Recent Advances in Thin Film Multilayer Interconnect Technology for IC Packaging

1987 ◽  
Vol 108 ◽  
Author(s):  
Ronald J. Jensen
Keyword(s):  
Thin Film ◽  
Recent Work ◽  
High Performance ◽  
High Density ◽  
High Conductivity ◽  
Packaging Technology ◽  
Ic Packaging ◽  
The Stability ◽  
Work Done ◽  
Interconnect Technology

ABSTRACTA high-performance packaging technology being developed at Honeywell and a number of other companies uses thin-film processes to pattern high-density interconnections in multiple layers of a high-conductivity conductor (e.g., copper) and a polymer dielectric, primarily polyimide. This paper describes the physical characteristics and unique advantages of this thin film multilayer (TFML) interconnect technology; it then summarizes the results of recent work done at Honeywell in processing TFML structures, assessing the stability and reliability of the materials system, and fabricating test vehicles and demonstration packages.

Z-Interconnect Technology - A Reliable, Cost Efficient Solution for High Density, High Performance Electronic Packaging

2014 ◽  
Vol 2014 (1) ◽  
pp. 000141-000147 ◽  
Author(s):  
John M. Lauffer ◽  
Kevin Knadle
Keyword(s):  
Electronic Packaging ◽  
High Performance ◽  
Performance Enhancement ◽  
High Density ◽  
Consumer Electronics ◽  
Electrical Performance ◽  
Printed Wiring Board ◽  
Electrically Conductive Adhesive ◽  
Plated Through Hole ◽  
Interconnect Technology

Common themes across all segments of electronic packaging today are density and performance. High density interconnect (HDI) technology is one of the most commonly utilized methods for electronic package density improvement, while many different areas have been investigated for performance improvement, from low loss dielectric and conductor materials, to via design and via stub reduction. Electrical performance and density requirements are sometimes complementary, but often times, conflicting with one another. This paper will describe the design, materials, fabrication, and reliability of a new Z-Interconnect technology that addresses both high density and high performance demands simultaneously. Z-Interconnect technology uses an electrically conductive adhesive to electrically interconnect several cores (Full Z) or sub-composites (Sub Z) in a single lamination process. Z-Interconnect technology will be compared and contrasted to other commonly used solutions to the performance and density challenges. HDI or sequential build-up technology is a pervasive solution to the density demands in semiconductor packaging and consumer electronics (e.g. Smart phones), but has not caught hold in HPC or A&D printed wiring board (PWB) applications. One solution for PWB electrical performance enhancement is plated through hole (PTH) stub reduction by “back drilling” the unwanted portion of the PTH. Pb-free reflow and Current Induced Thermal Cycling (CITC) test results of product coupons and specially designed test vehicles, having component pitches down to 0.4mm, will be presented. Z-Interconnect test vehicles have survived 6X Pb-free (260C) reflow cycles, followed by greater than 3000 cycles of 23C–150C CITC cycles. Test vehicle and product coupons also easily survive 10 or more 23C–260C CITC cycles.

Advanced Packaging Solution for High Density FCCSP Molding Warpage

2019 ◽  
Author(s):  
Shuai-Lin Liu ◽  
Ward Ye ◽  
Yu-Po Wang ◽  
Long-Yuan Wang ◽  
Fred Lin
Keyword(s):  
High Performance ◽  
Consumer Products ◽  
High Density ◽  
Influential Factor ◽  
Molding Process ◽  
Vacuum Suction ◽  
Packaging Technology ◽  
Advanced Packaging ◽  
High Bandwidth ◽  
Warpage Deformation

Abstract In recent years, the IC industry continues to drive demand in the consumer market, and more global sales of smart-phones, smart-watches and tablets have continued to grow. In order to continuously enhance high performance computing, the consumer products pursued began to integrate HBM (High Bandwidth Memory) and AI (Artificial Intelligence) to strong and powerful mainstream market. With the shrinking use space pursued by consumer products, it is necessary to continuously develop lighter and thinner products, and under such product conditions, it seems that the risks and difficulties of advanced packaging technology will be expected. Due to the ministration application, the warpage issue is the most influential factor in the following development of packaging technology. In this paper, we would like to overcome the poor strip warpage, not only to choose the EMC material form CTE property, but to think about improving the warpage from the machine process. The residual stress generated by the molding process of thermosetting resins exerts serious influences upon the mechanical properties, so we use Laser area beam processing to reheat the EMC and use the vacuum suction to reshape the warpage deformation. In this case, we verify the laser radiation time and peak temperature control of different strip types (including molded, thermal taped and ball attached molded strip) and EMC wafer form. We succeed to improve the maximum strip warpage from 17 um to 1um; wafer form from 13um to 3.5um. This laser beam reshape technology is proven to solve the warpage significantly for high density assembly.

An Overview of Multichip Module Technology for low Power Applications

1992 ◽  
Vol 264 ◽  
Author(s):  
Chung W. Ho ◽  
Sharon McAfee-Hunter
Keyword(s):  
Thin Film ◽  
Low Power ◽  
Manufacturing Process ◽  
High Performance ◽  
Low Cost ◽  
High Density ◽  
Point Of View ◽  
Multichip Module ◽  
Multichip Modules

AbstractThin-film multichip modules (i.e. MCM-D) can provide simple, low-cost packaging and interconnect options for interconnecting high-density, high-performance devices. The following is an overview of an MCM-D technology that can be implemented on top of several substrate materials. Tradeoffs will be discussed related to using different substrate materials and the corresponding implications from the assembly point of view. The MCM-D manufacturing process is reviewed and the subsequent reliability results are discussed.

Development of high-performance magnetic thin film for high-density magnetic recording

2005 ◽  
Vol 50 (23) ◽  
pp. 4576-4585 ◽  
Author(s):  
Tetsuya Osaka ◽  
Toru Asahi ◽  
Jun Kawaji ◽  
Tokihiko Yokoshima
Keyword(s):  
Thin Film ◽  
Magnetic Recording ◽  
High Performance ◽  
High Density ◽  
Magnetic Thin Film ◽  
High Density Magnetic Recording

Spheron Fan-In WLCSP Technology Qualification and Scale Up - 200 mm to 300 mm

2013 ◽  
Vol 2013 (DPC) ◽  
pp. 000471-000494
Author(s):  
Andre Cardoso ◽  
Rui Almeida ◽  
Felandorio Fernandes ◽  
Ted Tessier ◽  
Anthony Curtis
Keyword(s):  
Crucial Role ◽  
High Performance ◽  
Scale Up ◽  
High Density ◽  
Technology Licensing ◽  
Ic Packaging ◽  
Wafer Processing ◽  
Unit Reduction

Overview: Fan-In WLP plays crucial role on today's high density, high performance IC Packaging. 300 mm wafer processing addresses cost-per-unit reduction and volume demand. Results of Spheron Fan-In WLCSP Technology Qualification and 200 mm to 300 mm Scale Up at Nanium, using FlipChipInternational Technology Licensing

Materials for Future High Performance Magnetic Recording Heads

MRS Bulletin ◽  
1990 ◽  
Vol 15 (3) ◽  
pp. 36-44 ◽  
Author(s):  
Tomasz Jagielinski
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
High Frequency ◽  
High Performance ◽  
Ion Beam ◽  
Chemical Vapor ◽  
High Density ◽  
High Coercivity ◽  
Track Width ◽  
The Future

Recording in the 1990s will be high density, high frequency, in-contact recording on high coercivity media. Today's state-of-the-art head materials, NiFe, Sendust and amorphous alloys, will be used in some applications. However, layered structured and artificial superlattices will become the key head technologies of the future. Use of advanced preparation techniques will allow “true” materials engineering and the fabrication of devices to incredibly accurate specifications.These very high density recording systems will require optimal inter-play between all the components—media, head, and head/media interface. Future media will be very smooth, high coercivity, large moment thin films. The head/media spacing will be less than 50 nm, and recording at more than 100 MHz will be required. Single-track heads will be replaced by very narrow track-width multitrack devices in high data rate recorders. Thin film heads will provide the answer to most of the problems of large recording fields and high frequency response. These changes will define new requirements for head materials, some of which cannot be met by currently used materials. Conventional ferrite heads will not be found in high performance recording systems; thin film inductive and magnetoresistive (MR) heads (Figure 1) will be widely used. Thin films, metals and alloys, both crystalline and amorphous, layered structures and artificial superlattices will be the key head technologies in the future. New material preparation technologies, MBE (molecular beam epitaxy), MOCVD (molecular chemical vapor deposition), sputtering, and ion beam deposition are becoming increasingly available and less expensive. These methods will be used to fabricate future devices to incredibly accurate specifications.

High-resolution scanning electron microscopy of thin-film magnetic media of magnetic recording disk

1992 ◽  
Vol 50 (2) ◽  
pp. 1334-1335
Author(s):  
K. Ogura ◽  
H. Nishioka ◽  
N. Ikeo ◽  
T. Kanazawa ◽  
J. Teshima
Keyword(s):  
Thin Film ◽  
Fine Structure ◽  
High Resolution ◽  
Magnetic Recording ◽  
High Performance ◽  
Magnetic Hysteresis ◽  
Grain Structure ◽  
Magnetic Media ◽  
Cross Sectional ◽  
Resolution Observation

Structural appraisal of thin film magnetic media is very important because their magnetic characters such as magnetic hysteresis and recording behaviors are drastically altered by the grain structure of the film. However, in general, the surface of thin film magnetic media of magnetic recording disk which is process completed is protected by several-nm thick sputtered carbon. Therefore, high-resolution observation of a cross-sectional plane of a disk is strongly required to see the fine structure of the thin film magnetic media. Additionally, observation of the top protection film is also very important in this field.Recently, several different process-completed magnetic disks were examined with a UHR-SEM, the JEOL JSM 890, which consisted of a field emission gun and a high-performance immerse lens. The disks were cut into approximately 10-mm squares, the bottom of these pieces were carved into more than half of the total thickness of the disks, and they were bent. There were many cracks on the bent disks. When these disks were observed with the UHR-SEM, it was very difficult to observe the fine structure of thin film magnetic media which appeared on the cracks, because of a very heavy contamination on the observing area.

The Structure and Properties of MoSi2 Thin Film in Mos Process

1980 ◽  
Vol 38 ◽  
pp. 326-327
Author(s):  
C.K. Wu ◽  
P. Chang ◽  
N. Godinho
Keyword(s):  
Thin Film ◽  
Integrated Circuits ◽  
High Performance ◽  
Large Scale ◽  
Process Development ◽  
Structure And Properties ◽  
Metal Silicides ◽  
High Oxidation ◽  
Important Approach ◽  
High Oxidation Resistance

Recently, the use of refractory metal silicides as low resistivity, high temperature and high oxidation resistance gate materials in large scale integrated circuits (LSI) has become an important approach in advanced MOS process development (1). This research is a systematic study on the structure and properties of molybdenum silicide thin film and its applicability to high performance LSI fabrication.

Dietary Vitamin and Stability of Oral Anticoagulation: Proposal of a Diet with Constant Vitamin K1 Content

1997 ◽  
Vol 77 (03) ◽  
pp. 504-509 ◽  
Author(s):  
Sarah L Booth ◽  
Jacqueline M Charnley ◽  
James A Sadowski ◽  
Edward Saltzman ◽  
Edwin G Bovill ◽  
...  
Keyword(s):  
Dietary Intake ◽  
Vitamin K ◽  
High Performance ◽  
Case Reports ◽  
Food Composition ◽  
Dietary Guidelines ◽  
Dietary Vitamin ◽  
Vitamin K1 ◽  
The Stability ◽  
The Impact

SummaryCase reports cited in Medline or Biological Abstracts (1966-1996) were reviewed to evaluate the impact of vitamin K1 dietary intake on the stability of anticoagulant control in patients using coumarin derivatives. Reported nutrient-drug interactions cannot always be explained by the vitamin K1 content of the food items. However, metabolic data indicate that a consistent dietary intake of vitamin K is important to attain a daily equilibrium in vitamin K status. We report a diet that provides a stable intake of vitamin K1, equivalent to the current U.S. Recommended Dietary Allowance, using food composition data derived from high-performance liquid chromatography. Inconsistencies in the published literature indicate that prospective clinical studies should be undertaken to clarify the putative dietary vitamin K1-coumarin interaction. The dietary guidelines reported here may be used in such studies.

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