Monolithic GaAs/Si Integration

1988 ◽  
Vol 126 ◽  
Author(s):  
George W. Turner ◽  
H. K. Choi ◽  
J. P. Mattia ◽  
C. L. Chen ◽  
S. J. Eglash ◽  
...  

ABSTRACTThe recent demonstrations of room-temperature cw operation of diode lasers fabricated in GaAs/AlGaAs layers grown on Si wafers have encouraged efforts to develop monolithic GaAs/Si integration technology for applications such as optical interconnects between VLSI subsystems. This paper summarizes our current work in this area, which is focused on the development of a highspeed, MSI-scale monolithic GaAs/Si test chip that integrates Si MOSFET circuits with diode lasers, LEDs, photoconductive detectors, and MESFET logic circuits fabricated in GaAs/AlGaAs layers grown by molecular beam epitaxy. Growth issues and processing considerations that affect device and circuit performance are addressed, and the characteristics of LEDs monolithically integrated with Si driver circuits and of GaAs microwave MESFETs fabricated on high-resistivity Si substrates are reported.

1988 ◽  
Vol 116 ◽  
Author(s):  
George W. Turner ◽  
H. K. Choi ◽  
J. P. Mattia ◽  
C. L. Chen ◽  
S. J. Eglash ◽  
...  

AbstractThe recent demonstrations of room-temperature cw operation of diode lasers fabricated in GaAs/AlGaAs layers grown on Si wafers have encouraged efforts to develop monolithic GaAs/Si integration technology for applications such as optical interconnects between VLSI subsystems. This paper summarizes our current work in this area, which is focused on the development of a highspeed, MSI-scale monolithic GaAs/Si test chip that integrates Si MOSFET circuits with diode lasers, LEDs, photoconductive detectors, and MESFET logic circuits fabricated in GaAs/AlGaAs layers grown by molecular beam epitaxy. Growth issues and processing considerations that affect device and circuit performance are addressed, and the characteristics of LEDs monolithically integrated with Si driver circuits and of GaAs microwave MESFETs fabricated on high-resistivity Si substrates are reported.


1986 ◽  
Vol 22 (17) ◽  
pp. 919 ◽  
Author(s):  
R.K. Defreez ◽  
J. Puretz ◽  
R.A. Elliott ◽  
J. Orloff ◽  
L.W. Swanson

1977 ◽  
Vol 24 (9) ◽  
pp. 1214-1214 ◽  
Author(s):  
J.N. Walpole ◽  
S.H. Groves ◽  
T.C. Harman
Keyword(s):  

1977 ◽  
Vol 16 (7) ◽  
pp. 1273-1274 ◽  
Author(s):  
Kunishige Oe ◽  
Seigo Ando ◽  
Koichi Sugiyama

2009 ◽  
Vol 15 (3) ◽  
pp. 716-723 ◽  
Author(s):  
J. Tatebayashi ◽  
A. Jallipalli ◽  
M.N. Kutty ◽  
Shenghong Huang ◽  
K. Nunna ◽  
...  

1993 ◽  
Vol 5 (10) ◽  
pp. 1146-1149 ◽  
Author(s):  
J.P. Donnelly ◽  
W.D. Goodhue ◽  
C.A. Wang ◽  
R.J. Bailey ◽  
G.A. Lincoln ◽  
...  
Keyword(s):  

1995 ◽  
Vol 39 ◽  
pp. 155-164
Author(s):  
Naoki Yamamoto

A fluorescent and diffracted X-ray spectrometer with an X-ray sub-micron beam was developed for the analysis of stress, crystal structure, and contamination in micro-regions of ULSIs. A fine glass capillary with a parabolic cross-sectional inner wall surface was made to form a micro X-ray beam. A micro-focus X-ray generator with a membrane-type target was also developed for use with the capillary. The equipment was used to analyze the crystal phases of Ti silicide fine lines and the strains in Al interconnections.The resistance of Ti-silicide lines increases the line width narrows under about 0.5 μrn. This is because of the growth of crystal phases of TiSi2(C49) and TiSi(B27) with high resistivity ﹛60 to 100 μΩ-cm).Hillocks of Al grow at line edges when Al layers are compressed by Si substrates and surrounding insulating layers. On the other hand, when the Al is extended by these layers, voids form in the AI lines.


Micromachines ◽  
2020 ◽  
Vol 11 (9) ◽  
pp. 818
Author(s):  
Milena Rašljić Rafajilović ◽  
Katarina Radulović ◽  
Milče M. Smiljanić ◽  
Žarko Lazić ◽  
Zoran Jakšić ◽  
...  

We present the design, simulation, fabrication and characterization of monolithically integrated high resistivity p-type boron-diffused silicon two-zone heaters in a model high temperature microreactor intended for nanoparticle fabrication. We used a finite element method for simulations of the heaters’ operation and performance. Our experimental model reactor structure consisted of a silicon wafer anodically bonded to a Pyrex glass wafer with an isotropically etched serpentine microchannels network. We fabricated two separate spiral heaters with different temperatures, mutually thermally isolated by barrier apertures etched throughout the silicon wafer. The heaters were characterized by electric measurements and by infrared thermal vision. The obtained results show that our proposed procedure for the heater fabrication is robust, stable and controllable, with a decreased sensitivity to random variations of fabrication process parameters. Compared to metallic or polysilicon heaters typically integrated into microreactors, our approach offers improved control over heater characteristics through adjustment of the Boron doping level and profile. Our microreactor is intended to produce titanium dioxide nanoparticles, but it could be also used to fabricate nanoparticles in different materials as well, with various parameters and geometries. Our method can be generally applied to other high-temperature microsystems.


2005 ◽  
Vol 44 (5) ◽  
pp. 436-439 ◽  
Author(s):  
Taeksoo Ji ◽  
Hargsoon Yoon ◽  
Jose K. Abraham ◽  
Vijay K. Varadan

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