that adds considerable complexity to the manufacture. When experiment temperature is 90 °C and KOH density is 34mol, an averaged instantaneous etching rate as high 25μm/min has been observed in silicon for a 4.6W input laser power, this etching rate register a 500% increase model on conventional anisotropic etching of silicon. Discussing the anisotropic etching rate of silicon dependence on the laser power and on the temperature are further. The experiment results show that the system structure design is reasonable and it can meet the requirement of every planes of silicon crystal etching, it can be used widely in variety of application aspects.


1980 ◽  
Vol 1 ◽  
Author(s):  
D.H. Lee ◽  
G.L. Olson ◽  
L.D. Hess

ABSTRACTIndium antimonide can be recrystallized epitaxially in the liquid phase by a scanning cw argon ion laser beam for improvements in crystal quality, surface morphology and oxide interface properties. Selected area diffraction measurements, Auger sputter depth profiling and dispersive x-ray analysis indicate that crystallization occurs epitaxially, and stoichiometry is preserved in the laser processed regions. Complete elimination of all asperities present in the original polished surface was observed subsequent to laser irradiation. Scanning electron microscopy and mechanical stylus measurements of the lateral profile of the laser irradiated region revealed the presence of a slight surface contour (convex meniscus) with a maximum change in height of 700 Å across a 64 μm recrystallized strip. In contrast to previous work with other compound semiconductors (e.g., GaAs), these results with InSb indicate that cw laser-induced melting and subsequent liquid phase epitaxial recrystallization can be used to provide improved materials properties of particular compound semiconductors.


1972 ◽  
Vol 50 (20) ◽  
pp. 3381-3383 ◽  
Author(s):  
Noel A. P. Kane-Maguire ◽  
Cooper H. Langford

Partial photoresolution of [Formula: see text], Cr(C2O4)2phen−, and [Formula: see text] by irradiation with circularly polarized light from an argon ion laser and 496.5 or 514.5 nm is reported. Steady states corresponding to 1–2% resolution are achieved. They are in agreement with predictions from known circular dichroism and the assumption that differential isomerization is simply a consequence of differential absorptivity of the enantiomers.


1987 ◽  
Vol 101 ◽  
Author(s):  
M. Datta ◽  
L. T. Romankiw ◽  
D. R. Vigliotti ◽  
R. J. von Gutfeld

ABSTRACTWe report the first results of experiments using a focused argon ion laser to locally induce chemical etching of steel and stainless steel in neutral salt solutions for maskless patterning. The solutions include sodium chloride, sodium nitrate and potassium sulfate. Vertical etch rates up to 4 microns/s are observed.


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